Abstract: A cooling fin assembly for mounting on a semiconductor package that includes a plurality of pins adapted to be affixed to a surface on the package, and a cooling fin means having a thin walled cellular configuration with the cells defining elongated openings in side-by-side relation that extend through the fin means, the pins being seated in the cells of the fin means.

Abstract: Two electrical components 1 and 2 containing electric conductor lines 3 and 4 are interconnected in that one component 2 comprises silicon contact fingers 5 and a back part 6 made of silicon and carrying the fingers 5. Fingers 5 and back part 6 preferably represent an integer component of an integrated circuit provided on a monocrystalline substrate and to be connected to other electrical components. Fingers 5 and back part 6 are preferably made in accordance with micromechanical silicon semiconductor technology.

Abstract: A process for forming a high density solder pad and fan-out metallurgy system in a ceramic substrate wherein a pattern of indented lines is formed in the surface of a green ceramic substrate, the lines filled with a conductive metal paste, a layer of dielectric green ceramic material deposited over at least a portion of the area of the pattern of indented lines, and sintering the resultant substrate.

Abstract: A method of forming a brazed joint between conformal surfaces byproviding a Sn gettering metal layer on at least one of the conformal surfaces,placing a mass of a low melting Au Sn alloy between the conformal surfaces,heating the resultant assembly to a temperature in excess of the melting point of the alloy,simultaneously with heating applying a pressure to force the surfaces together to squeeze the major portion of the molten Au-Sn alloy from between the surfaces, and cooling the assembly,the bond between the surfaces formed of a relatively thin higher melting Au-Sn alloy resulting when the major portion of the alloy is removed allowing the remaining Sn to combine with the Sn gettering layer to reduce the relative amount of Sn in the alloy.

Abstract: A re-work method for removing extraneous plated metal layer areas from the surface of a ceramic substrate containing refractory metal areas wherein the substrate is heated at a temperature for a time sufficient to strengthen the bond between the plated metal layer and the refractory metal areas while simultaneously reducing the strength of the bond between the extraneous plated metal layer overlying the ceramic and the ceramic, immersing the substrate in a liquid, and applying localized ultrasonic energy in close proximity to the extraneous metal areas to be removed.

Abstract: The dilution refrigerator operates by sucking a .sup.4 He-rich mixture from a tank and returning it to the tank through a superleak. Thereby the .sup.3 He is separated and returned to the .sup.3 He-rich content of the tank. By this cycling process, a drop in temperature is obtained at the exit of the superleak and through re-mixing of the .sup.3 He with the .sup.4 He. Cycling of the liquid .sup.3 He-.sup.4 He mixture is performed by a bellows pump maintained in a container 16 at a temperature below 2.degree. K. and by specially designed valves comprising a steel ball as a plug and a gold ring as the valve seat.

Abstract: A flexible, extensible thermal conduction element for use in a semiconductor package to conduct heat from a device to a cold plate, or cover, featuring a plurality of thin flexible interleaved leaf elements capable of bridging the gap between the device and cold plate, or cover, and accommodating for gap variability and non-parallel surfaces.

Abstract: A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.

Abstract: A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cover positioned in close proximity to the bridge element has an axially compressible spring member with a bulged central portion, a first flat plate member adapted to be placed in contact with the device, a second flat plate member adapted to be disposed in contact with the cold plate or cover, and a means to maintain the spring member, the first plate member and the second plate member in operative engagement.

Abstract: This method of bonding the heads of connecting pins previously inserted in a ceramic substrate to the eyelets of conductors formed on the top surface of said substrate comprises the steps of: applying a droplet of flux to the head of each pin; applying a solder ball to the head of each pin where it is held in position because of the adhesive capacity of the flux; heating in a furnace containing a nitrogen atmosphere and having a peak temperature of 350.degree. C. to cause a solder reflow; and allowing to cool to enable the solder to set and to provide a permanent electrical and mechanical bond between the head of the pins and the eyelets. This method is suitable for use in manufacturing electronic modules employed in computers.

Abstract: An improved conduction cooling system for a semiconductor package that includes a slidable conduction cooling piston in contact with a device and mounted in a cap or cold plate, a means for urging the piston longitudinally and laterally into contact with the device and the cap or cold plate, respectively, and a means to prevent rotation of the piston.

Abstract: A process for cleaning both polar and non-polar residue material from screening masks, wherein the mask is contacted with a liquid solvent that at least includes a solvent selected from the group consisting of N-Cyclohexyl-2-Pyrrolidone, N-Isopropyl-2-Pyrrolidone, Ethyl Hexyl Acetate, Dibutyl Cartitol and MAGIE OIL #543.

Abstract: A transistor structure is provided with an emitter which is formed from non-monocrystalline silicon which is caused to be converted to monocrystalline silicon during the manufacture of the transistor. In the process of manufacturing the present semiconductor structure, a subcollector is formed in a semiconductor substrate. The subcollector dopant out diffuses into a subsequently deposited epitaxial layer. A base region is formed in the epitaxial layer of a conductivity type opposite that of the conductivity type of the subcollector. This results in a PN junction between the base region and the out diffused subcollector impurities forming the collector of the transistor.A layer of non-monocrystalline silicon is deposited on the epitaxial layer. At least a portion of the non-monocrystalline silicon forms a precursor for an emitter region which is contiguous to but vertically displaced from the surface of the base region.

Abstract: Briefly, the apparatus in accordance with this invention features an energy coaxial feedthrough fix-mounted in the wall of the vacuum chamber for supplying electrical and mechanical energy from sources located externally of the vacuum chamber to within the vacuum chamber. Additionally, the apparatus includes a movable coaxial coupler capable of releasably engaging the coaxial feedthrough and additionally releasably latching a substrate holder. Finally, the apparatus includes a linkage assembly located within the chamber connected to the coupler so that the coupler may be located in a first position proximate an access port in the chamber wall to facilitate quick and convenient loading of a substrate holder and a second position in which the coupler may be connected to the feedthrough for uniformly transmitting electrical and mechanical energy to the substrate holder and the substrates thereon.

Abstract: A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cap located in close proximity to the device having a first plate to be placed in contact with a semiconductor device surface, a first spiral strip of heat conductive material joined to the first plate, a second plate to be placed in contact with a heat sink surface or cap spaced from the device surface, and a second spiral strip of thin heat conductive material interleaved with the first spiral strip and in partially overlapping telescoping relation, the second spiral strip joined to the second plate, and a means to bias the first and second plate outwardly relative to each other.

Abstract: An apparatus for removing solder bonded devices from a substrate which includes a hollow housing element having an open end with a seating portion adapted to engage the flat backside of a semiconductor device, an inlet for admitting heated gases to the interior of the housing, and an outlet for the heated gases, a baffle within the housing having an end portion recessed from the seating portion of the housing wherein the baffle directs heated gas downwardly against the backside of the device when in engagement with the seating portion of the housing, and a clamping means to secure a semiconductor device in seated relation on the seating portion.A rework method for removing a solder bonded semiconductor device from a ceramic substrate leaving only a coating of solder on the pad site sufficient to solder bond another device without the need for additional pad site preparation which includes the steps of preheating the substrate and solder bonded devices to a temperature not greater than 100.degree. C.

Abstract: An improved electronic package having a support substrate, at least one electronic device mounted on the substrate, a cover mounted on the substrate disposed over said device and having a surface in spaced proximity to the device, the improvement being:a thermal bridge for conducting heat from the device to the cover which includes a relatively thick metal sheet provided with cuts that define at least one tab element,grooves in the tab element that make it bendable,and a spring means to selectively urge the tab element into contact with the device.

Abstract: An improved interposer punch apparatus including a plurality of elongated punch elements, a head slidably supporting the punch elements, means to urge the punch elements in an extended position, a stripper plate, and a base for supporting a substrate to be punched with apertures for receiving the lower ends of the punch elements, the imrovement being a means in said base for forcibly displacing slugs of material punched from a substrate from the ends of the punch elements following a punching operation.

Abstract: An electrical probe assembly with rotatable probe elements for establishing electrical contact to pad surfaces having a plurality of elongated probe elements formed of a conductive flexible material, each having a length many times its diameter, spaced upper and lower flat support elements having apertures receiving the ends of the probe elements and maintaining the probe elements in a generally parallel arrangement with at least the lower ends in a configuration corresponding to the pad configuration to be contacted, and a means to simultaneously rotate the probe elements.

Abstract: A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.