Abstract: A semiconductor memory device allows a read command to be inputted thereto after a passage of a relatively short time period from a point in time where a write command has been inputted thereto. A method of operating the semiconductor memory device includes inputting a write command, inputting a read command in a preset period of time after the write command has been inputted, loading read data of a memory cell onto a data bus in response to the read command; and loading write data from outside of the semiconductor memory device onto the data bus in response to the write command.

Abstract: A method for forming a fine pattern in a semiconductor device using a quadruple patterning includes forming a first partition layer over a first material layer which is formed over a substrate, performing a photo etch process on the first partition layer to form a first partition pattern, performing an oxidation process to form a first spacer sacrificial layer over a surface of the first partition pattern, forming a second spacer sacrificial layer over the substrate structure, forming a second partition layer filling gaps between the first partition pattern, removing the second spacer sacrificial layer, performing an oxidation process to form a third spacer sacrificial layer over a surface of the second partition layer and define a second partition pattern, forming a third partition pattern filling gaps between the first partition pattern and the second partition pattern, and removing the first and third spacer sacrificial layers.

Abstract: A method for forming an isolation layer of a semiconductor device includes forming a trench in a substrate, forming a high-density plasma (HDP) oxide layer filling a portion of the trench, forming a spin-on-dielectric (SOD) oxide layer having a certain height over the HDP oxide layer, performing a thermal treatment, and forming an enhanced high-aspect-ratio process (eHARP) oxide layer filling another portion of the trench over the SOD oxide layer.

Abstract: A phase locked loop includes a phase lock unit configured to compare a phase of a reference clock with a phase of a feedback clock and to generate an internal clock based on the comparison; a delay lock unit configured to compare the reference clock with the internal clock, and to generate the feedback clock which is delayed in response to a control voltage based on the comparison; and a start voltage enable unit configured to receive an enable signal and to apply a start voltage as the control voltage in response to the enable signal.

Abstract: In an erase method of a flash device, including a page buffer configured to transfer a virtual voltage in response to a discharge signal and further comprising strings each including memory cells and coupled to the page buffer via a respective bit line, applying a ground voltage to a gate of each of the memory cells and erasing the memory cells coupled to a selected bit line by supplying the virtual voltage wherein the virtual voltage is applied to the selected bit line and a unselected bit line.

Abstract: A semiconductor integrated circuit includes a semiconductor chip. The semiconductor chip includes a well arranged to receive a first well bias voltage from a well biasing region, a through-chip-via arranged to penetrate the well, and a guard region disposed around the through-chip-via with space in-between and arranged to apply a second well bias voltage to the well.

Abstract: A semiconductor memory device includes: a first bank and a second bank; one or more first data input/output pads disposed at one side of the first bank and used in access to data of the first bank; one or more second data input/output pads disposed at one side of the second bank and used in access to data of the second bank; a first cyclic redundancy code (CRC) generation circuit for generating a first CRC using a plurality of data output from the first bank and outputting the generated first CRC through the first data input/output pads; and a second CRC generation circuit for generating a second CRC using a plurality of data output from the second bank and outputting the generated second CRC through the second data input/output pads.

Abstract: An electrostatic discharge protection device includes a substrate where an active region is defined by an isolation layer, a gate electrode simultaneously crossing both the isolation layer and the active region, and a junction region formed in the active region at both sides of the gate electrode and separated from the isolation layer by a certain distance in a direction where the gate electrode is extended. The electrostatic discharge protection device is able to prevent the increase of a leakage current while securing an electrostatic discharge protection property that a semiconductor device requires.

Abstract: A semiconductor memory device is capable of performing a stable high-speed operation while inputting/outputting data. The semiconductor memory device includes an inversion output circuit configured to output a clocking pattern in a clocking mode, and an inversion pin to which the inversion output circuit is connected.

Abstract: A page buffer of a nonvolatile memory device according to the present disclosure comprises a first data latch unit configured to store data for program or program inhibition, a second data latch unit configured to store data for setting threshold voltage states of cells to be programmed, and a 1-bit pass determination unit configured to determine whether a cell to be programmed has been programmed to exceed a verification voltage by grounding or making floating a first verification signal output terminal in response to data set to a first node of the first data latch unit and data applied to a sense node.

Abstract: A semiconductor device includes: a semiconductor substrate configured to include a plurality of trenches therein; a plurality of buried bit lines each configured to fill a portion of each trench; a plurality of active pillars each formed in an upper portion of each buried bit line; a plurality of vertical gates each configured to surround each active pillar; and a plurality of word lines configured to couple neighboring vertical gates with each other.

Abstract: A Code Address Memory (CAM) cell read control circuit of a semiconductor memory device includes a CAM cell read circuit configured to read data stored in a CAM cell and to output the read data, an internal delay circuit configured to delay an externally input reset signal and to generate a number of internal command signals, and a signal generation unit configured to generate an internal ready/busy signal in response to the internal command signals. The internal ready/busy signal is generated after the externally input reset signal has reset the CAM cell read circuit.

Abstract: A semiconductor device is protected from static electricity introduced through bump pads and probe test pads. The semiconductor device includes a bump pad through which data is inputted, a first electrostatic discharge unit configured to discharge static electricity introduced through the bump pad, a probe test pad through which data is inputted, the probe test pad having a larger size than the bump pad, a second electrostatic discharge unit configured to discharge static electricity introduced through the probe test pad, and an input buffer unit configured to buffer the data transferred through the bump pad or the probe test pad.

Abstract: A semiconductor memory device includes a reference voltage generator for generating a plurality of reference voltages each having different voltage levels in response to a self refresh enable control signal, and a voltage comparator for generating a result signal that controls a self refresh operation cycle by comparing each of the plurality of reference voltages with a temperature information voltage that represents an internal temperature of an integrated circuit.

Abstract: A semiconductor memory device includes an open-loop-type delay locked loop (DLL) configured to generate a clock signal locked by reflecting a first delay amount which actually occurs in a data path and a second delay amount which is required for locking the clock signal, a latency control unit configured to shift an inputted command according to a latency code value corresponding to the first delay amount and latency information, and output the shifted command, and an additional delay line configured to delay the shifted command according to a delay code value corresponding to the second delay amount, and output the command of which operation timing is controlled.

Abstract: A method of programming a nonvolatile memory device comprises a bit line voltage set-up step of receiving a program command and data to be programmed and setting up a voltage of a selected bit line according to a state of program data; a program step of supplying a program voltage to a word line selected for a program in response to a control signal for setting up the program voltage, supplying a first pass voltage to unselected word lines, and then performing the program; and a program verification step of, in response to a control signal which is subsequent to the control signal for setting up the program voltage and is used to set a verification voltage, performing a program verification operation by supplying the verification voltage to the selected word line.

Abstract: A multi-bit test control circuit includes an operation unit, a delay unit, and a generation unit. The operation unit is configured to combine a single source signal inputted to each bank with a delay signal generated by delaying the source signal by a certain time to generate a first pulse signal. The delay unit is configured to delay the first pulse signal by a certain time. The generation unit is configured to combine an output signal of the operation unit with an output signal of the delay unit to generate a second pulse signal for a bank interleaving multi-bit test.

Abstract: A semiconductor device includes a substrate with a recess pattern, a gate electrode filling the recess pattern, a threshold voltage adjusting layer formed in the substrate under the recess pattern, a source/drain region formed in the substrate on both sides of the gate electrode and a gate insulation layer, with the recess pattern being disposed between the gate electrode and the substrate, wherein the thickness of the gate insulation layer formed in a region adjacent to the source/drain region is greater than the thickness of the gate insulation layer formed in a region adjacent to the threshold voltage adjusting layer.

Abstract: A doping method for a semiconductor device includes forming a trench in a semiconductor substrate, forming a doped layer doped with a dopant over the undoped layer, and forming a doped region into which the dopant is diffused, wherein the doped region is a portion of the semiconductor substrate in contact with the doped layer.

Abstract: A nonvolatile memory device includes a high voltage generation unit configured to generate a program voltage and a pass voltage, a block selection unit coupled to the high voltage generation unit through global word lines, a memory cell array coupled to the block selection unit through word lines, a discharge unit coupled to the global word lines and configured to change a level of voltage supplied to the global word lines, and a discharge control unit configured to generate a discharge signal, and transfer the discharge signal to the discharge unit in response to the program voltage.