Patents Assigned to Advanced Semiconductor Engineering
  • OPTOELECTRONIC PACKAGE
    Publication number: 20240345315
    Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
  • OPTICAL DEVICE
    Publication number: 20240345337
    Abstract: An optical device is provided. The optical device includes a first photonic component and a second photonic component. The first photonic component is configured to communicate with the second photonic component through a first optical path or an electrical path depending on a distance between the first photonic component and the second photonic component.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tai-Hsiang LIU, Hung-Yi LIN, Wen Chieh YANG
  • ELECTRONIC DEVICE
    Publication number: 20240345343
    Abstract: An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
  • PACKAGE DEVICE
    Publication number: 20240345341
    Abstract: A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung Jui KANG, Shih-Yuan SUN, Chiu-Wen LEE, Chang Chi LEE, Chun-Yen TING, Hung-Chun KUO
  • ANTENNA PACKAGE STRUCTURE
    Publication number: 20240347909
    Abstract: The present disclosure provides an antenna package structure, including a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a plurality of first patterns and a plurality of second patterns geometrically distinct from the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are configured to enhance gain and directivity of the first antenna.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
  • ELECTRONIC DEVICE
    Publication number: 20240339383
    Abstract: An electronic device and a method of manufacturing an electronic device are provided. The electronic device includes an electronic component, a carrier, and a lead. The electronic component has a lateral surface. The carrier supports the electronic component. The lead is electrically connected to the electronic component and disposed adjacent to the lateral surface of the electronic component. The carrier and the lead are configured to block an electromagnetic wave between the electronic component and an external of the electronic device.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 10, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ko-Pu WU, Chih-Hung HSU, Chin Li HUANG, Chieh-Yin LIN, Yuan-Chun CHEN, Kai-Sheng PAI
  • PACKAGE STRUCTURE
    Publication number: 20240334586
    Abstract: A package structure is provided. The package structure includes an electronic component, a heat dissipating element, a thermal interfacing unit, and a confining structure. The electronic component has an upper surface. The heat dissipating element is over the upper surface of the electronic component. The thermal interfacing unit is between the upper surface of the electronic component and the heat dissipating element. The thermal interfacing unit includes a thermal interfacing material (TIM). The TIM is attached to the confining structure by capillary force.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: An-Hsuan HSU, Hung-Hsien HUANG, Chin-Li KAO
  • SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240329344
    Abstract: Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN, Chang Chi LEE, Hung-Chun KUO, Chun-Yen TING
  • PACKAGE DEVICE AND ELECTRONIC DEVICE
    Publication number: 20240329300
    Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-I WU, Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
  • PACKAGE STRUCTURE
    Publication number: 20240332192
    Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-I WU, Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
  • OPTICAL PACKAGE
    Publication number: 20240329387
    Abstract: An optical package is provided. The optical package includes a first optical device and an optical guiding structure. The first optical device is disposed over a carrier. The optical guiding structure is disposed over the carrier and configured to adjust a first optical transmission path of the first optical device.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Chi-Han CHEN, Jr-Wei LIN, Pei-Jung YANG
  • OPTICAL DEVICE PACKAGE
    Publication number: 20240332274
    Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.
    Type: Application
    Filed: June 11, 2024
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tsung-Yueh TSAI, Meng-Jen WANG, Yu-Fang TSAI, Meng-Jung CHUANG
  • OPTOELECTRONIC PACKAGE STRUCTURE
    Publication number: 20240302589
    Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component, a second photonic component, and an interposer. The first photonic component is disposed over the second photonic component. The interposer is optically coupled between the first photonic component and the second photonic component. The interposer is configured to define a first signal path therebetween.
    Type: Application
    Filed: March 10, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
  • CIRCUIT STRUCTURE
    Publication number: 20240306295
    Abstract: A circuit structure includes a low-density conductive structure, a high-density conductive structure and a plurality of traces. The high-density conductive structure is disposed over the low-density conductive structure, and defines an opening extending from a top surface of the high-density conductive structure to a bottom surface of the high-density conductive structure. The opening exposes a first pad of the low-density conductive structure and a second pad of the low-density conductive structure. The second pad is spaced apart from the first pad. The traces extend from the top surface of the high-density conductive structure into the opening. The traces include a first trace connecting to the first pad of the low-density conductive structure and a second trace connecting to the second pad of the low-density conductive structure.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240304555
    Abstract: A package structure and a method for manufacturing the package structure are provided. The package structure includes an interposer, a first electronic component over the interposer, and a second electronic component over the interposer. The interposer includes a first interconnector and a second interconnector. The first electronic component and the second electronic component are disposed at a first horizontal level and electrically connected to each other through the first interconnector. The second interconnector is electrically connected to a third electronic component disposed at a second horizontal level different from the first horizontal level.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hung-Yi LIN, Cheng-Yuan KUNG
  • ELECTRONIC PACKAGE STRUCTURE
    Publication number: 20240304450
    Abstract: An electronic package structure includes a first electronic component, a first thermal conductive structure and a second thermal conductive structure. The first thermal conductive structure is disposed over the first electronic component. The second thermal conductive structure is disposed between the first electronic component and the first thermal conductive structure. A first heat transfer rate of the second thermal conductive structure along a first direction from the first electronic component to the first thermal conductive structure is greater than a second heat transfer rate of the second thermal conductive structure along a second direction nonparallel with the first direction from the first electronic component to an element other than the first thermal conductive structure.
    Type: Application
    Filed: March 7, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: An-Hsuan HSU, Chin-Li KAO
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240304606
    Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first circuit layer, a second circuit layer under the first circuit layer, a first electronic component between the first circuit layer and the second circuit layer and connected to the first circuit layer and a sub-package between the first circuit layer and the second circuit layer and connected to the second circuit layer. The sub package comprises a second electronic component under the first electronic component and a conductive structure configured to dissipate heat generated from the first electronic component.
    Type: Application
    Filed: March 9, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wei-Hao CHANG
  • OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240302614
    Abstract: An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.
    Type: Application
    Filed: May 14, 2024
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU
  • PACKAGE STRUCTURE
    Publication number: 20240304584
    Abstract: A package structure is provided. The package structure includes a semiconductor substrate. The semiconductor substrate includes a lower portion and an upper portion. The upper portion of the semiconductor substrate defines a high speed signal transmission region. The high speed signal transmission region includes a first region configured to communicate with a first electronic component and a second region configured to communicate with an external device.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hai-Ming CHEN, Hung-Yi LIN, Cheng-Yuan KUNG
  • PACKAGE STRUCTURE
    Publication number: 20240297090
    Abstract: A package structure is provided. The package structure includes an electronic component, a heat dissipating element, and an adhesive layer. The heat dissipating element is disposed over the electronic component. The adhesive layer is disposed between the electronic component and the heat dissipating element and spaced apart from the electronic component by a first space. The first space is configured to reduce a thermal conductive region between the electronic component and the heat dissipating element occupied by the adhesive layer.
    Type: Application
    Filed: March 1, 2023
    Publication date: September 5, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jui-Shan HSU, Kuang-Hsiung CHEN, Yu-Wei LIANG