Long Lines Patents (Class 333/236)
  • Patent number: 8237519
    Abstract: Filter design techniques and filters based on metamaterial structures including an extended composite left and right handed (E-CRLH) metamaterial unit cell.
    Type: Grant
    Filed: November 17, 2008
    Date of Patent: August 7, 2012
    Assignee: Rayspan Corporation
    Inventor: Maha Achour
  • Publication number: 20120039050
    Abstract: There are provided an electronic device having a transmission line pattern embedded in a case and a method for manufacturing the same. The electronic device includes a line pattern body embedded in a case and including a line pattern for electrically connecting components to each other, terminal portions respectively disposed at portions of the line pattern corresponding to terminals of the components to be electrically connected, and exposed from the bottom of the case, and connection members connecting the terminals of the components with the terminal portions.
    Type: Application
    Filed: April 26, 2011
    Publication date: February 16, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Won CHANG, Jae Suk SUNG, Dae Kyu LEE, Hyun Do PARK, Chang Mok HAN, Hyun Sam MUN, Dae Ki LIM, Sang Woo BAE, Dae Seong JEON, Ha Ryong HONG
  • Publication number: 20120002383
    Abstract: A differential path replacement component includes: a first signal line that comprises one end and the other end; and a second signal line that comprises one end adjacent to one end of the first signal line and the other end adjacent to the other end of the first signal line, that transmits a signal having a phase opposite to a phase of a signal transmitted through the first signal line, and that is paired with the first signal line. The first and second signal lines are twisted together such that an arranged sequence of one end of the first signal line and one end of the second signal line is reversed to an arranged sequence of the other end of the first signal line and the other end of the second signal line.
    Type: Application
    Filed: September 14, 2011
    Publication date: January 5, 2012
    Applicant: Fujitsu Limited
    Inventors: Kouichiro Asou, Toshihiro Miyamoto
  • Publication number: 20110298561
    Abstract: A transmission line and method for implementing includes a plurality of segments forming an electrical path and a continuous optical path passing through the segments. Discrete inductors are formed between and connect adjacent segments. The inductors are formed in a plurality of metal layers of an integrated circuit to balance capacitance of an optical modulator which includes the transmission line to achieve a characteristic impedance for the transmission line.
    Type: Application
    Filed: June 8, 2010
    Publication date: December 8, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: WILLIAM M. GREEN, Alexander V. Rylyakov, Clint L. Schow, Yurii A. Vlasov
  • Publication number: 20110266888
    Abstract: A bipolar pulse generator includes two, two-conductor transmission lines coupled together with a load positioned between the two transmission lines. Each conductor of a transmission line we define as a segment. Two segments of one transmission line are charged and switchably coupled to two segments of the other transmission line to produce a bipolar pulse on the matched load. This bipolar pulse generator may be implemented in a flat or a folded design. The generator may include two transmission line structures coupled together with a load positioned between each transmission line structures. The first transmission line structure may include a stepped transmission line and an embedded transmission line segment. A switch may be coupled between the embedded transmission line segment and another segment of the transmission line structure.
    Type: Application
    Filed: July 12, 2011
    Publication date: November 3, 2011
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Simon Y. London
  • Publication number: 20110260812
    Abstract: An antenna transmission line for feeding multiple items includes a first conductor member, a second conductor member, and a dielectric material positioned between the first and second conductor members, which prevents water from accumulating between the first and second conductive members. Means are provided to connect multiple elements to the transmission line at connection terminals. An insulator may be provided adjacent to each of the connection terminals, the insulator being generally non-conductive. A plurality of holes provided in the insulator on either side of the conductor members allows the elements to be weaved therethrough to provide a more stable connection.
    Type: Application
    Filed: March 30, 2011
    Publication date: October 27, 2011
    Inventors: Paul D. Sergi, Charles T. Rauch
  • Publication number: 20110260813
    Abstract: The invention relates to a method and a device for pseudo-differential transmission through interconnections used for sending a plurality of electrical signals. An interconnection having 4 transmission conductors and a return conductor distinct from the reference conductor cannot be modeled as a uniform multiconductor transmission line. Each end of the interconnection is connected to a termination circuit. Three damping circuits are connected between the return conductor and the reference conductor. The transmitting circuits receive at their inputs the signals from the 4 channels of the two sources, and are connected to the interconnection. The receiving circuits are connected to the interconnection, each receiving circuit being such that the signals of the 4 channels of a source connected to a transmitting circuit in the activated state are sent to the four channels of the destinations, without noticeable echo, internal crosstalk and external crosstalk.
    Type: Application
    Filed: July 1, 2011
    Publication date: October 27, 2011
    Applicant: EXCEM
    Inventors: Frédéric BROYDE, Evelyne CLAVELIER
  • Publication number: 20110254746
    Abstract: A transmission line for a vehicle includes: a steel plate for forming a body of a vehicle; a dielectric formed on the steel plate; and a conductive line formed on the dielectric. An antenna for a vehicle includes: a steel plate for forming a body of a vehicle; a dielectric formed on the steel plate; and a conductive line formed on the dielectric in such a manner as to include a radiating structure.
    Type: Application
    Filed: October 25, 2010
    Publication date: October 20, 2011
    Applicant: POSTECH Academy-Industry Foundation
    Inventors: Wee Sang Park, Dae Woong Woo, Jae Hee Kim
  • Publication number: 20110221547
    Abstract: Provided is an electromagnetic wave transmission sheet having a mesh-shaped electrode. The sheet has a length of width in a direction vertical to the propagation direction of the transmitted electromagnetic wave which length is substantially identical to half of the wavelength of the transmitted electromagnetic wave multiplied by a natural number so that a resonance state is obtained in the vertical direction. It is preferable that the sheet have an electromagnetic wave absorbing medium for reducing reflection of the transmitted electromagnetic wave in the propagation direction, so as to eliminate the need of an electromagnetic wave absorbing medium for reducing reflection in the direction vertical to the propagation direction of the transmitted electromagnetic wave.
    Type: Application
    Filed: September 15, 2009
    Publication date: September 15, 2011
    Inventors: Ken-Ichi Tezuka, Naoya Asamura, Hiroto Itai
  • Patent number: 8008985
    Abstract: A high-frequency electric field coupler is provided for use in a contactless communication system propagating high frequency signals in a wide band utilizing electric field coupling. The coupler includes a coupling electrode and a resonance unit operating to increase the amplitude of an electrical charge accumulated at the coupling electrode at a predetermined resonance frequency. The coupling electrode is a linear conductor in the form of a coil.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: August 30, 2011
    Assignee: Sony Corporation
    Inventor: Takanori Washiro
  • Patent number: 7994873
    Abstract: A balun device including a first to a third inductance elements and a first to a third capacitance elements is provided. The first inductance element has a first end for receiving an input signal and a second end. The second inductance element has a third end and a fourth end, wherein the third and the forth ends are for outputting a first and a second output signals corresponding to the input signal, respectively. The first output signal and the second output signal substantially have the same amplitude and opposite phases. The first and the second inductance elements generate mutual inductance. The first capacitance element is coupled to the first end. The second capacitance element is coupled to the third end. The third capacitance element is coupled to the fourth end. The third inductance element is seriesly connected to one of the first to the third capacitance elements.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: August 9, 2011
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Ying-Chieh Shyu
  • Publication number: 20110148541
    Abstract: A transmission medium includes: first and second lines #1 and #2, which are separated from each other and arranged substantially in parallel with each other; a third line #3, which is alternately entangled and wound around the first and second lines from one direction thereof so as to form a plurality of entangling portions Po to Pn in a longitudinal direction of the first and second lines, respectively; and a fourth line #4, which forms a plurality of entangling portions Po to Pn where the fourth line is alternately entangled and wound around the first and second lines from one direction thereof and a plurality of intersecting portions C1 to Cn where the fourth line intersects the third line internally of the first and second lines in the longitudinal direction of the first and second lines, respectively, wherein, the respective entangling portions of the third and fourth lines are alternately disposed in the longitudinal direction of the first and second lines, respectively, the winding direction of one of
    Type: Application
    Filed: September 11, 2008
    Publication date: June 23, 2011
    Inventor: Toru Sugama
  • Publication number: 20110133597
    Abstract: A method of producing an electromechanical device includes forming a layer of density-changing material on a substructure, and forming a support layer on at least a portion of the layer of density-changing material. The density-changing material has a first density during the forming the layer and a second density subsequent to the forming the support layer, the second density being greater than the first density such that the layer of density-changing material shrinks in at least one dimension to provide a gap between the layer of density changing material and at least one of the support layer and the substructure. A combined electronic and electromechanical device has a substrate, an electronic circuit formed on the substrate, and an electromechanical system formed on the substrate to provide a combined electronic and electromechanical device on a common substrate. The electromechanical system comprises a structure that is free to move within a gap defined by the electromechanical system.
    Type: Application
    Filed: December 6, 2010
    Publication date: June 9, 2011
    Applicant: ScanNanoTek Oy
    Inventors: Andrei J. Pavlov, Yelena V. Pavlova
  • Patent number: 7944330
    Abstract: A resonant element that causes a signal input from an input terminal to resonate at a predetermined resonance frequency and outputs it to an output terminal is provided. The element has a transmission line series including a plurality of transmission lines connected in series with each other and intersecting with a hotline connecting the input terminal and the output terminal and a plurality of switches. At least one of one end and the other end of the transmission line series is a grounded end. The resonant element having first and second end side, each end side having a first transmission line and a second transmission line connected to a switch having a grounded end. The resonance frequency is switched by turning on/off the switch to change the sum of the lengths of the transmission lines through which the signal passes.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: May 17, 2011
    Assignees: Funai Electric Co., Ltd., The University of Electro-Communications
    Inventors: Yasushi Yamao, Makoto Hasegawa, Hiroyuki Kobayashi
  • Publication number: 20110102113
    Abstract: A high-impedance line includes a plurality of windings successively arranged. Each of the windings includes an upper portion and a lower portion parallel to the upper portion. The upper portions of each of the windings are electrically connected to the lower portions of adjacent windings. A resistance unit electrically connected between every two adjacent windings.
    Type: Application
    Filed: May 19, 2010
    Publication date: May 5, 2011
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: XU GAO, ZHI-JUN ZHANG, ZHENG-HE FENG, STEVEN-PHILIP MARCHER, ZHAN LI, YONG YAN
  • Patent number: 7924121
    Abstract: A dispersion-free radial transmission line (“DFRTL”) preferably for linear accelerators, having two plane conductors each with a central hole, and an electromagnetically permeable material (“EPM”) between the two conductors and surrounding a channel connecting the two holes. At least one of the material parameters of relative magnetic permeability, relative dielectric permittivity, and axial width of the EPM is varied as a function of radius, so that the characteristic impedance of the DFRTL is held substantially constant, and pulse transmission therethrough is substantially dispersion-free. Preferably, the EPM is divided into concentric radial sections, with the varied material parameters held constant in each respective section but stepwise varied between sections as a step function of the radius.
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: April 12, 2011
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: George J. Caporaso, Scott D. Nelson
  • Patent number: 7915980
    Abstract: A communication device consistent with certain implementations has a coaxial cable having length and first and second ends. The coaxial cable further has a central conductor, a dielectric insulator surrounding the central conductor, and an electric shield conductor surrounding the dielectric insulator. The dielectric insulator serves as a dielectric waveguide having a characteristic impedance Z at an operating frequency range. A termination for electrical energy coupled into or out of the dielectric insulator at approximately the characteristic impedance Z at the operating frequency range to utilize the dielectric insulator as a waveguide for transmission of signals along the length of the coaxial cable, and wherein the center conductor is further used to communicate an electrical signal between the first and second ends. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: March 29, 2011
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Robert Allan Unger, Robert L. Hardacker, Christopher Jensen Read
  • Patent number: 7902938
    Abstract: A data transmitter uses a transmission line including a ground conductor (305), a signal conductor (201), and an insulating material (3) which insulates them from each other. The insulating material includes a dielectric (320) exhibiting a nonlinear relationship between a generated electric field and dielectric polarization. The effective reactance per unit length of the transmission line changes depending on the signal voltage. Data is transmitted between integrated circuits (102) via the transmission line, achieving data transmission at a higher speed than a conventional one.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: March 8, 2011
    Assignee: NEC Corporation
    Inventor: Kaoru Narita
  • Patent number: 7889031
    Abstract: High-speed interconnect systems for connecting two or more electrical elements for both on-chip and off-chip applications are provided. Interconnect system has the means, which could reduce the microwave loss induced due to the dielectrics. Reducing the effective loss tangent of the dielectrics reduces the microwave loss. With optimize design of the interconnects, the speed of the electrical signal can be made to closer to the speed of the light. The interconnect systems consists of the electrical signal line, inhomogeneous dielectric systems and the ground line, wherein inhomogeneous dielectric system consisting of the opened-trenches into the dielectric substrate or comb-shaped dielectrics to reduce the microwave loss. Alternatively dielectric structure can have the structure based on the fully electronic or electromagnetic crystal or quasi crystal with the line defect.
    Type: Grant
    Filed: October 7, 2007
    Date of Patent: February 15, 2011
    Assignee: Banpil Photonics, Inc.
    Inventor: Achyut Kumar Dutta
  • Patent number: 7839236
    Abstract: Techniques, apparatus and systems that use composite left and right handed (CRLH) metamaterial structures to combine and divide electromagnetic signals at multiple frequencies. The metamaterial properties permit significant size reduction over a conventional N-way radial power combiner or divider. Dual-band serial power combiners and dividers and single-band and dual-band radial power combiners and dividers are described.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: November 23, 2010
    Assignee: Rayspan Corporation
    Inventors: Alexandre Dupuy, Ajay Gummalla, Maha Achour
  • Publication number: 20100289601
    Abstract: An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor.
    Type: Application
    Filed: June 12, 2009
    Publication date: November 18, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHOU-KUO HSU, YU-CHANG PAI, CHENG-SHIEN LI, JIA-CHI CHEN
  • Publication number: 20100060388
    Abstract: A transmission line microwave apparatus includes at least one nonreciprocal transmission line part, which includes a series branch circuit equivalently including a capacitive element and a shunt branch circuit equivalently including an inductive element. The nonreciprocal transmission line part has gyrotropic characteristic by being magnetized in a magnetization direction different from the propagation direction of a microwave, and has an asymmetric structure to a plane formed by the propagation direction and the magnetization direction. The nonreciprocal transmission line part has a propagation constant and an operating frequency set in a dispersion curve that represents a relation between the propagation constant and the operating frequency so that the propagation constant in the forward direction and the propagation constant in the backward direction have nonreciprocal phase characteristics different from each other.
    Type: Application
    Filed: March 5, 2008
    Publication date: March 11, 2010
    Inventor: Tetsuya Ueda
  • Patent number: 7612638
    Abstract: A waveguide in semiconductor integrated circuit is disclosed, the waveguide comprises a horizontal first metal plate, a horizontal second metal plate above the first metal plate, separated by an insulation material, and a plurality of metal vias positioned in two parallel lines, running vertically through the insulation material in contacts with both the first and second metal plates, wherein the first and second metal plates and the plurality of metal vias form a metal enclosure in a cross-sectional view that can serve as a waveguide.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: November 3, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shine Chung, Fu-Lung Hsueh
  • Publication number: 20090134017
    Abstract: A system providing selective spin modification and reaction in an electrolytic cell. An electrolytic cell is coupled to a magnet that provides a level-splitting magnetic field in a region of electrolyte adjacent to a working electrode, thus establishing a spin resonance for an unpaired electron associated with a chemical species in the region of electrolyte adjacent to the working electrode. The working electrode carries an excitation current produced by a switching source or amplifier. The excitation current produces an alternating magnetic field adjacent to the working electrode that alters the spin state population density for the unpaired electron associated with a chemical species within the electrolyte, thereby enhancing or inhibiting the reaction of the chemical species during subsequent electrolysis.
    Type: Application
    Filed: August 18, 2008
    Publication date: May 28, 2009
    Inventor: MEHLIN DEAN MATTHEWS
  • Patent number: 7528686
    Abstract: A tunable filter includes a first resonator; a second resonator; and, a conductive grid assembly electrically coupled to the first and second resonators and coupled to ground. The conductive grid assembly alters the coupling between the first and second resonators. The conductive grid assembly preferably includes a conductive grid element electrically coupled to the first and second resonators; and, a ground coupling element connected between the conductive grid element and ground for altering the coupling between the conductive grid element and ground.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: May 5, 2009
    Assignee: Rockwell Collins, Inc.
    Inventor: John C. Estes
  • Publication number: 20090096554
    Abstract: A power combiner comprising an LC lattice structure is shown, together with a method for generating a planar wave front. The LC structure can comprise constant or voltage dependent capacitors. Either the delay or the characteristic impedance of the two-dimensional transmission line formed by the LC lattice structure are kept constant. A planar wave propagating along one direction of the transmission line gradually experiences higher impedances at the edges, creating a lower resistance path for the current in the middle. This funnels more power to the center as the wave propagates.
    Type: Application
    Filed: October 16, 2008
    Publication date: April 16, 2009
    Inventors: Ehsan Afshari, Harish Bhat, Seyed Ali Hajimiri
  • Patent number: 7515015
    Abstract: A signal transmission structure includes a driving circuit block, a receiving circuit block, a main transmission line, and a copper patch. The main transmission line connects the driving circuit block to the receiving circuit block for transmitting signals therebetween. The copper patch is arranged at the main transmission line, and has a rectangular shape. The copper patch can reduce switching rates when the signal state of the driving circuit changes rapidly. The copper patch serves as a compensation capacitor, to reduce a rate of switching of the signal, and to reduce or even eliminate the problems of crosstalk and overshooting and undershooting of signals. It is of advantage that the copper patch is simple to manufacture and very suitable for mass production.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: April 7, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ning Liu, Yu-Hsu Lin, Yun-Qiang Meng
  • Publication number: 20090051468
    Abstract: A radio frequency source includes a coaxial non-linear transmission line. The coaxial non-linear transmission line may include a closed, non-magnetic, cylindrical outer conductor defining a cavity therein; and a plurality of stages enclosed by the outer conductor. Each stage may then includes an axial field solenoid wound about the outer conductor; a non-magnetic, cylindrical inner conductor disposed within the cavity and coaxially aligned with the outer conductor; a plurality of cylindrical ferrite switch elements, each defining a respective bore through which the inner conductor runs; and a plurality of inner and outer cups coaxially aligned with the inner and outer conductors, each defining a respective bore through which the inner conductor runs.
    Type: Application
    Filed: August 15, 2008
    Publication date: February 26, 2009
    Inventors: Michael C. Scott, Steve E. Calico, Chris E. Williams
  • Publication number: 20090039985
    Abstract: An electronic device includes a transmitter circuit, a receiver circuit, a first conductor, and a second conductor of a return path being a grounded line. The first conductor is surrounded by a dielectric. A plurality of resistive elements are connected in parallel between the first conductor and the second conductor. The first conductor transfers therethrough a transmission signal from the transmitter circuit. The length of the line of the first conductor is set to be greater than or equal to one half of the product between the inverse of the signal transfer rate of the first conductor and the velocity of light traveling through the dielectric. The resistive elements are provided along the line of the first conductor for every unit distance being equal to one half of the product between the signal transfer rate of the first conductor and the velocity of light traveling through the dielectric. Thus, it is possible to reduce the signal waveform distortion along the transmission line.
    Type: Application
    Filed: August 8, 2008
    Publication date: February 12, 2009
    Inventor: Masaya SUMITA
  • Patent number: 7414492
    Abstract: A power amplifier (power amplifier) having multiple solid state sub-amplifiers connected in parallel between the power amplifier input and the power amplifier output are described. The signal input to the power amplifier is provided to an RF splitter connected between the power amplifier input connector and the input of each of the sub-amplifiers. The RF splitter splits the input power from the signal input and provides the power to the sub-amplifier inputs through input electrical paths. The input electrical paths from the power amplifier input to the sub-amplifiers are substantially physically identical. Each of the sub-amplifiers drive an input of an RF combiner connected between the outputs of the sub-amplifiers and the output of the power amplifier. The RF combiner combines the output power from each of the sub-amplifiers through output electrical paths, and provides the combined power to the power amplifier output.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: August 19, 2008
    Assignee: Keragis Corporation
    Inventor: Robert M. Rector
  • Patent number: 7391288
    Abstract: A high frequency resonator circuit and method of fabrication is described which has a resonant frequency independent of physical resonator dimensions. The resonator operates in a zeroeth-order mode on a composite right/left-handed (CRLH) transmission line (TL). The LH wave properties of the CRLH-TL contributing anti-parallel phase and group velocities. In one variation, the unit cells are formed from microstrip techniques, preferably creating alternating interdigitated capacitors and stub inductors. The resonant wavelength of the resonator is dependent on the electrical characteristics of the unit cells and not the physical size of the resonator in relation to the desired resonant wavelength. The resonator is created with at least 1.5 unit cells and the Q of the resonator is substantially independent of the number of unit cells utilized. The resonator circuit is particularly well suited for reducing resonator size, and allows resonators of various wavelengths to be fabricated within a fixed board area.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: June 24, 2008
    Assignee: The Regents of the University of California
    Inventors: Tatsuo Itoh, Atsushi Sanada, Christophe Caloz
  • Patent number: 7334325
    Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: February 26, 2008
    Assignee: Intel Corporation
    Inventors: Weston Roth, Jayne L. Mershon, Xang Moua, Jason A. Mix
  • Patent number: 7330090
    Abstract: A high frequency resonator circuit and method of fabrication is described which has a resonant frequency independent of physical resonator dimensions. The resonator operates in a zeroeth-order mode on a composite right/left-handed (CRLH) transmission line (TL). The LH wave properties of the CRLH-TL contributing anti-parallel phase and group velocities. In one variation, the unit cells are formed from microstrip techniques, preferably creating alternating interdigitated capacitors and stub inductors. The resonant wavelength of the resonator is dependent on the electrical characteristics of the unit cells and not the physical size of the resonator in relation to the desired resonant wavelength. The resonator is created with at least 1.5 unit cells and the Q of the resonator is substantially independent of the number of unit cells utilized. The resonator circuit is particularly well suited for reducing resonator size, and allows resonators of various wavelengths to be fabricated within a fixed board area.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: February 12, 2008
    Assignee: The Regents of the University of California
    Inventors: Tatsuo Itoh, Atsushi Sanada, Christophe Caloz
  • Patent number: 7298234
    Abstract: High-speed interconnect systems for connecting two or more electrical elements are provided. Interconnect system has the means, which could reduce the microwave loss induced due to the dielectrics. Reducing the effective loss tangent of the dielectrics reduces the microwave loss. With optimize design of the interconnects, the speed of the electrical signal can be made to closer to the speed of the light. The interconnect systems consists of the electrical signal line, inhomogeneous dielectric systems and the ground line, wherein inhomogeneous dielectric system consisting of the opened-trenches into the dielectric substrate or comb-shaped dielectrics to reduce the microwave loss. Alternatively dielectric structure can have the structure based on the fully electronic or electromagnetic crystal or quasi crystal with the line defect. Alternatively, dielectric structure can be made to comb-shaped structure with teethes having thickness and space making the air pocket to reduce the microwave loss.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: November 20, 2007
    Assignee: Banpil Photonics, Inc.
    Inventor: Achyut Kumar Dutta
  • Patent number: 7227430
    Abstract: A bondwire transition arrangement for interconnecting a signal port on one IC of a multichip module with a signal port on another, adjacent, IC of the same module employs a distributed signal-transition process in which the signal on one port appears as subsignals at tapping points along a series transmission-line segment arrangement between that port and ground on the same IC and the subsignals are recombined along a second series transmission-line segment arrangement connected between the other port and ground on the other IC. Spatially corresponding tapping points are interconnected via bondwires.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: June 5, 2007
    Assignee: Marconi Communications GmbH
    Inventors: Hardial Singh Gill, Stefan Koch, Rolf Lohrmann
  • Patent number: 7193490
    Abstract: Since a width of an edge portion of a signal line of a first high frequency transmission line is changed with respect to a width of another portion thereof, a deviation of impedances in a connection portion of the first and second high frequency transmission lines can be suppressed, so that signal reflections occurred in the connection portion can be lowered and a signal passing characteristic is improved.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: March 20, 2007
    Assignee: TDK Corporation
    Inventor: Hideaki Shimoda
  • Patent number: 7167936
    Abstract: Circuit board having a plurality of bus lines (6), which run on the circuit board (1) essentially parallel to a preferred direction of the circuit board (1), and having at least one integrated circuit (3) for the high-speed data processing of data, which integrated circuit is arranged on the circuit board (1), is integrated in a housing (4) having a plurality of housing sides (5) and has a plurality of parallel interfaces for connection to the bus lines (6), in which case the housing sides (5) of the integrated circuits (3) are oriented at an inclination with respect to the preferred direction of the circuit board (2).
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: January 23, 2007
    Assignee: Infineon Technologies AG
    Inventor: Paul Lindt
  • Patent number: 7088201
    Abstract: A broadside 90° microwave coupler is composed of three metal layers in a homogeneous dielectric media. The coupler is constructed in a multi-layer configuration with two conductor strips arranged on top of each other so as to be electro-magnetically coupled. A ground plane formed with a third metal layer below the coupled conductor strips is opened so that it is separated from the conductor strips by a gap. The two conductor strips are fully embedded into the dielectric layer. The characteristic physical dimensions of the coupler are determined to achieve the desired coupling coefficient while maintaining low reflection, high isolation and phase balance at the output ports of the coupler.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: August 8, 2006
    Assignee: Eudyna Devices Inc.
    Inventor: Belinda Piernas
  • Patent number: 7076378
    Abstract: An apparatus determines a characteristic of a portion of a power line. The apparatus comprises a coupling device in communication with a processor. The coupling device receives a signal from a power line and the processor receives the signal from the coupling device and determines a characteristic of a portion of the power line based on the received signal.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: July 11, 2006
    Assignee: Current Technologies, LLC
    Inventor: Ronald E. Huebner
  • Patent number: 6903634
    Abstract: An approach to enhance the noise immunity of high-speed digital signals by means of a resonance-free environment is developed. Resonance detuning is achieved by appropriately reshaping the layout of the power/ground planes. Resonant properties of the power distribution system, including resonant frequencies and field distribution profiles, were characterized with frequency-domain simulations. Analysis of the resonant field profiles reveals that the electric field distribution of the dominant mode normally concentrates in the vicinity of the plane edge. Therefore, resonance can be effectively tuned out of the operating frequency range through boundary configuring. In addition, it is shown that variation of the quality factor with the external probe position provides a means to monitor and construct the resonant field distribution. Physical mechanism responsible for this unique property is clarified from the perspective of probe coupling.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: June 7, 2005
    Assignee: Silicon Integrated Systems Corp.
    Inventor: Tsun-hsu Chang
  • Patent number: 6825743
    Abstract: A circuit for processing radio frequency signals. The circuit can include a substrate board that has at least one dielectric layer (100) having a first set of substrate properties over a first region (102). The first set of substrate properties can include a first permittivity and a first permeability. A second region (140) can be provided with a set of second substrate properties. The second region can have a second set of substrate properties including a second permittivity and a second permeability. The second permittivity can be different than the first permittivity and/or the second permeability can be different than the first permeability. A first transmission line (102) having at least one discontinuity can be coupled to the second region (108). The discontinuity can include a bend, corner, non-uniformity, break in the transmission line, or a junction between the first transmission line and a second transmission line.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: November 30, 2004
    Assignee: Harris Corporation
    Inventors: Raymond Charles Rumpf, Jr., William D. Killen, Randy T. Pike
  • Patent number: 6812803
    Abstract: A high-speed router backplane, and method for its fabrication, are disclosed. The backplane uses differential signaling trace pairs on multiple high-speed signaling layers, the high-speed signaling layers separated by ground planes. Plated signaling thru-holes connect the trace pairs to the board surface for connection to external components. The signaling thru-holes pass through clearances in each ground plane. At selected ground planes, a conductive pad is patterned within each high-speed signaling thru-hole clearance, the pad slightly larger than the thru-hole diameter. The pads affect the impedance characteristics of the thru-holes, thus providing a better impedance match to the differential trace pairs, reducing signal reflections, and improving the ability to signal across the backplane at high speeds.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: November 2, 2004
    Assignee: Force10 Networks, Inc.
    Inventor: Joel R. Goergen
  • Patent number: 6774741
    Abstract: A non-uniform transmission line includes at least one patterned conductive layer, a dielectric layer adjacent to the patterned conductive layer(s), and an insulating layer surrounding the patterned conductive layer(s) and the dielectric layer.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: August 10, 2004
    Assignee: DeCorp Americas, Inc.
    Inventors: Michael W. McCurdy, David Murray, James M. Potter, Robert J. Sexton, Linda Sue Walling
  • Patent number: 6700463
    Abstract: A transmission line structure for reduced coupling of signals between circuit elements. The structure includes an RF transmission line disposed on a circuit board (100) formed from a dielectric substrate material. The RF transmission line includes an elongated conductive metal trace (110) and has opposed elongated edge portions. The structure also includes a pair of elongated substrate boundary regions (105) coextensive with at least a portion of the elongated conductive metal trace (110). Each of the boundary regions (105) is positioned adjacent to a respective one of the opposing edge portions to define an elongated substrate channel region (205). A pair of conductive metal traces (410) can be disposed on the substrate channel region (205) within the substrate boundary regions (105). The conductive metal traces (410) are spaced apart by an intermediate substrate region (405) and are parallel to each other.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: March 2, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6677831
    Abstract: A new method to control differential signal trace impedance allows flexible use of different signal trace width and spacing while maintaining constant differential impedance in printed circuit boards. Differential impedance of a signal pair is determined by the geometry of individual traces and the spacing between traces. The value of the differential impedance is inversely proportional to signal trace width and directly proportional to signal trace spacing. By decreasing or increasing trace width and spacing simultaneously, a constant differential impedance can be achieved.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: January 13, 2004
    Assignee: 3PARdata, Inc.
    Inventors: Christopher Cheng, Josh Price
  • Publication number: 20030222727
    Abstract: A non-uniform transmission line includes at least one patterned conductive layer, a dielectric layer adjacent to the patterned conductive layer(s), and an insulating layer surrounding the patterned conductive layer(s) and the dielectric layer.
    Type: Application
    Filed: May 28, 2002
    Publication date: December 4, 2003
    Inventors: Michael W. McCurdy, David Murray, James M. Potter, Robert J. Sexton, Linda Sue Walling
  • Patent number: 6564274
    Abstract: In concentrated multiprocessor systems conforming to the presently disclosed modular architecture, a host processor and plural client processors are packaged in a single box containing a high speed (short length) bus connecting all of the processors, and data storage resources via the bus. The bus may be of a type commonly used in contemporary single computer systems; e.g. one conforming to PCI specifications. The host processor and associated resources are mounted directly on an integrated circuit motherboard containing the bus and card connectors attached to the bus. The card connectors removably receive integrated circuit cards containing individual client processors. In one embodiment, client processors are configured to be used as workstations or PC's—in a residence, office or small factory environment—relative to users and accessories remote from the system enclosure.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: May 13, 2003
    Assignee: Omnicluster Technologies, Inc.
    Inventors: Chester A. Heath, Dennis J. McBride, Gregg J. McKnight, Vincent C. Wu
  • Patent number: 6310527
    Abstract: A reactance of a reactance element in a multi-layer circuit board apparatus is trimmed by cutting a portion of the circuit pattern of the reactance element with a laser beam. The reactance element is sandwiched between grounded layers. A coil circuit pattern having at least a hole therein may be provided as the reactance element. A side portion between the edge of the coil circuit pattern and the hole is cut with the laser beam to trim the inductive reactance. Cutting is effected while the circuit is operated and the operating condition such as an oscillation frequency is observed. A plurality of holes may be provided in the coil circuit pattern. The trimming amount of the inductive reactance is determined by the number of the hole subjected to cutting. The holes may have different sizes. The trimming amount is obtained by which one of the hole is subjected to cutting. The distance between the cut circuit pattern is equal to or larger than the thickness of the circuit pattern.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: October 30, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Sugawara, Tamotsu Kaneko, Sadahiro Gomi, Masayuki Ito
  • Patent number: 6239671
    Abstract: A transmission or delay line transformer comprising a plurality of transmission or delay lines (101-110) so arranged that the inputs to the lines are connected together in parallel to provide a transformer input (130) and the outputs of the lines are connected together in series so as to provide a transformer output (131). In order to provide isolation between the input (130) and the output (131) of the transformer the lines are arranged so as to provide inductive isolation (L) between the inputs and outputs of the lines. The inductive isolation (L) provided between the input and output of any particular line depends upon the stage of the transformer which that particular line forms, the higher the stage the higher the amount of inductive isolation provided. The transmission or delay lines may take the form of conventional transmission lines, transmission lines modified so as to increase the time of propagation of signals along the line or lumped element balanced delay lines.
    Type: Grant
    Filed: May 18, 1999
    Date of Patent: May 29, 2001
    Assignee: Isis Innovation Limited
    Inventor: Paul Smith
  • Patent number: 5966056
    Abstract: Method and apparatus for enabling the transmission of high bandwidth analog and digital data over cable lengths of more than 1000 feet through low cost semishielded or unshielded four wire cable are disclosed. Three balanced mode signals are transmitted using four conductors. In this configuration, the components A+ and A- of a first balanced mode signal A are respectively carried on a first pair of conductors, the components B+ and B- of a second balanced mode signal B are respectively carried on a second pair of conductors, and the components C+ and C- of a third balanced mode signal C are respectively carried on a pair of conductors synthesized through the commonality of the first and second conductor pairs, respectively. Using this technique, a new additional virtual ground plane is created wherein signal energy can be transmitted without interfering or combining with the other signals being transmitted on the remaining conductor pairs.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: October 12, 1999
    Assignee: INT Labs, Inc.
    Inventor: Barry Thornton