Patents Assigned to Advanced Semiconductor Engineering
-
Publication number: 20250015069Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.Type: ApplicationFiled: September 24, 2024Publication date: January 9, 2025Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang-Yu LIN, Cheng-Hsuan WU
-
Publication number: 20240429213Abstract: An electronic device is provided. The electronic device includes a package structure and a power regulating element. The package structure includes an electronic component, a plurality of first conductive structures, and an encapsulant. The plurality of first conductive structures are connected to the electronic component. The encapsulant encapsulates the electronic component and exposes a portion of the plurality of first conductive structures. The power regulating component includes a plurality of second conductive structures directly bonded with the plurality of first conductive structures and configured to provide the electronic component with a power signal.Type: ApplicationFiled: June 20, 2023Publication date: December 26, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Syu-Tang LIU, Pao-Nan LEE, Yu-Hsun CHANG, Jung Jui KANG
-
Publication number: 20240429115Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.Type: ApplicationFiled: September 10, 2024Publication date: December 26, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi CHEN, Chang-Lin YEH, Jen-Chieh KAO
-
Publication number: 20240427092Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.Type: ApplicationFiled: September 10, 2024Publication date: December 26, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Chieh TANG, Lu-Ming LAI, Yu-Che HUANG, Ying-Chung CHEN
-
Publication number: 20240421086Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a second electronic component, and a circuit structure. The circuit structure is supported by the first electronic component and the second electronic component. The circuit structure electrically connects the first electronic component to the second electronic component and is configured to provide the first electronic component and the second electronic component with a power.Type: ApplicationFiled: June 16, 2023Publication date: December 19, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Syu-Tang LIU, Yu-Hsun CHANG
-
Publication number: 20240421103Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.Type: ApplicationFiled: August 27, 2024Publication date: December 19, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chia Hsiu HUANG, Chun Chen CHEN, Wei Chih CHO, Shao-Lun YANG
-
Publication number: 20240413115Abstract: A package structure is provided. The package structure includes an electronic component, an encapsulant, a first conductive pillar, a first dielectric layer. The electronic component has an active surface. The encapsulant encapsulates the electronic component and exposes the active surface of the electronic component. The first conductive pillar is over the active surface of the electronic component, wherein an upper surface of the first conductive pillar includes a concave portion. The first dielectric layer is over the encapsulant and the active surface of the electronic component, wherein the first dielectric layer defines an opening exposing the concave portion of the first conductive pillar.Type: ApplicationFiled: June 7, 2023Publication date: December 12, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Ling YEH, Yuan-Feng CHIANG, Chung-Hung LAI, Chin-Li KAO
-
Publication number: 20240413062Abstract: A package structure is provided. The package structure includes a wiring structure, a first element, and a plurality of first wires. The wiring structure has a first recess recessed from a first surface of the wiring structure. The first element is disposed over the first surface of the wiring structure. The first wires are disposed in the first recess and extending in a direction from the wiring structure to the first element. The first wires are configured to reduce an inclination of the first element with respect to the first surface of the wiring structure.Type: ApplicationFiled: June 7, 2023Publication date: December 12, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Jen-Hao PAN
-
Publication number: 20240413061Abstract: A package structure is provided. The package structure includes a substrate, a wiring structure, and a wire bundle structure. The wiring structure is over the substrate. The wire bundle structure is between the wiring structure and the substrate. The wire bundle structure includes a first wire bundle extending from the substrate and a second wire bundle extending from the wiring structure and contacting the first nanowire bundle. The wire bundle structure is configured to reduce a variation in a distance of a gap between the substrate and the wiring structure.Type: ApplicationFiled: June 7, 2023Publication date: December 12, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: An-Hsuan HSU, Cheng-Yuan KUNG, Yaohsin CHOU
-
Publication number: 20240411096Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component and an optical interposer. The optical interposer includes a plurality of optical paths and optically coupled to the first photonic component. The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.Type: ApplicationFiled: June 9, 2023Publication date: December 12, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Sin-Yuan MU
-
Publication number: 20240395784Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible carrier, an electronic component disposed over the flexible carrier, and a first flexible connection element configured to connect the flexible carrier and the electronic component. The first flexible connection element is configured to extend along a deformation direction of the electronic device. An interconnection structure is also provided.Type: ApplicationFiled: May 25, 2023Publication date: November 28, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Kuei-Hao TSENG, Kai Hung WANG, Chih Lung LIN
-
Publication number: 20240379567Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.Type: ApplicationFiled: July 22, 2024Publication date: November 14, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Jr-Wei LIN
-
Publication number: 20240371739Abstract: An electronic package includes a pad, a dielectric layer, a bump, and a conductive element. The dielectric layer encapsulates the pad and includes an opening exposing the pad. The bump is disposed over the pad. The conductive element is disposed in the opening between the pad and the bump. The conductive element is configured to mitigate a shrinkage of an electrical path between the pad and the bump occupied by an expansion of the dielectric layer.Type: ApplicationFiled: May 5, 2023Publication date: November 7, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pin-Yao CHEN, Shiuan-Yu LIN, Hung-Jung TU
-
Publication number: 20240371711Abstract: A package structure is provided. The package structure includes an amplifier and a filter structure. The amplifier has an active surface. The filter structure is disposed over the amplifier, and communicates with the amplifier through a first signal path substantially vertical to the active surface of the amplifier.Type: ApplicationFiled: May 5, 2023Publication date: November 7, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Ting CHEN, Hung-Yi LIN, Cheng-Yuan KUNG
-
Publication number: 20240373752Abstract: A semiconductor substrate and a package structure including the same are provided. The semiconductor substrate includes a first surface and a second surface. The first surface includes a filtering region. The second surface is opposite to the first surface and includes an amplifying region.Type: ApplicationFiled: May 5, 2023Publication date: November 7, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Ting CHEN, Hung-Yi LIN, Cheng-Yuan KUNG
-
Publication number: 20240355793Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure is provided. The semiconductor package structure includes a carrier and a component. The carrier includes a first part and a second part separated from the first part. The component is disposed under the first part and electrically connected to the second part. The first part is configured to be electrically connected to a device disposed over the first part.Type: ApplicationFiled: April 20, 2023Publication date: October 24, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Kay Stefan ESSIG, You-Lung YEN, Bernd Karl APPELT, Jean Marc YANNOU
-
Publication number: 20240357751Abstract: An electronic device is disclosed. The electronic device includes a first circuit structure, a second circuit structure having a surface facing the first circuit structure, and a first electronic component disposed over the first circuit structure and supporting the second circuit structure. The electronic device also includes a second electronic component disposed adjacent to the second circuit structure and having a top surface at an elevation higher than the surface of the second circuit structure with respect to the first circuit structure.Type: ApplicationFiled: April 21, 2023Publication date: October 24, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-Yu CHEN, Huei-Shyong CHO, Shih-Wen LU
-
Publication number: 20240355763Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.Type: ApplicationFiled: July 1, 2024Publication date: October 24, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: En Hao HSU, Kuo Hwa TZENG, Chia-Pin CHEN, Chi Long TSAI
-
Publication number: 20240356197Abstract: The present disclosure provides an electronic device, which includes an encapsulant, an electronic component, an antenna structure, and a first conductive element. The electronic component is disposed in the encapsulant. The antenna structure has an antenna pattern exposed to air and facing the encapsulant, and a first supporting element separating the antenna pattern from the encapsulant. At least a portion of the first conductive element is within the encapsulant, and electrically connects the antenna pattern to the electronic component by the first supporting element.Type: ApplicationFiled: April 20, 2023Publication date: October 24, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yuanhao YU, Weifan WU, Yong-Chang SYU, Chung Ju YU
-
Publication number: 20240347921Abstract: The present disclosure provides an antenna package structure, which includes antenna and a transmitting structure. The transmitting structure includes a first dielectric material and a second dielectric material of different dielectric constants, and a frequency selective surface unit. The first dielectric layer and the second dielectric layer are configured to focus the electromagnetic wave radiated between the antenna and the frequency selective surface unit.Type: ApplicationFiled: April 13, 2023Publication date: October 17, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
