Abstract: What is described is a high-frequency integrated circuit provided on a III-V compound semiconductor, wherein an emitting device is radiation-coupled with the integrated circuit such that the emitting device irradiates the integrated circuit, and wherein the integrated circuit has at least one of an oscillator, a mixer, a phase shifter, a frequency divider or an amplifier.

Abstract: An electronic component handling apparatus includes: a moving device that presses a device under test (DUT) against a socket of a test head. The moving device includes: a pusher that contacts the DUT; and a heater that heats the DUT through the pusher. The pusher includes: an internal space; and a first flow path that communicates with the internal space. Fluid from the test head is supplied to the internal space through the first flow path.

Abstract: An optical testing device for use in testing an optical measuring instrument provides incident light from a light source to an incident object and receives reflected light due to reflection of the incident light at the incident object. The optical testing device includes an incident light receiving section that receives incident light, and a light signal providing section. The light signal providing section provides a light signal to the incident object after a predetermined delay time since the incident light receiving section has received the incident light. A reflected light signal due to reflection of the light signal at the incident object is provided to the optical measuring instrument. The delay time is approximately equal to the time between emission of the incident light from the light source and reception of the reflected light by the optical measuring instrument in the case of actually using the optical measuring instrument.

Abstract: A switch circuit includes at least a first and a second switch element connected in series and a switch control configured for providing control signals for switching the first and the second switch element, such that the control signals have a different timing and such that the first and the second switch element perform one joint switch function.

Abstract: An exposure device is provided, including: a body tube depressurized to produce a vacuum state therein; a plurality of charged particle beam sources that are provided in the body tube, and emit a plurality of charged particle beams in a direction of extension of the body tube; a plurality of electromagnetic optical elements, each being corresponding to one of the plurality of charged particle beams in the body tube, and controls the one of the plurality of charged particle beams; first and second partition walls that are arranged separately from each other in the direction of extension in the body tube, and form non-vacuum spaces between at least parts of the first and second partition walls; and a depressurization pump that depressurizes a non-vacuum space that contacts the first partition wall and a non-vacuum space that contacts the second partition wall to an air pressure between zero and atmospheric pressure.

Abstract: Provided is a magnetic sensor testing device capable of preventing performance of an electromagnet from greatly changing due to heat applied to a magnetic sensor. A magnetic sensor testing device includes electromagnets 50 and 60 that apply a magnetic field to a magnetic sensor, temperature regulators 30 and 40 that regulate a temperature of the magnetic sensor by locally applying heat to the magnetic sensor, and a controller that controls the electromagnets 50 and 60 and the temperature regulators 30 and 40, in which the controller tests the magnetic sensor in a state in which the magnetic field is applied to the magnetic sensor by the electromagnets 50 and 60 while the heat is applied to the magnetic sensor by the temperature regulators 30 and 40.

Abstract: A power supply device for a test equipment, test equipment having a power supply device and a method for operating a power supply device are described. The power supply device is configured for an at least partly capacitive load and has an output voltage provider configured to generate a target voltage, which is energized by an input supply voltage provided at an input of the power supply, wherein the target voltage generates an output supply voltage at the capacitive load, when the capacitive load is connected to an output of the power supply and a supply current monitor configured to monitor supply current flowing into the input of the power supply and to temporarily reduce the target voltage generating the output supply voltage, if a current value of the supply current exceeds a first predetermined threshold.

Abstract: A laser beam output apparatus includes a pulsed laser output section, an optical path determining section, a wavelength changing section, and a multiplexer. The pulsed laser output section outputs a laser beam having a predetermined wavelength as first pulses. The optical path determining section receives the first pulses and determines one among a plurality of optical paths for each of the first pulses for output. The wavelength changing section receives light beams traveling, respectively, through the plurality of optical paths and changes the light beams to have their respective different wavelengths for output. The multiplexer multiplexes outputs from the wavelength changing section.

Abstract: The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L2 of the second contact probe 22 is shorter than the length L1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.

Abstract: A test apparatus for testing a device under test is configured to receive a response signal from the device under test and to apply one or more correction functions to the received response signal to at least partially correct an imperfection of the DUT. The test apparatus is configured to thereby obtain a corrected response signal of the device under test and to evaluate the corrected response signal to judge the device under test.

Abstract: A test equipment has a signal input/signal output and a use-site calibration unit for determining a user-site compensation function. The user-site compensation function has a compensation magnitude function and a compensation Hilbert phase function. The calibration unit has a level meter and a calculator. The level meter is configured to measure a magnitude characteristic of the electrical signal, the magnitude characteristic being the basis for the determination of the compensation Hilbert phase function. The calculator is configured to determine a Hilbert phase characteristic of the electrical signal based on a Hilbert transformation of a function dependent on the measured magnitude characteristic and to determine the compensation Hilbert phase function on the basis of the Hilbert phase characteristic.

Abstract: A Built-in-Self-Test (BIST) centric Automatic Test Equipment (ATE) framework can include a host controller and one or more tester units. The host controller can be configured to receive one or more inputs to initiate testing of a plurality of Devices Under Test (DUTs). The one or more tester unit can include a plurality of Universal Asynchronous Receiver-Transmitters (UARTs) communication links. The UART communication links can be configured to send one or more commands for initiating and controlling a Built-in-Self-Test (BIST) in the plurality of DUTs. The UART communication links can also be configured to receive test output data of the BIST from the plurality of DUTs. The host controller can also be configured to output the test output data of the BIST.

Abstract: A heat exchanger which exchanges heat with a DUT while contacting the DUT includes: a heat exchange block which thermally contacts the DUT; a first heat transfer sheet which overlaps a front end surface of the heat exchange block; a second heat transfer sheet which overlaps the front end surface of the heat exchange block through the first heat transfer sheet; and a first holding member which holds the second heat transfer sheet.

Abstract: A compound semiconductor device includes a first transistor formed on a GaN epitaxial layer. The first transistor includes a gate electrode, a source electrode, a drain electrode, and a protective film covering them. End portions of the first transistor do not overhang the protective film, and the concentration of fluorine in the GaN epitaxial layer in the region where the gate electrode of the first transistor is formed is substantially zero.

Abstract: [Object] Provided is an electronic component handling apparatus capable of controlling a DUT temperature within an appropriate range even in a DUT in which an abrupt temperature change occurs under test.

Abstract: [Object] Provided is an electronic component handling apparatus capable of controlling a DUT temperature within an appropriate range even in a DUT in which a sudden temperature change occurs under test.

Abstract: A burn-in board capable of realizing a uniform temperature distribution inside a burn-in board is provided. A burn-in board includes: a plurality of sockets; a burn-in board body including an upper surface for mounting the sockets thereon and a lower surface on the side opposite to the upper surface; a reinforcement frame contacting the lower surface; a bottom cover contacting the reinforcement frame; a heat conduction plate interposed between the burn-in board body and the bottom cover; and a heat conduction sheet thermally connecting the burn-in board body to the heat conduction plate, in which the reinforcement frame presses the heat conduction plate toward the heat conduction sheet.

Abstract: A method for receiving data using an FPGA receiver circuit comprises receiving payload data from a DUT using a first rate of a plurality of line rates during a first burst, wherein the DUT is communicatively coupled to the FPGA receiver circuit. The method further comprises transitioning to a power saving state at an end of the first burst and receiving synchronization data from the DUT using a second rate of a plurality of line rates during a second burst. Further, the method comprises establishing synchronization with a clock data recovery (CDR) circuit of the FPGA receiver circuit at the second rate and receiving payload data from the DUT at the second rate.

Abstract: A sensor test apparatus capable of efficiently testing a sensor is provided. A sensor test apparatus 30 which tests the pressure sensor 90 includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electronically connected, a pressure chamber 43 which applies pressure to the sensor 90, and a heat sink 443,462 which applies a thermal stress to the sensor 90, the test unit 35 which tests the sensor 90 via the socket 445, and the conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

Abstract: A sensor test apparatus having excellent versatility is provided. The sensor test apparatus 30 includes a first application unit 40 including a first application device 42 including a socket 445 to which the sensor 90 is electrically connected, and a pressure chamber 43 which applies pressure to the sensor 90, a test unit 35 which tests the sensor 90 via the socket 445, a conveying robot 33 which conveys the sensor 90 into and out of the first application unit 40, and an apparatus main body 301 which houses the first application unit 40, the test unit 35 and the conveying robot 33, and the apparatus main body 301 has an opening 306d which allows the first application unit 40 to be inserted into the apparatus main body 301 and removed from the apparatus main body 301 to an outside.