Patents Assigned to Advanced Semiconductor Engineering
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Publication number: 20240297086Abstract: An interconnection structure and a package structure are provided. The interconnection structure includes a substrate, a conductive layer, a bonding layer, and a moderating layer. The conductive layer is over the substrate and has a top surface. The bonding layer is over the top surface of the conductive layer. The moderating layer is between the conductive layer and the bonding layer and configured to mitigate an increase in a surface roughness of the top surface of the conductive layer during an electroless plating process for forming the bonding layer.Type: ApplicationFiled: March 1, 2023Publication date: September 5, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Wei CHIANG, Yun-Ching HUNG, Yung-Sheng LIN
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Publication number: 20240290515Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the conductive wire. The first connection element is disposed outside the magnetic layer.Type: ApplicationFiled: February 24, 2023Publication date: August 29, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wu Chou HSU, Hung Yi CHUANG, Shin-Luh TARNG
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Publication number: 20240288745Abstract: A semiconductor device is provided. The semiconductor device includes a first optical transceiver, a second optical transceiver and a component. The component is configured to provide a magnetic field to change a light emitting direction from the first optical transceiver to the second optical transceiver or from the second optical transceiver to the first optical transceiver.Type: ApplicationFiled: February 24, 2023Publication date: August 29, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wen-Long LU
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Publication number: 20240282715Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, a second carrier disposed over the first carrier, and a reinforcement connected to the second carrier and configured to prevent the second carrier from being recessed toward the first carrier.Type: ApplicationFiled: February 17, 2023Publication date: August 22, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wei-Hao CHANG
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Publication number: 20240283165Abstract: An electronic device is provided. The electronic device includes a carrier, an antenna element, a first parasitic patch, and a first current distribution unit. The antenna element is at least partially over the carrier. The first parasitic patch is adjacent to the antenna element. The first current distribution unit is configured to form a first equivalent patch area of the first parasitic patch. The first equivalent patch area has a first length extending in a direction substantially parallel to a first direction of electric current of the antenna element and substantially equal to ?/2, and ? is a wavelength of an operating frequency of the antenna element.Type: ApplicationFiled: February 22, 2023Publication date: August 22, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Hong-Sheng HUANG
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Publication number: 20240282694Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.Type: ApplicationFiled: April 30, 2024Publication date: August 22, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chiung-Ying KUO, Hung-Chun KUO
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Publication number: 20240272365Abstract: An optical module is disclosed. The optical module includes a carrier, a first optical receiver disposed over the carrier and configured to receive a first light of a first wavelength band, and a second optical receiver disposed over the carrier and configured to receive a second light of a second wavelength band different from the first wavelength band. The optical module also includes a light blocking structure having a first portion around the first optical receiver and the second optical receiver. The light blocking structure is substantially opaque to the first wavelength band and the second wavelength band. The optical module also includes a first optical filter disposed over the first optical receiver and configured to allow the first light to pass through, and a second optical filter disposed over the second optical receiver and configured to allow the second light to pass through.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shyue-Long LOUH, Jenchun CHEN
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Publication number: 20240275038Abstract: The present disclosure provides an electronic device. The electronic device includes a carrier and an interconnection structure disposed over the carrier and having a plurality of conductive pads. One of the plurality of conductive pads is adjustable to function as a functional pad or a non-functional pad for an antenna unit.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wei-Chih CHO
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Publication number: 20240275061Abstract: The present disclosure provides an electronic device. The electronic device includes a radio frequency (RF) circuit region and an antenna region. The RF circuit region has a first circuit density. The antenna region includes a circuit structure. The circuit structure defines a waveguide. The circuit structure has a second circuit density less than the first circuit density.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
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Publication number: 20240275060Abstract: The present disclosure provides an electronic device. The electronic device includes a signal transmission structure and a circuit. The signal transmission structure defines a waveguide. The signal transmission structure defines a plurality of first apertures. The circuit is configured to adjust a geometric profile of at least one of the plurality of first apertures to control a frequency of an electromagnetic wave radiated from the first apertures.Type: ApplicationFiled: February 10, 2023Publication date: August 15, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
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Publication number: 20240264369Abstract: An optoelectronic package includes a first photonic component, an optical connection element and an optical component. The optical connection element is disposed at least partially over the first photonic component. The optical component is disposed at least partially over the first photonic component. The optical connection element and the optical component are spaced apart from each other.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
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Publication number: 20240264368Abstract: An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN, Chang Chi LEE, Chun-Yen TING
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Publication number: 20240264377Abstract: An optical package device and a method of manufacturing the same are disclosed. The optical package device includes an optical component and an optical guiding component. The optical component is configured to change a phase of an input optical signal from a first state to a second state, and to output a first beam with a phase of the second state. The optical guiding component is disposed adjacent to the optical component, the first beam propagating from the optical component toward the optical guiding component. The physical axis of the optical component perpendicular thereto is not parallel with a physical axis of the optical guiding component perpendicular thereto.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Ying-Chung CHEN
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Publication number: 20240258229Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.Type: ApplicationFiled: April 9, 2024Publication date: August 1, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Yi Chun CHOU
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Publication number: 20240260181Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.Type: ApplicationFiled: April 9, 2024Publication date: August 1, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Ze LIN, Chia Ching CHEN, Yi Chuan DING
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Publication number: 20240249988Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a substrate, an electronic component, an intermediate structure and a protective layer. The electronic component is disposed over the substrate. The intermediate structure is disposed over the substrate and comprises an interposer and a conductive element on the interposer. The protective layer is disposed over the substrate and has an upper surface covering the electronic component and being substantially level with an upper surface of the conductive element.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Chang CHEN, Wei-Tung CHANG, Jen-Chieh KAO
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Publication number: 20240249958Abstract: A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.Type: ApplicationFiled: January 20, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ya Fang CHAN, Cong-Wei CHEN, Kuoching CHENG, Shih-Yu WANG
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Publication number: 20240250427Abstract: The present disclosure provides an electronic device. The electronic device includes an antenna. The antenna includes a first conductive element, a second conductive element, and a switch circuit. The first conductive element is configured to transmit a first signal along a first direction. The second conductive element is configured to transmit a second signal along a second direction different from the first direction. The switch circuit is configured to electrically couple a ground to the first conductive element and/or the second conductive element.Type: ApplicationFiled: January 23, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Hao CHANG, Wei-Chun LEE
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Publication number: 20240250006Abstract: The present disclosure provides a package structure. The package structure includes a die bonding region and a first lead region. The first lead region extends along a first direction. The first direction is along a first edge of the die bonding region. The first lead region includes a first high density lead region and a first low density lead region. The first high density lead region overlaps the first low density lead region in the first direction.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: I-Jen CHEN
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Publication number: 20240250030Abstract: An electronic device is provided. The electronic device includes an inductor and a dielectric layer. The inductor includes a first magnetic layer, a conductive trace over the first magnetic layer, and a second magnetic layer over the conductive trace. The dielectric layer includes a first portion between the second magnetic layer and an inclined surface of the first magnetic layer. A substantially constant distance between the second magnetic layer and the inclined surface of the first magnetic layer is defined by the dielectric layer.Type: ApplicationFiled: January 23, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Chiu-Wen LEE, Yu-Hsun CHANG, Tai-Yuan HUANG
