Long Lines Patents (Class 333/236)
  • Patent number: 5939952
    Abstract: A flat flexible electrical cable includes a pair of pseudo-twisted conductors on a flexible dielectric substrate. Each conductor includes alternate straight and oblique sections. The straight sections of the conductors are generally parallel to each other and of uniform width. The oblique sections of the conductors cross each other at a crossover point. Each oblique section of each conductor is reduced in width uniformly in a direction from the straight-to-oblique transfer point of the respective conductor to the crossover point of the conductors.
    Type: Grant
    Filed: May 21, 1997
    Date of Patent: August 17, 1999
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Tetsuo Hoshino
  • Patent number: 5923227
    Abstract: A non-linear dispersive transmission line includes a plurality of substantially block-like shaped capacitor elements (4) arranged in sequence in at least two arrays. The even numbered elements (4b, 4d etc) extend side by side to form a first array and the odd numbered elements (4a, 4c) etc extend side by side to form the second array. Each element (4) in one array is connected via inductors (3) to two immediately adjacent elements in the other array. Facing surfaces (5) of each two immediately adjacent elements (4a, 4c) in each array form cross link capacitors.
    Type: Grant
    Filed: September 25, 1997
    Date of Patent: July 13, 1999
    Assignee: British Aerospace Public Limited Company
    Inventor: Nigel Seddon
  • Patent number: 5872490
    Abstract: A signal cable is provided with a first signal line and second signal line which are respectively connected between a first signal device and a second signal device and are constructed so as to transmit appointed signals, wherein the second signal line is a constant potential line and connects the first shielding line to the second signal line at the same potential at the first signal device side and simultaneously connects the second shielding line to the second signal line at the same potential at the second signal device side.
    Type: Grant
    Filed: January 16, 1997
    Date of Patent: February 16, 1999
    Inventor: Satoru Kamimura
  • Patent number: 5830301
    Abstract: A composite structure including stacked layers of dielectric material hav a center conductor in the form of a cylindrical via which is surrounded by an annular dielectric region and an outer ground plane comprised of contiguous pairs of generally circular ground plane segments where each pair of ground plane segments are separated by a pair of spaces or gaps therebetween and wherein the gaps of adjoining layers are mutually oriented by a predetermined angle of rotation, preferably 90.degree..
    Type: Grant
    Filed: February 12, 1997
    Date of Patent: November 3, 1998
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Dana J. Sturzebecher, Michael T. Cummings, Thomas P. Higgins, James R. DeMarco
  • Patent number: 5770988
    Abstract: A thin-film multilayered electrode of a high frequency electromagnetic field coupled type is disclosed. The thin-film multilayered electrode comprises thin-film conductors and dielectric thin films alternately stacked on a dielectric substrate so that a plurality of TEM mode transmission lines are multilayered. A film thickness of each of the dielectric thin films is set so that phase velocities of TEM waves which propagate through at least two of the plurality of TEM mode transmission lines are made substantially equal to each other, and a film thickness of each of the thin-film conductors is set so as to be smaller than a skin depth of a frequency which is used so that electromagnetic fields of at least two of the plurality of TEM mode transmission lines are coupled with each other.
    Type: Grant
    Filed: August 22, 1996
    Date of Patent: June 23, 1998
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshihiko Goto, Masato Kobayashi, Yukio Yoshino, Yuzo Katayama
  • Patent number: 5712585
    Abstract: A system for convening between parallel data and serial data is described. In the system (b 10), individual bits of the parallel data (12) are latched into individual registers (117). Each register (117) is coupled to a corresponding AND gate (110) which is also connected to receive phased clock signals. The output terminals of the AND gates (110) are connected to an OR gate (115). Using the system, with appropriately phased clocks, the parallel data is convened into serial data.
    Type: Grant
    Filed: December 29, 1995
    Date of Patent: January 27, 1998
    Assignees: Deog-Kyoon Jeong, Sun Microsystems
    Inventor: Deog-Kyoon Jeong
  • Patent number: 5675298
    Abstract: A low-loss, low-inductance metal interconnect for an electrical signal in a microcircuit comprises a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer. The metal interconnect lines are interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in the plane. The metal interconnect lines together comprise a signal interconnect path, and the metal lines are coupled to a fixed voltage potential, such as ground.
    Type: Grant
    Filed: November 21, 1995
    Date of Patent: October 7, 1997
    Assignee: Sun Microsystems, Inc.
    Inventors: Raghunand Bhagwan, Alan Rogers, John MacDonald
  • Patent number: 5644276
    Abstract: A composite structure including stacked layers of dielectric material hav a center conductor in the form of a cylindrical via which is surrounded by an annular dielectric region and an outer ground plane comprised of contiguous pairs of generally circular ground plane segments where each pair of ground plane segments are separated by a pair of spaces or gaps therebetween and wherein the gaps of adjoining layers are mutually oriented by a predetermined angle of rotation, preferably 90.degree..
    Type: Grant
    Filed: May 29, 1996
    Date of Patent: July 1, 1997
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Dana J. Sturzebecher, Michael T. Cummings, Thomas P. Higgins, James R. DeMarco
  • Patent number: 5539360
    Abstract: A transmission line has a limited cross-section, a transmission line geometry and an improved characteristic impedance tolerance. The transmission line geometry utilizes a unique combination of broadside coupling and coplanar coupling with a reflector plate in order to improve the tolerance of the characteristic impedance. First, a larger coplanar gap is used to reduce the etching error. Second, the inner dielectric thickness sensitivities were also reduced by relying on broadside coupling and coplanar coupling to determine the characteristic impedance of the transmission line. Third, the effect of registration error in the broadside coupling is eliminated by rendering the two signal bearing conductors on the same layer.
    Type: Grant
    Filed: March 11, 1994
    Date of Patent: July 23, 1996
    Assignee: Motorola, Inc.
    Inventors: Louis J. Vannatta, James P. Phillips, Eric L. R. Krenz
  • Patent number: 5349317
    Abstract: A high frequency signal transmission tape for connecting a plurality of high frequency IC chips to each other or connecting a high frequency IC chip to a signal transmission line disposed on a package includes an insulating thin film having a surface; a conductive signal line disposed on the surface; and two conductive grounding lines disposed on the surface on opposite sides of, parallel to, and spaced from the signal line. The signal transmission tape produces small reflection and attenuation of signals in an extremely high frequency band, i.e., a millimeter-wave frequency band over 30 GHz. Therefore, high frequency IC chips arbitrarily arranged on a package are easily connected using the high frequency signal transmission tape.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: September 20, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshihiro Notani, Takayuki Katoh
  • Patent number: 5124677
    Abstract: A waffeline-configured, surface-mount transmission line module contains a two-dimensional arrangement of periodically distributed conductive surface mesas and channels. Within the channels are segments of dielectrically surrounded conductor. The geometry of the arrangement of segments among the waffleline channels is defined in accordance with the intended signal coupling functionality of the interconnect structure. For example, in the case of a signal splitting application, the conductor segments may be arranged in a tree-like configuration between an input port and multiple output ports. Isolation resistors may be disposed within the channels of the waffleline between adjacent locations of diverging conductor runs among the mesas of the waffleline.
    Type: Grant
    Filed: August 22, 1990
    Date of Patent: June 23, 1992
    Assignee: Harris Corporation
    Inventors: Douglas Heckaman, Diane G. Caruso
  • Patent number: 5029235
    Abstract: An electromagnetic dispersive delay line (10) includes a dielectric strip (28) as well as a coupler (24, 34, 36, and 38) for launching surface electromagnetic waves into the dielectric strip. The upper surface of the dielectric strip (28) is left exposed to the air in order to provide an interface with a lower-permittivity medium of propagation. This permits a surface-electromagnetic-wave propagation mode. The thickness of the dielectric strip (28) is varied along its length so as to result in a linear relationship of delay to frequency throughout a predetermined frequency range. Preferably, a conductive strip (26) spaced from the dielectric strip extends along the surface-wave propagation path in the region occupied by the evanescent field external to the dielectric strip (28). This conductive strip (26) modifies the phase relationships between the electric and magnetic fields in the evanescent-field region so as to cause some of the power transmission to occur outside of the dielectric strip.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: July 2, 1991
    Assignee: Sanders Associates, Inc.
    Inventors: John T. Apostolos, Chester E. Stromswold, Robert H. Carrier
  • Patent number: 4945189
    Abstract: An interconnection cable for audio frequency high fidelity applications comprises a first and a second conductor which are disposed close to one another and connected at the ends, wherein the second conductor has an electrical length which is a least three times longer than the first conductor. The second conductor is helically wound about the first conductor. A third conductor may be included in the space within the helical winding, and in one embodiment may be connected at the ends of the first and second conductor. In another embodiment, the third conductor may be insulated from the first conductor and the second conductor for signal return.
    Type: Grant
    Filed: August 9, 1989
    Date of Patent: July 31, 1990
    Inventor: Donald E. Palmer
  • Patent number: 4891616
    Abstract: A differential-mode signal transmission system includes a circuitboard composed of at least one dielectric board substrate and a pair of spaced apart conductive parallel planar signal transmission lines disposed on one surface of the substrate and extending between a pair of edges thereof for providing pass-through transmission of differential-mode signals from one to the opposite edge of the substrate. Preferably, the circuitboard is composed of at least a pair of dielectric board substrates being disposed in face-to-face layered contact with one another and having at least one pair of the spaced apart conductive parallel planar signal transmission lines disposed between the layered substrates along the inner surfaces thereof. Ground planes are provided on the outer surfaces of the layered substrates for electrically shielding the parallel planar transmission line pair.
    Type: Grant
    Filed: June 1, 1988
    Date of Patent: January 2, 1990
    Assignee: Honeywell Inc.
    Inventors: Gerald W. Renken, Kimberly J. Gray, Michael W. Greenwood
  • Patent number: 4851793
    Abstract: A miniaturized transmission link architecture for intercoupling high frequency miniaturized integrated circuit components comprises a thin conductive plate in one surface of which a matrix or grid work of rectilinear grooves or channels are formed, creating "waffle-iron"-like pattern in one surface of the conductive plate. The spacing between channels corresponds to the width of a channel which, in turn, may be sized to substantially match the outer diameter of insulation jacketed wire that is placed in the channels. The depth of a channel or groove is slightly larger than the outer diameter of the wire to accommodate wire crossovers at intersections of the channels. The top surface of the "waffle-plate" is provided with a conductive foil to complete the shielding for the wires.
    Type: Grant
    Filed: July 14, 1987
    Date of Patent: July 25, 1989
    Assignee: Harris Corporation
    Inventors: Douglas E. Heckaman, Roger H. Higman, Jeffrey A. Frisco, Edward J. Bajgrowicz
  • Patent number: 4843356
    Abstract: An electrical transmission line has improved signal transmission characteristics, low attenuation, constant phase and group velocity and constant and nearly ohmic characteristic impedance over a wide frequency band by providing low magnetic loss inductance along with the shunt capacitance of the insulation surrounding the conductors. The low loss inductance can be provided by particulate magnetic material, such as ferrites, homogeneously distributed in the insulating material or alternatively the inductance can be provided by ring(s) of magnetic material concentric with the conductor or by layer(s) of magnetic material when the conductor(s) are flat. A variety of radial or longitudinal profiles of the doping level is possible and can be used in combination with any of these basic loading designs. These concepts can be applied in twisted pair, coaxial or high voltage power transmission and distribution single or three phase cables or strip lines and other breadboard applications.
    Type: Grant
    Filed: August 25, 1986
    Date of Patent: June 27, 1989
    Assignee: Stanford University
    Inventors: Bruce B. Lusignan, Simos D. Dadakarides
  • Patent number: 4769515
    Abstract: The present invention relates to single and twisted pair transmission line wires wherein the effective electrical diameter of the primary conductor is increased. This is accomplished by wrapping conductive foil or conductive foil laminated to a substrate layer onto a primary conductor with a diameter less than 20 mils wherein the foil is in contact with the conductor and has an outer insulating cover.This may be done by either spiral wrapping or by longitudinal wrapping around the electrical conductor. This invention provides a desired characteristic impedance along the length of the wire(s) and allows easy removal for standard termination and increased cut-through resistance.
    Type: Grant
    Filed: June 25, 1987
    Date of Patent: September 6, 1988
    Assignee: W. L. Gore & Associates
    Inventors: Paul E. Hubis, James G. Vana, Stephen C. Miller
  • Patent number: 4701763
    Abstract: A small antenna including a dielectric plate, upper and lower conductive plates provided on upper and lower faces of the dielectric plate, respectively, a plurality of conductive reactance posts for connecting, at first positions of the dielectric plate, the upper and lower conductive plates to each other, and a feed point provided at a second position of the dielectric plate such that first and second plane-parallel plate transmission lines separated from each other by the reactance posts are formed by the upper and lower conductive plates.
    Type: Grant
    Filed: September 16, 1985
    Date of Patent: October 20, 1987
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junko Yamamoto, Kyohei Fujimoto, Kazuhiro Hirasawa, Haruhiro Kuboyama
  • Patent number: 4695810
    Abstract: A miniaturized transmission link architecture for intercoupling high frequency miniaturized integrated circuit components comprises a thin conductive plate in one surface of which a matrix or grid work of rectilinear grooves or channels are formed, creating "waffle-iron"-like pattern in one surface of the conductive plate. The spacing between channels corresponds to the width of a channel which, in turn, may be sized to substantially match the outer diameter of insulation jacketed wire that is placed in the channels. The depth of a channel or groove is slightly larger than the outer diameter of the wire to accommodate wire crossovers at intersections of the channels. The top surface of the "waffle-plate" is provided with a conductive foil to complete the shielding for the wires.
    Type: Grant
    Filed: October 22, 1984
    Date of Patent: September 22, 1987
    Assignee: Harris Corporation
    Inventors: Douglas E. Heckaman, Roger H. Higman, Jeffrey A. Frisco, Edward J. Bajgrowicz
  • Patent number: 4644380
    Abstract: Disclosed is a substance-sensitive semiconductor and a method for making the same, wherein a substance-sensitive material is combined with photoresist material and applied to an electronic device structure. The substance-sensitive material may be applied before or after the photoresist material, or even may be combined with the photoresist material to form a substance-sensitive layer of photoresist material on the semi-conductor. The photoresist material is then processed, such that unwanted, or undesirable areas are free from the photoresist material and the areas of desired substance sensitivity have a fully processed photoresist layer. A further embodiment of the present disclosure provides multiple layers sensitive to different ions on a single sheet of semiconductor or electromagnetically active material.
    Type: Grant
    Filed: July 30, 1981
    Date of Patent: February 17, 1987
    Assignee: University of Pennsylvania
    Inventor: Jay N. Zemel
  • Patent number: 4638272
    Abstract: A lossy transmission line in which the effective length of the line is reduced by providing resistive ferrite beads spaced along the line to provide constant power loss per unit length. Inductance ferrite beads may be included equally spaced along the line. Resistive beads are located with increasing frequency per unit length from the beginning of the line until a maximum bead density per unit length is achieved. The lossy line is suitable as a terminating unit for a portable travelling wave antenna and in other situations where size reduction is desirable.
    Type: Grant
    Filed: January 2, 1985
    Date of Patent: January 20, 1987
    Assignee: The Commonwealth of Australia
    Inventor: Richard A. Ive
  • Patent number: 4527135
    Abstract: A balanced-line transmission cable is disclosed for use in a communications system of the type having a differential driver which transmits a differential output in the form of two output voltage signals which are transmitted to two corresponding inputs of a differential receiver which produces an output proportional to the difference between the two input voltage signals. A woven balanced line transmission cable includes a plurality of balanced-line signal conductor pairs each pair consisting of first and second signal transmission wires laterally spaced closely adjacent one another and lying generally parallel with one another in the cable. The first and second signal transmission wires transmit one each of the two voltages for input into the differential receiver. A plurality of fiber warp and weft yarns are interwoven in the cable with the signal conductor wire pairs fixing the lateral spacing and parallel alignment of the first and second signal transmission wires.
    Type: Grant
    Filed: June 20, 1983
    Date of Patent: July 2, 1985
    Assignee: Woven Electronics Corp.
    Inventor: Douglas E. Piper
  • Patent number: 4525693
    Abstract: A transmission line is provided, at least a portion of the wave energy transmitting part of the line being made of a dielectric material shaped to create a physical condition which preserves the deflected wave surface of the electromagnetic wave along the portion of the transmission line. The physical condition for preserving the deflected wave surface is formed by providing at least one linear portion which retards the speed of energy transmission so as to prevent the rotation of the electric field surface of the electromagnetic wave. The wave energy transmitting portion composed of dielectric material is preferably made to have an oval cross-section in which the ratio between the major axis and the minor axis has a value not lower than 4/3. Alternatively, the wave energy transmitting portion can be made to have a rectangular cross-section.
    Type: Grant
    Filed: April 11, 1983
    Date of Patent: June 25, 1985
    Assignee: Junkosha Company Ltd.
    Inventors: Hirosuke Suzuki, Hajime Ohki
  • Patent number: 4506235
    Abstract: A cable with at least two insulated conductors wherein the symmetrical mode electromagnetic field between the conductors is essentially confined in a low loss dielectric medium and globally surrounded at least partially by a magnetic absorptive insulating composite, attenuating the asymmetrical current mode and providing a magnetic shielding effect against outside electromagnetic interference.The electromagnetic field of the symmetrical mode is confined between the two conductors while the electromagnetic field of the common mode is absorbed in the magnetic absorptive insulating composite.
    Type: Grant
    Filed: February 23, 1982
    Date of Patent: March 19, 1985
    Inventor: Ferdy Mayer
  • Patent number: 4499438
    Abstract: Disclosed is a high frequency attenuation core and cable. The core includes a conductor surrounded by a high frequency energy absorbing medium, then surrounded by a dielectric, and then surrounded by an outer layer made from a material having a high complex dielectric constant. The cable includes the above described core surrounded by an electromagnetic interference (EMI) shield which is further surrounded by a conductive layer. The cable and core as described above may be used in harness applications wherein a plurality of cores and/or cables as described above are surrounded by a gross shield. In addition, when the cores described above are used in multi-core applications, they may individually include an additional EMI shield for greater electromagnetic interference protection.
    Type: Grant
    Filed: September 14, 1982
    Date of Patent: February 12, 1985
    Assignee: Raychem Corporation
    Inventors: Rajendra S. Cornelius, Albert R. Martin, Hans E. Lunk, Mark D. Mendenhall
  • Patent number: 4490697
    Abstract: There is provided a signal propagating device for receiving an input signal at an input end thereof and supplying the input signal to a plurality of memory cells arranged in one row. The signal propagating device includes a word line connected to transmit the input signal and having a plurality of line segments electrically coupled to the memory cells. A preceding one of the line segments is formed to have a larger average width than a succeeding one of the line segments.
    Type: Grant
    Filed: June 7, 1982
    Date of Patent: December 25, 1984
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Hiroshi Yasuda, Kiyofumi Ochii
  • Patent number: 4486721
    Abstract: Disclosed is a high frequency attenuation core and cable. The core includes a conductor surrounded by a high frequency energy absorbing medium, then surrounded by a dielectric, and then surrounded by an outer layer made from a material having a high complex dielectric constant. The cable includes the above described core surrounded by an electromagnetic interference (EMI) shield which is further surrounded by a conductive layer. The cable and core as described above may be used in harness applications wherein a plurality of cores and/or cables as described above are surrounded by a gross shield. In addition, when the cores described above are used in multi-core applications, they may individually include an additional EMI shield for greater electromagnetic interference protection.
    Type: Grant
    Filed: December 7, 1981
    Date of Patent: December 4, 1984
    Assignee: Raychem Corporation
    Inventors: Rajendra S. Cornelius, Hans E. Lunk, Albert R. Martin, Mark D. Mendenhall
  • Patent number: 4463323
    Abstract: A woven electrical transmission cable A is illustrated which includes a plurality of warp elements (12, 12, 14) interwoven with a weft element (16). A number of the warp elements are ground conductors (10) and a number are signal conductors (12). The ground and signal conductors are arranged in clusters (D, E) which include signal conductor pairs (12a, 12b and 12c, 12d) isolated by ground conductors (10a-10c and 10d-10f), respectively. An input signal is split at the input (20, 24) of the cluster between the signal conductor pair which is then combined at the output to provide a single output signal (28, 30). The location of the ground conductors relative to the signal conductors is fixed in the cable by interweaving of the weft (16) and warp binder yarns (14) together with the warp conductors (10, 12) whereby the characteristic impedance is controlled.
    Type: Grant
    Filed: August 23, 1982
    Date of Patent: July 31, 1984
    Assignee: Woven Electronics Corporation
    Inventor: Douglas E. Piper
  • Patent number: 4441091
    Abstract: A low loss leakage transmission line including a cylindrical dielectric tube the wall thickness d.sub.2 of which is selected to satisfy ##EQU1## where .epsilon..sub.1 is the dielectric constant of the internal space within the tube, .epsilon..sub.2 is the dielectric constant of the material which forms the tube, and n is a positive odd integer. A loss layer may be disposed around the cylindrical dielectric tube to capture any lost wave energy. In one embodiment, a plurality of cylindrical dielectric tubes of different dielectric constants are coaxially arranged with the wall thickness of each of the tubes satisfying the above formula.
    Type: Grant
    Filed: July 22, 1982
    Date of Patent: April 3, 1984
    Assignee: Hitachi Cable Ltd.
    Inventors: Shigeo Nishida, Mitsunobu Miyagi, Koichi Mikoshiba
  • Patent number: 4382236
    Abstract: A new strip line cable is provided comprising a dielectric in tape form made of a porous, crystalline polymer and one or more pairs of electrical conductors, each pair of conductors having one conductor located on one side of said tape and the other conductor located on the opposite side of said tape and in substantially parallel relationship to the first conductor of the pair, the pairs of conductors being arranged in substantially parallel transverse relationship across said tape, and insulating layers made of a suitable non-porous plastic material placed over the conductors to affix them to said dielectric tape and encapsulate the cable assembly. The preferred tape dielectric is expanded, porous polytetrafluoroethylene.
    Type: Grant
    Filed: April 13, 1981
    Date of Patent: May 3, 1983
    Assignee: Junkosha Co., Ltd.
    Inventor: Hirosuke Suzuki
  • Patent number: 4379307
    Abstract: The invention includes methods and apparatus for providing relatively long conductors on integrated chips with substantially reduced RC time constants. The preferred mode utilizes a substrate having a metallization pattern wherein etching or milling into the substrate creates a cavity with a metallization conductor disposed in the mouth of the cavity, said cavity being metallized to provide the second conductor. A similar structure may be formed by utilizing orientation dependent etchant which attacks the (111) surface much quicker than the (100) surface to provide an etched V-shaped cavity wherein the first conductor is still an elongated metallization segment in the mouth of the V, and the V is metallized to provide the second conductor.
    Type: Grant
    Filed: June 16, 1980
    Date of Patent: April 5, 1983
    Assignee: Rockwell International Corporation
    Inventor: Sidney I. Soclof
  • Patent number: 4353040
    Abstract: Disclosed is a multi-layer module structure having a constant characteristic impedance. In each conductor line plane, two signal lines are arranged between a ground and a voltage supply line. This line sequence: ground/signal/signal/voltage supply line, is repeated several times in each conductor line plane. The spacing between the signal line and the adjacent ground and voltage supply line, respectively, is identical in each case. Adjacent conductor line planes, nth and (n+1)th have conductor lines arranged orthogonally. The lines of the nth and the (n+2)th plane are preferably staggered to each other such that when the nth plane is projected relative to the (n+2)th plane, the ground line of the (n+2)th plane is arranged in between the voltage supply lines (e.g. a voltage supply line and a ground line) of the nth plane.
    Type: Grant
    Filed: October 2, 1980
    Date of Patent: October 5, 1982
    Assignee: International Business Machines Corporation
    Inventors: Horst Krumm, Helmut Schettler, Rainer Stahl, Rainer Zuhlke
  • Patent number: 4301428
    Abstract: At least one conductive element combined with a magnetic absorbing mixture surrounding at least part of the conductor has a composite structure: a core is formed by a filament or fiber (rayon, nylon, glass) and a conductive coating (metal or metallic glass). There is so provided a high resistance element, with good mechanical properties and a great absorption of high frequencies.Applications: antiparasitic cables for ignition of internal combustion engines, instrumentation and low-pass cables, coaxial cables, shields and screens.
    Type: Grant
    Filed: September 26, 1979
    Date of Patent: November 17, 1981
    Inventor: Ferdy Mayer
  • Patent number: 4216449
    Abstract: A waveguide for the transmission of electromagnetic energy which has a low attenuation even with a small line cross-section realized by disposing in the interior of an electromagnetically shielded hollow cylinder, consisting of a substance having a low permittivity, a dielectric wire of a substance having a high permittivity. An E.sub.om -wave (m = 1, 2, 3 . . . , circular H field) is excited in the dielectric wire and the dimensioning of the dielectric wire is such, depending on the permittivities of the two substances and the particular operating frequency, that a TEM wave develops at least substantially in the space in the dielectric hollow cylinder. In the simplest case, the electromagnetic shield can consist of a metal tube and the dielectric hollow cylinder can consist primarily of air. Furthermore, the E.sub.om wave excited in the dielectric wire is preferably the E.sub.01 wave (TM.sub.01 mode).
    Type: Grant
    Filed: January 12, 1978
    Date of Patent: August 5, 1980
    Assignee: BBC Brown Boveri & Company Limited
    Inventor: Alfred Kach
  • Patent number: 4166259
    Abstract: A flat, high frequency cable having a number of longitudinal conductors, is provided with a transverse conductance between said longitudinal conductors. The transverse conductance is substantially smaller than the conductivity of said longitudinal conductors to provide a defined attenuation along the cable. The transverse conductance is determined by a plurality of discrete components such as resistors and capacitors electrically connected to said longitudinal conductors at spaced intervals. The present cable may comprise two or three conductors.
    Type: Grant
    Filed: November 16, 1977
    Date of Patent: August 28, 1979
    Assignee: Messerschmitt-Bolkow-Blohm GmbH
    Inventors: Walter Hermann, Burkhart Kuhl, Wolf-Dieter Schuck
  • Patent number: 4157518
    Abstract: A leaky coaxial cable is disclosed having an axial conductor, a dielectric layer coaxial along the length of the conductor and an outer conductive shield coaxial with the dielectric layer. The outer shield comprises a nonconductive elongate film carrier having a pair of spaced electrically conductive foil strips formed thereon which define a uniform width gap therebetween along the length of the film, the film being disposed about the circumference of the dielectric layer such that outer lateral edges of the foil strips overlap and the uniform width gap extends along the length of the cable. The film carrier may be applied on the dielectric layer either longitudinally thereof or by helically winding the film along the length of the dielectric layer. The cable also preferably includes at least one drain wire and an outer protective jacket.
    Type: Grant
    Filed: July 27, 1977
    Date of Patent: June 5, 1979
    Assignee: Belden Corporation
    Inventor: John W. McCarthy