Patents Assigned to Advanced Semiconductor Engineering
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Patent number: 12087652Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.Type: GrantFiled: August 9, 2022Date of Patent: September 10, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi Chen, Chang-Lin Yeh, Jen-Chieh Kao
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Patent number: 12085768Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.Type: GrantFiled: September 2, 2021Date of Patent: September 10, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shih-Chieh Tang, Lu-Ming Lai, Yu-Che Huang, Ying-Chung Chen
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Patent number: 12089349Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: GrantFiled: August 29, 2023Date of Patent: September 10, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Publication number: 20240297086Abstract: An interconnection structure and a package structure are provided. The interconnection structure includes a substrate, a conductive layer, a bonding layer, and a moderating layer. The conductive layer is over the substrate and has a top surface. The bonding layer is over the top surface of the conductive layer. The moderating layer is between the conductive layer and the bonding layer and configured to mitigate an increase in a surface roughness of the top surface of the conductive layer during an electroless plating process for forming the bonding layer.Type: ApplicationFiled: March 1, 2023Publication date: September 5, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Wei CHIANG, Yun-Ching HUNG, Yung-Sheng LIN
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Publication number: 20240297090Abstract: A package structure is provided. The package structure includes an electronic component, a heat dissipating element, and an adhesive layer. The heat dissipating element is disposed over the electronic component. The adhesive layer is disposed between the electronic component and the heat dissipating element and spaced apart from the electronic component by a first space. The first space is configured to reduce a thermal conductive region between the electronic component and the heat dissipating element occupied by the adhesive layer.Type: ApplicationFiled: March 1, 2023Publication date: September 5, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jui-Shan HSU, Kuang-Hsiung CHEN, Yu-Wei LIANG
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Publication number: 20240290515Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the conductive wire. The first connection element is disposed outside the magnetic layer.Type: ApplicationFiled: February 24, 2023Publication date: August 29, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wu Chou HSU, Hung Yi CHUANG, Shin-Luh TARNG
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Publication number: 20240288745Abstract: A semiconductor device is provided. The semiconductor device includes a first optical transceiver, a second optical transceiver and a component. The component is configured to provide a magnetic field to change a light emitting direction from the first optical transceiver to the second optical transceiver or from the second optical transceiver to the first optical transceiver.Type: ApplicationFiled: February 24, 2023Publication date: August 29, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wen-Long LU
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Patent number: 12074118Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.Type: GrantFiled: June 13, 2023Date of Patent: August 27, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia Hsiu Huang, Chun Chen Chen, Wei Chih Cho, Shao-Lun Yang
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Publication number: 20240283165Abstract: An electronic device is provided. The electronic device includes a carrier, an antenna element, a first parasitic patch, and a first current distribution unit. The antenna element is at least partially over the carrier. The first parasitic patch is adjacent to the antenna element. The first current distribution unit is configured to form a first equivalent patch area of the first parasitic patch. The first equivalent patch area has a first length extending in a direction substantially parallel to a first direction of electric current of the antenna element and substantially equal to ?/2, and ? is a wavelength of an operating frequency of the antenna element.Type: ApplicationFiled: February 22, 2023Publication date: August 22, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Hong-Sheng HUANG
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Publication number: 20240282715Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, a second carrier disposed over the first carrier, and a reinforcement connected to the second carrier and configured to prevent the second carrier from being recessed toward the first carrier.Type: ApplicationFiled: February 17, 2023Publication date: August 22, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wei-Hao CHANG
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Publication number: 20240282694Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.Type: ApplicationFiled: April 30, 2024Publication date: August 22, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chiung-Ying KUO, Hung-Chun KUO
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Patent number: 12068259Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.Type: GrantFiled: March 14, 2023Date of Patent: August 20, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei Da Lin, Meng-Jen Wang, Hung Chen Kuo, Wen Jin Huang
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Publication number: 20240275060Abstract: The present disclosure provides an electronic device. The electronic device includes a signal transmission structure and a circuit. The signal transmission structure defines a waveguide. The signal transmission structure defines a plurality of first apertures. The circuit is configured to adjust a geometric profile of at least one of the plurality of first apertures to control a frequency of an electromagnetic wave radiated from the first apertures.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
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Publication number: 20240275061Abstract: The present disclosure provides an electronic device. The electronic device includes a radio frequency (RF) circuit region and an antenna region. The RF circuit region has a first circuit density. The antenna region includes a circuit structure. The circuit structure defines a waveguide. The circuit structure has a second circuit density less than the first circuit density.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
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Publication number: 20240275038Abstract: The present disclosure provides an electronic device. The electronic device includes a carrier and an interconnection structure disposed over the carrier and having a plurality of conductive pads. One of the plurality of conductive pads is adjustable to function as a functional pad or a non-functional pad for an antenna unit.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wei-Chih CHO
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Publication number: 20240272365Abstract: An optical module is disclosed. The optical module includes a carrier, a first optical receiver disposed over the carrier and configured to receive a first light of a first wavelength band, and a second optical receiver disposed over the carrier and configured to receive a second light of a second wavelength band different from the first wavelength band. The optical module also includes a light blocking structure having a first portion around the first optical receiver and the second optical receiver. The light blocking structure is substantially opaque to the first wavelength band and the second wavelength band. The optical module also includes a first optical filter disposed over the first optical receiver and configured to allow the first light to pass through, and a second optical filter disposed over the second optical receiver and configured to allow the second light to pass through.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shyue-Long LOUH, Jenchun CHEN
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Publication number: 20240264377Abstract: An optical package device and a method of manufacturing the same are disclosed. The optical package device includes an optical component and an optical guiding component. The optical component is configured to change a phase of an input optical signal from a first state to a second state, and to output a first beam with a phase of the second state. The optical guiding component is disposed adjacent to the optical component, the first beam propagating from the optical component toward the optical guiding component. The physical axis of the optical component perpendicular thereto is not parallel with a physical axis of the optical guiding component perpendicular thereto.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Ying-Chung CHEN
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Publication number: 20240264369Abstract: An optoelectronic package includes a first photonic component, an optical connection element and an optical component. The optical connection element is disposed at least partially over the first photonic component. The optical component is disposed at least partially over the first photonic component. The optical connection element and the optical component are spaced apart from each other.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
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Publication number: 20240264368Abstract: An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN, Chang Chi LEE, Chun-Yen TING
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Patent number: 12057670Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first substrate, a second substrate, and a solid solution layer. The first substrate includes a first metal layer, and the first metal layer includes a first metal. The second substrate includes a second metal layer. The solid solution layer electrically connects the first metal layer to the second metal layer. The solid solution layer includes a first metal-rich layer.Type: GrantFiled: March 31, 2021Date of Patent: August 6, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: An-Hsuan Hsu, Yung-Sheng Lin
