Abstract: A variable value monitoring system and method acquires and displays data information words having addresses within a certain range. In one mode of operation, data information words having addresses within a predetermined range are selected and stored in a shadow RAM and only changes in that data are presented to a viewer. The viewer can select the display format for a panel of data contained within the predetermined range of addresses. A FIFO memory temporarily stores the variable values of selected data information words. A flag memory stores flag bits at internal addresses corresponding to each address in a predetermined block of external addresses. Status bit are provided for each data word addressed by the predetermined block of addresses and means are provided for logically comparing the flag bits with corresponding status bits and for storing a data information word in the FIFO if the logical comparison is true.

Abstract: Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for securing the bonding wires in position to prevent wire-wash and electrically shorting of the bonding wires when a plastic molding compound is formed around the die and leadframe. Alternatively the bonding wires are contained within notches formed in the distal end of the support ring. A lid placed over the support ring provides an enclosure for the integrated-circuit die. Stacking of support rings on each other and concentric support rings provide various optional arrangements for supporting bonding wires.

Abstract: A differential input circuit has two halves, each half includes a differential input voltage terminal with a first emitter follower having its base terminal connected to the input terminal, having a collector terminal connected to a first voltage terminal, an emitter terminal connected to a first terminal of an emitter resistor. A second emitter follower is provided having has its base terminal connected to the first differential input terminal, having a collector terminal connected to the first voltage terminal, and having an emitter terminal. A diode-connected transistor is provided having an emitter terminal connected to the emitter terminal of the second emitter follower, having its base and collector terminals connected together. A current source is provided having an output terminal connected to the base and collector terminals of the first diode-connected transistor, and having an input terminal connected to a second voltage terminal.

Abstract: A package assembly for an integrated circuit die includes a base having a cavity formed therein for receiving an integrated circuit die. The base has a ground-reference conductor. A number of bonding wires are each connected between respective die-bonding pads on the integrated circuit die and corresponding bonding pads formed on the base. The lid has an electrically conductive layer formed on it to cover the integrated circuit die in the cavity formed in the base. The electrically conductive layer formed on the lid is positioned in close proximity to some of the plurality of bonding wires. The electrically conductive layer formed on the lid is connected to the ground-reference conductor of the base. This arrangement reduces both the self-inductances of the one or more conductors and the mutual inductance between the one or more conductors. With this arrangement the electrically conductive layer formed on the lid is grounded to reduce interference being radiated from the electrically conductive layer.

Abstract: Method and apparatus for improving the cooling of a molded package assembly for one or more integrated-circuit dies, each of which is attached to a die-attach paddle portion of a lead frame. The improved package includes a molded-plastic package body which is formed around the lead frame and the attached integrated-circuit die. The package body has one or more through-holes formed through it for passage of air, where the air currents are drawn by convection or forced through the through-hole for cooling the integrated-circuit die attached the die-attach paddle. The die-attach paddle has a corresponding hole formed in it and the through-hole formed in the package body is located adjacent to the hole in the die-attach paddle to form a through-channel through the lead frame and the molded plastic body for convection cooling. The die-attach paddle is covered with molded plastic material so that the die-attach paddle is not exposed in the through-channel.

Abstract: A package design configuration for an integrated-circuit die includes a leadframe having its bonding fingers connected to the periphery of an electrically-insulated, heat-conductive substrate, formed, for example, of a ceramic material. A number of electrically conductive traces, or bonding islands, serve as intermediate bonding locations for shorter bonding wires connecting bonding pads on the integrated-circuit die to the bonding fingers of the leadframe. The conductive traces serving as bonding islands are formed by deposition of thin-film material using semiconductor fabrication techniques or by deposition of thick-film material using printing techniques. Various shapes and configurations of the conductive traces are available, such as elongated rectangular patterns, or zigzag patterns. Alternatively, the electrically-insulated, heat-conductive ceramic substrate is attached to the die-attach pad of a conventional leadframe.

Abstract: An improved golf simulation system for two players is contained in a single booth, which has a single screen on which are projected various views of simulated golf holes and into which two golfers independently but concurrently hit golf balls from within the single booth, a dual-player golf simulator system. Each player uses a portion of a golf tee area. Ball flight sensors sense the flight of the two independently, concurrently hit golf balls. A computer concurrently computes the flight and landing location of the first golf ball on the simulated hole and the flight and landing location of the second golf ball on the simulated hole as a function of the sensed velocity, trajectory, and spin of each of the respective golf balls. The simulated golf hole can be viewed as a single view of as a split view when each player has a different viewing location.

Abstract: An encapsulated electrically and thermally enhanced integrated circuit is disclosed. An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate. A lead frame having inwardly-extending bonding fingers has the bottom sides thereof attached to the top of the substrate. A contiguous layer of insulating material is bonded to the top sides of the bonding fingers, such that the layer of insulating material peripherally surrounds the integrated-circuit die. A conductive layer of material is then bonded to the top of the insulating layer. A second layer of insulating material followed by a second conductive layer may be bonded on top of the first conductive layer. Electrical connections are made from the integrated-circuit die to the conductive layers surrounding the die. The device is then encapsulated in a plastic material.

Abstract: A storable cover for covering the cabin portion of a variety of vehicles, such as sedans, vans, and hatchbacks, carries storage means secured thereto to be disposed in a suitable compartment of the vehicle. The trailing edge of the cover is anchored inside the vehicle when the cover is disposed onto the vehicle. The storage means is affixed firmly inside the trunk or other rear compartment of the various vehicles, such as for example, sedans, hatchbacks, and vans so as to locate part of the over assembly within a locked compartment. The cover is deployed by being taken out of the storage means and fed from the trunk through the opening which is created between the raised closure member for the compartment and the body of the vehicle.

Abstract: A corrector ring maintains the coplanarity of the tips of the leads of a quad flat pack QFP package during shipping and handling. A first snap-fit or adhesively-fixed ring member has an inner peripheral surface which engages the lower walls of the QFP package. The ring member also has an outer peripheral surface which engages the inner surfaces of the resilient leads of the QFP package. A second snap-fit adhesively-fixed ring member is held in place over the outer surfaces of the leads.

Abstract: A TAB carrier is loaded into the bottom position of a bottom-loading stacking magazine using a slider which conveys the TAB carrier from a first loading position to a second unloading position located beneath the stacking magazine. The slider has a first horizontal surface on which a TAB carrier is initially placed and a second horizontal surface which is elevated above the first horizontal surface. A ramp surface connects the two horizontal surfaces. A retractable knife blade engages the TAB carrier and permits the TAB carrier to be carried by the slider only from the first position to the second position and prevents the TAB carrier from being carried by the slider from the second position back to the first position.

Abstract: A sputter target assembly includes a main target plate formed of a refractory material, such as Ti/W, which provides a target surface which is bombarded by ions and from which is ejected refractory material for thin-film deposition. A removable center piece is formed of a refractory material and fits within a recess formed in the center region of the main target plate to provide a surface which is substantially coplanar with the target surface of the main target. The removable center piece is attached to the main target plate with a screw formed of a refractory material. The main target plate is bonded to a backing plate for cooling.

Abstract: A heat-sink cooling apparatus and a method for attaching a heatsink to a ceramic integrated-circuit package are provided. An externally-threaded molybdenum stud is attached to and extends from a copper/tungsten slug, or attachment plate, which is brazed to the ceramic integrated-circuit package. The stud and the slug have similar thermal coefficients of expansion to reduce thermal stress at the interface therebetween. An aluminum heatsink has an internally threaded hole formed therein for receiving the externally-threaded molybdenum stud. The external threads of the harder molybdenum material engage and deform the threads formed in the aluminum heatsink to provide strong mechanical and thermal bonding between the stud and the heatsink.

Abstract: A technique for measuring golf swing tempo or clubhead speed for a golfer swinging a golf club through a tee area. Two parallel infrared (IR) transmitters transmit respective IR beams along predetermined lines toward the tee area. Respective IR sensors receive respective IR beams reflected from a reflector mounted to the shaft of the golf club, near the clubhead. Each IR sensors provides a respective output signal indicative of the passage of the golf club through a corresponding IR beam. Predetermined sequences of output signals from the IR sensors are detected and the differences in time between various output signals are measured to provide tempo and clubhead speed values for display on a LCD screen. The speed values can be compensated values as obtained from look-up tables.

Abstract: An improved shielding assembly is provided for a sputter source which has an anode and cathode target-ring assembly mounted to a cylindrical mounting structure. A cooling assembly for the anode and cathode target-ring assembly is mounted to the distal end of the cylindrical mounting structure. A baffle shield member has an outer flat ring-shaped mounting base-portion which overlies the cooling assembly and from which a baffle portion inwardly extends toward the anode and cathode target-ring assembly. A shield member comprises an annular ring base portion, which is mounted over the outer flat ring-shaped mounting base-portion of the baffle shield member and from which an inner lip portion extends inwardly. The inner lip portion has a rounded contour to provide a smooth base for deposition of a smooth layer of sputtered material on said lip portion.

Abstract: A technique for providing electrostatic discharge (ESD) protection for an open-drain CMOS I/O buffer circuit. having an output terminal. An NMOS enhancement-mode transistor has its drain connected to the VDD power bus for the buffer circuit, its source connected to the output terminal, and its gate connected to a noise-free internal VSS power bus (VSSI). The bulk region is connected to the VSS power bus (VSSE) for the I/O buffer circuit. ESD protection is provided by a parasitic lateral npn bipolar transistor that is inherent to the NMOS transistor. The parasitic lateral npn bipolar transistor has an emitter formed from the drain-to-bulk junction of the NMOS transistor, a collector formed from the source-to-bulk junction of the NMOS transistor, and a base formed in the bulk region.

Abstract: A golf simulator includes a screen for displaying a simulated golf hole. Sensors measure one or more parameters of a hit golf ball hit with a golf club by a player. These parameters may include the velocity, trajectory, and spin of a golf ball. A computer determines the distance and location of the hit golf ball from the simulated hole as a function of the measured parameters. The computer enhances a player's shot by a predetermined enhancement factor. In a preferred embodiment the calculated forward velocity of a hit ball is increased with the enhancement factor to obtain an enhanced forward velocity. The enhancement factor can be a predetermined percentage ranging between 0 and 200 percent. The enhancement factor can be automatically phased out, attenuated, or cancelled as the player approaches the simulated hole. The display screen displays the enhancement factor of a player.

Abstract: An energy-efficient barrier uses thin slats, on one side of which are formed a number of reflective surfaces. The reflective surfaces are oriented at an angle, with respect to the face of the slat, to maximize reflection of the rays of the sun. The parallel reflective surfaces are formed as a series of ridges along the length of a slat and as the treads of a series of stairsteps formed along the length of a slat. The slats can be formed of extruded material with the reflective surfaces formed of reflective material which is polated on V-grooves formed in the slats. The slats are oriented in relation to the direct rays of the sun to pass the direct rays of the winter sun between the wider faces of the slats. The reflective surfaces on each slat are also aligned to reflect the direct rays of the summer sun.

Abstract: A two-link, trip-free operating mechanism assembly for a switch includes a first pivotally-mounted link comprising a switch lever arm. One end of the switch lever arm is coupled to the switch and a second end of the switch lever arm has a roller mounted thereto. A second link assembly includes a pivotable support member to which a cam member is mounted for rotation. The pivotable support member is selectively fixed during the closing of the contacts, or movable between a contact-closed position and an overriding open position. The cam member controls the state of the switch. In the tripped condition, the cam member and the roller are disengaged and the switch assumes a tripped, or open, state. A first spring arrangement applies a force to the link arrangement to cause the links to close from an open position. For trip-free operation, a second set of springs forces the switch arm link to immediately move to a switch-open position.

Abstract: A priority encoder for receiving input request signals at a number of input request terminals and for providing an N-bit output binary code word indicating the binary identification number of the highest-priority, currently-active input request terminal. Each output bit of the output binary code word is provided from a respective logic circuit. Whenever any one of a first group of input request terminals, which are identified as having a logical TRUE value in a particular bit position of the N-bit output binary code word, is active, all of a second group of input request terminals, having a logical FALSE value for the particular bit position, are disabled. Sequential operation of the logic circuits for each output bit is obtained by successively delaying enablement of a logic circuit until high-order logic circuits have completed operation.