Abstract: A method of simultaneously collecting exocervical and endocervical cells from a female patient, includes providing a combination exo-endocervical sampling device including a sampler having a pair of opposing wings and a prominence extending from the wings. The opposing wings include a sampling surface and the prominence includes a multiplicity of endless looped fiber pairs distributed axially along a distal end section of the prominence. Each looped fiber pair includes a first loop extending transverse from the shaft and a second loop extending transverse from the shaft. The loops define a void space therebetween configured to capture exo-endocervical cells. The method includes placing the sampling device in contact with a cervix of the female patient, collecting exocervical cells with the opposing wings of the sampling device, and simultaneously collecting endocervical cells with the prominence.

Abstract: An integrated circuit includes a die and a first magnetic field sensitive element formed on the die. The integrated circuit includes a first coil formed on the die and around the first magnetic field sensitive element.

Abstract: A system including an encoder, multiple sensing elements and control logic. The encoder has a pole pitch and is configured to rotate in a direction of rotation. The multiple sensing elements are situated along the direction of rotation and span at least half the length of the pole pitch. The control logic is configured to receive signals from the multiple sensing elements based on the encoder in a static position and obtain a switching point based on the signals.

Abstract: A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer.

Abstract: An integrated circuit includes an array of memory cells. Each memory cell includes a diode. The integrated circuit includes a doped semiconductor line formed in a semiconductor substrate. The doped semiconductor line is coupled to a row of diodes. The integrated circuit includes conductive cladding contacting the doped semiconductor line.

Abstract: A power semiconductor arrangement and method is disclosed. One embodiment provides a power semiconductor module. An insulator is arranged between the module and a cooling element, increasing clearances between the power semiconductor module and the cooling element.

Abstract: A stent combined with a positioning apparatus to effectively place the stent at a precise deployment site within a narrowed vascular region such as an artery. The stent is maneuvered through the vessel and is guided by a guiding catheter up the vessel to where the narrowing is located. Upon exiting the guiding catheter and approaching the deployment site within the coronary artery, a deployment site locator expands to contact the vascular structure and, thereby, effectively position the stent at the deployment site within the narrowed vessel. This system apparatus and method is particularly useful for stent placement at an ostium (origin) of a vessel.

Abstract: One aspect provides for the separating of two or more joined materials by heating with microwaves, thereby producing differential thermal expansion of the materials. The pieces to be treated are exposed to microwave energy, producing differing rates of heating, and therefore expansion, of the differing materials making up the treated pieces of material. The differential thermal expansion of the differing materials will cause sufficient strain to separate the differing materials. Separation can be enhanced in some cases by following microwave heating with rapid cooling of the treated material.

Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.

Abstract: A cable includes a first layer of wire helically wound to define a lumen having a lumen diameter. A second layer of wire is helically wound over the first layer. A first end segment of the second layer is configured with a plurality of strands that are fused together. A second end segment of the second layer is configured with a plurality of strands that are fused together.

Abstract: A module includes a substrate including a first copper surface and a semiconductor chip. The module includes a first sintered joint bonding the semiconductor chip directly to the first copper surface.

Abstract: A method and apparatus for embedded memory security is disclosed. One embodiment protects data in a memory block from unauthorized reading. When writing or reading data to or from the memory block an error correction code is used to calculate an ECC value, wherein the calculation of the ECC value is based on a combination of the data and a access identifier provided to the memory block prior to reading. The access identifier identifies the requesting program. A read error is signalled in case the calculated ECC value does not match a stored value thus indicating an access violation.

Abstract: A surgical cutting instrument for use with a drive motor, and related system and method, is described. The surgical cutting instrument includes an elongated drive member, a cutting tip secured to the drive member, a non-conductive coupling body adapted for connection to a motor assembly, a housing maintaining the coupling body, a fluid coupling assembly and an electrical connector for connection to a stimulating energy source. The electrical connector is in electrical communication with the cutting tip via an electrical pathway.

Abstract: An integrated circuit with stacked devices. One embodiment provides a surface of a first semiconductor structure of a first crystalline semiconductor material including first and second portions. First structures are formed on the first portions. The second portions remain uncovered. Sacrificial structures of a second, different crystalline material are formed on the second portions. A second semiconductor structure of the first crystalline semiconductor material is formed over the sacrificial structures and over the first structures.

Abstract: An implantable medical device is disclosed that includes a valve body and a valve rotor adjustable with respect to the valve body. A tool can be utilized to determine and control a position of the valve rotor with respect to the valve body. The tool can include a valve body position reader, a valve rotor position reader and a valve rotor position controller to determine a valve setting for the device and adjust the valve setting as desired.

Abstract: A manufacturing method and system are disclosed for illuminating a target. A light controller has a plurality of pixels, and light is projected from at least a first light source to the light controller, wherein the light from the first light source is incident on the light controller at a first angle. The pixels are controlled to establish illumination characteristics for first and second optical paths between the light controller and the target.

Abstract: A method of operating an integrated circuit includes applying at least one first programming pulse to a plurality of non-volatile memory cells to adjust a level of a storage parameter of each of the non-volatile memory cells, the at least one first programming pulse defined by a plurality of pulse parameters each having a fixed valued, and determining a fail count by measuring the number of non-volatile memory cells of the plurality of non-volatile memory cells having a storage parameter level exceeding a verify level. The method further includes determining a change in an programming behavior of the plurality of non-volatile memory cells based on the fail count, adjusting a value of at least one pulse parameter of at least one second programming pulse defined by the plurality of pulse parameters to a desired value based on the change in programming behavior, and applying the at least one second programming pulse to the plurality non-volatile memory cells.

Abstract: A method for driving a fluorescent lamp and lamp ballast is disclosed. In one embodiment, an excitation AC voltage having an excitation frequency is applied to the series resonant circuit using a half-bridge circuit, having an output, to which the series resonant circuit is coupled, and having a first and a second switch, which are driven in the on state and in the off state with a fundamental frequency predetermined by a frequency signal or with an increased frequency. The switches are driven with the fundamental frequency or with the increased frequency with respect to the fundamental frequency in a manner dependent on a temporal change in the resonant circuit current between two temporally spaced-apart evaluation instants lying within a switched-on duration of one of the switches.

Abstract: A power semiconductor module system. One embodiment provides a power semiconductor module and a mounting adapter. The mounting adapter and the power semiconductor module can be latched to one another in two different latching stages such that a contact element of the power semiconductor module makes electrical contact with a contact element of the mounting adapter assigned to the contact element in a second one of the latching stages but not in a first one of the latching stages.