Abstract: To provide a microcontroller having a function for stopping supply of a clock signal to a slave block and a function for properly stopping the access to a slave block to which supply of a clock signal is stopped. A microcontroller of the present invention has a master block 101 for controlling the whole microcontroller, slave blocks 102 and 103 to be controlled by the master block 101, clock-signal control means 106 and 107 for controlling supply/stop of a clock signal in response to a clock control signal output from the master block 101, and a default slave block 104 for outputting a response signal RESP instead of a slave block to which supply of a clock signal is stopped.

Abstract: An acceleration sensor capable of standing a great acceleration is to be provided. It is configured of a mounting board and a sensor chip in which the sensor chip is formed of a weight, a beam and a frame. Then, the weight is surrounded by the frame. The weight is joined to the frame by a plurality of the beams, and the weight is separated from the board by being supported by the beams. Additionally, a thin, rectangular stopper is disposed on the mounting board right under the weight.

Abstract: Disclosed herein is a receiving circuit comprising demodulator 101 which pulls in the phase of each of burst signals respectively having preambles 701 and 711 each storing phase information or data therein, synchronous pattern parts 702 and 712 each storing synchronous information therein, and data parts 703 and 713 each storing the data therein, and outputs data obtained by demodulating the burst signal, a controller 110 which performs counting based on the demodulated data to output a timing signal, and a storage unit 102 which stores or outputs the demodulated data, based on the timing signal.

Abstract: A card for testing functions of the card interface of an electronic device is provided. The testing card includes a converting circuit, a latch circuit, a data processor, a signal generator, an oscillation combination circuit, and a reset circuit is provided. The converting circuit is coupled to the card interface. The latch circuit receives the data signal fed in from the card interface, latches the data signal and outputs it to the data processor afterwards. Having received the signal sent from the converting circuit and the latch circuit, the data processor is able to proceed with testing. The signal generator can output the mode selection signal and the interrupt signal to the card interface to test the functions of mode selection and interrupt signals. Furthermore, the oscillation combination circuit can generate a wait signal and feed the wait signal to the card interface for the wait test.

Abstract: A facsimile communication system is provided which is capable of sending out picture data from a gateway device on a receiver side to a facsimile device on the receiver side even in the development of delays in communications caused by fluctuations in a communication network and of avoiding a forced breakdown of the facsimile communication occurring based on a judgement by the facsimile communication system that a communication failure has occurred due to the delays in communications. In the facsimile communication system, the gateway device on the receiver side, after receiving a digital instruction (DCS) signal from the gateway device on a sender side, without waiting for the receipt of a receiving preparation confirmation (CFR) signal to be fed from a facsimile device on the receiver side, returns, for itself, the CFR signal to the gateway device on the sender side and then starts to receive picture data from the gateway device on the receiver side.

Abstract: A carton which may be ideally used as a gift box comprises a folded carton contained within the lid which ultimately closes the carton. The carton is formed from a blank having four panels which form the sides of the carton. Four end panels connected to the side panels may be folded together to form a bottom for the carton when in its assembled condition. The entire carton blank is folded to fit inside the lid. A transparent wrap, preferably a shrink wrap encloses the carton and any other wrapping paraphernalia within the lid.

Abstract: A dynamic power equalizer comprises an array waveguide grating having an input waveguide and an output waveguide at one end, and an input waveguide group and an output waveguide group at the other end. The double loops are composed of the input waveguide and the output waveguide group, and the input waveguide group and the output waveguide are used to process the input optical signal components having different powers into the output optical signal having a single and equalized optical power through wavelength-division de-multiplexing and wavelength-division multiplexing, thus achieving dynamic optical power equalization.

Abstract: An imaging system switching device is described. The imaging system switching device is used for multi-function office machines, which has a scanner and a printer and additionally a copy machine and a fax machine. The imaging system switching device has a roller, a lens, a reflector, an optical receiver, an optical transmitter, and an optical switch. The optical switch changes light streams transmitting route for different function so as to use the same transmitting elements for a scan function and a print function. Another aspect of the imaging system switching device further has an original roller so that the switching device of the imaging system can simultaneously scan and print.

Abstract: A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A substrate 1 has formed therein through-holes 7 lined on the internal walls with a wiring layer 9, and solder balls 6 are fusion-bonded to the substrate 1 in such a manner as to cover the through-holes 7. In the mounting process or in the repair process, heating probes 41 are passed through the through-holes 7 and thrust into the solder balls 6 to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls 6 can be heated, thereby averting adverse effects on the IC chip 3. In the repair process, the solder balls 6 can be restored to an initial condition free of intermetallic compounds.

Abstract: A semiconductor waveguide device includes a lower clad layer, an upper clad layer, an optical waveguide layer interposed between the lower clad layer and the upper clad layer, and a lower electrode and an upper electrode for applying a voltage to a laminated structure including the lower clad layer, the optical waveguide layer, and the upper clad layer. Light is made incident from an end face of the optical waveguide layer. The upper clad layer includes a stripe-like width-narrowed portion, and a width-broadened portion formed at a position closer to a light-incident end face than the width-narrowed portion and having a width wider than the width-narrowed portion.

Abstract: The present invention proposes an apparatus for loading and unloading wafers to and from the semiconductor fabrication equipment. The present invention uses two U-shaped port plate supporters of high rigidity to respectively join with drive devices such as lead screws, shaft bearings, and a lead device, and then join with components such as a port plate, a port door, and a base. The assembly is driven by a motor via timing pulleys, timing belts, idle wheels, a pair of lead screws, shaft bearings, and a lead device. An encoder is matched for feedback control. Thereby, accurate positioning of the main mechanism of the wafer pod responsible for upward and downward movement can be achieved so as to increase the accuracy and reliability of positioning transfer of wafers. Secondarily, the contamination of particles resulted from the motion of the main mechanism can be reduced by using an intake filtering system.

Abstract: A bill acceptor is constructed to include a housing, the housing having a base for holding a banknote for examination, a first light emitter adapted to emit infrared light onto the banknote carried on the base of the housing for examination, a second light emitter adapted to emit ultraviolet light onto the banknote for visual examination, an image sensor adapted to pick up infrared light reflected from the banknote carried on the base of the housing and to convert received light signal into image signal, and a display adapted to display image signal obtained from the image sensor for verifying the authenticity of the banknote.

Abstract: In an exemplary aspect of the invention, a method for displaying a computer program organization on a screen monitor provides a graphical representation of a source code structure during a debugging session. The graphical representation may include a program call graph (PCG) or portion thereof for a procedure within the source code. The PCG may comprise a P_node to symbolize a procedure and an association reference to identify the relationship between two such procedures. Alternatively, the graphical representation may include a control flow graph (CFG) or portion thereof associated with a procedure within the source code. The procedure may comprise of one or more basic blocks, each basic block associated with a potentially executable source code statement. The CFG may comprise a B_node symbolizing a first basic block and an association reference to identify the relationship between two such basic blocks.

Abstract: A velocity-pressure switching and pressure holding device and system for electrically-operated injection molding machines. The switching between closed-loop position control and closed-loop pressure control of a servo motor of an injection molding machine is quickly and smoothly achieved by a switchable loop switch to ensure the optimal control of the velocity-pressure switching during injection filling and pressure holding. Furthermore an adjustable observation value and a speed reducing set up for the injection axle before switching are provided to allow users to perform minor adjustments on the velocity-pressure switching during the slow down of the injection axle. The present invention easily and precisely achieves the optimal velocity-pressure switching parameters to facilitate better pressure holding ability to increase the quality of the plastic products.

Abstract: A method of manufacturing a semiconductor device includes preparing a semiconductor wafer including a first main surface having a semiconductor device forming region and a peripheral region, and a second main surface; preparing first and second dies defining a cavity; holding the semiconductor wafer by the first die so that the first main surface is exposed; placing a film member on the second die; supplying a predetermined amount of resin to a predetermined region on a resin layout region of the film member; heating the first die and the second die; bringing the first die and the second die into contact with each other through the film member to form the cavity, thereby the first main surface and the resin are placed in the cavity; and pressure-reducing the interior of the cavity and reducing the capacity of the cavity to cause the molten resin obtained by melting the resin to contact the first main surface, thereby forming an encapsulating portion on the first main surface.

Abstract: A uniform pressing apparatus used in nanoimprint lithographic process is proposed, including a housing having a first flange; a first carrier unit for carrying an imprint mold and having at least one second flange freely attaches to the first flange; a second carrier unit for carrying a substrate; at least one uniform pressing unit mounted on a imprint force transmission path; and a power source driving at least one of the housing and the second carrier unit to allow a contact to be formed between the mold and the moldable layer. Therefore, the nanoimprint lithographic process is achieved with good parallelism between the substrate and the mold and with uniform pressure distribution.