Abstract: An integrated circuit including a first magneto-resistive sensing element, magnetic material and a spacer. The magnetic material is situated laterally to the first magneto-resistive sensing element. The spacer is situated between the first magneto-resistive sensing element and the magnetic material. The magnetic material is magnetically coupled to the first magneto-resistive sensing element.

Abstract: One embodiment of the present invention provides a ground surface location system for identifying an object and its location within a coverage area. The ground surface location system includes a location transmitter and a location identifier. The location transmitter is positioned at a location within the coverage area and has a physical location code corresponding to the location stored therein, and is configured to provide an optical signal representative of the physical location code. The location identifier is adapted to couple to the object and has an object identification code representative of the object stored therein, and is configured to receive the optical signal and to transmit an identification signal representative of the physical location code and the object identification code.

Abstract: A system for capacitive object recognition including a pair of electrodes, one of the electrodes having an adjustable parameter, and a controller modeling current pathways formed by interaction of an object with an electric field between the pair electrodes as a network of capacitors. The controller is configured to set the adjustable parameter to a first setting and to apply a set of alternating current voltages to the pair electrodes and measure a resulting first set of current values at each of the electrodes, configured to set the adjustable parameter to a second setting and apply the set of alternating current voltages to the pair of electrodes and measure a resulting second set of current values at each of the electrodes, and configured to determine values for up to all capacitors of the network of capacitors based on the first and second sets of current values.

Abstract: A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a multiplicity of information regarding the monocrystalline and surface and also rear side constitution. A multiplicity of semiconductor device positions arranged in rows and columns are provided on the top side of the semiconductor wafer, an information chip being arranged at an exposed semiconductor device position, the information chip having at least the information of the rear side identification.

Abstract: A method for performing a surgical procedure on tissue at a target site of a patient includes providing a surgical cutting instrument including an outer tube, inner wire assembly and a cutting tip. The outer tube defines a curved segment. The inner wire assembly is rotatably disposed within the outer tube. The cutting tip is connected to the inner wire assembly and positioned at a distal end of the outer tube. The tissue at the target site is exposed and the cutting tip is deployed against the tissue. The method further includes rotating the inner wire assembly relative to the outer tube at speeds in excess of 50,000 RPM such that the cutting tip removes contacted tissue.

Abstract: A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the side edges, the rear side and the top side, on which surface-mountable external contacts are arranged. One embodiment includes power semiconductor components, wherein the metallic coating connects a rear side electrode to one of the surface-mountable external contacts on the top side of a power semiconductor chip.

Abstract: The semiconductor device comprises a semiconductor chip defining a first face and a second face opposite to the first face, the semiconductor chip comprising at least one contact element on the first face of the semiconductor chip, an encapsulating body encapsulating the semiconductor chip, the encapsulating body having a first face and a second face opposite to the first face, a redistribution layer extending over the semiconductor chip and the first face of the encapsulating body and containing a metallization layer comprising contact areas connected with the contact elements of the semiconductor chip, and an array of external contact elements located on the second phase of the encapsulating body.

Abstract: A semiconductor device with a number of integrated coils is disclosed. In one embodiment, a first coil portion and a second coil portion are at least in part overlapping each other. Another embodiment provides a process for manufacturing a semiconductor device having at least the processes of generating a first coil portion, generating a second coil portion, wherein at least a part of the first coil portion and a part of the second coil portion are overlapping each other.

Abstract: A football training system which allows for the quick and easy movement of the target unit, i.e., a blocking dummy. The training system comprises one or more combinations of a base, a flexible support member mountable at one of three locations on the base, and a padded target mounted on the flexible support member.

Abstract: A microelectromechanical (MEMS) nanoindenter transducer including a body, a probe moveable relative to the body, an indenter tip coupled to an end of the moveable probe, the indenter tip moveable together with the probe, and a micromachined comb drive. The micromachined comb drive includes an electrostatic actuator capacitor comprising a plurality of comb capacitors configured to drive the probe, together with the indenter tip, along a displacement axis, including in an indentation direction, upon application of a bias voltage to the actuation capacitor.

Abstract: A rectifier circuit with a synchronously controlled semiconductor element comprising at least one field effect transistor with a control electrode and two switching electrodes. The control electrode operates the reverse state and the forward state between the switching electrodes. For this, the rectifier circuit comprises at least one driver which cooperates with a voltage sensor of the field effect transistor. During the diode operating state of the field effect transistor, the driver operates this to the forward state. The voltage sensor thereby forms at least one part of a non-linear voltage divider which comprises at least one monolithically integrated measuring capacitance.

Abstract: A system for electronic components mounted on a circuit board is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conductive material, fixing the electronic component on the printed circuit board.

Abstract: A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip attached to the carrier, the chip having a copper contact pad that faces away from the carrier, extending a copper electrical connector between the contact pins and the contact pad, and diffusion soldering the copper electrical connector to the active area with a solder material including tin to form a solder connection including a contiguous bronze coating disposed between and in direct contact with both the copper electrical connector and the contact pad.

Abstract: A financial transaction card is packaged within a carrier which contains the card and prevents access to any indicia borne on the card (e.g., magnetic stripe, barcode, and the like) prior to activation of the financial transaction account associated with the card at the point of sale. The package bears no alternative indicia correlated with those borne on the card, and thus only the indicia on the card itself may be used for account activation. Such indicia are exposed at the point of sale by opening a section of the carrier to reveal the actual indicia borne on the card itself. Thus, any breakage of the carrier or other attempts to access the card within the packaging, prior to presentation of the packaged card for activation at the point of sale, is evidence of tampering of the package. In a preferred embodiment, the package is a simple three-panel, partially perforated construction that provides substantial security for the packaged card, at minimal manufacturing cost.

Abstract: An integrated circuit device includes a substrate with a first layer situated on the substrate. The first layer defines a first opening with a cover layer deposited on the first layer and coating a sidewall portion of the first opening. A second layer is situated on the cover layer. The second layer defines a second opening extending through the second layer and through the cover layer to connect the first and second openings.

Abstract: An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged between the upper part and the lower part.

Abstract: A power semiconductor component is described. One embodiment provides a semiconductor body having an inner zone and an edge zone. A base zone of a first conduction type is provided. The base zone is arranged in the at least one inner zone and the at least one edge zone. An emitter zone of a second conduction type is provided. The emitter zone is arranged adjacent to the base zone in a vertical direction of the semiconductor body. A field stop zone of the first conduction type is provided. The field stop zone is arranged in the base zone and has a first field stop zone section having a first dopant dose in the edge zone and a second field stop zone section having a second dopant dose in the inner zone. The first dopant dose is higher than the second dopant dose.