Abstract: A processor implements a network of functional nodes and communication paths between the nodes. The processor includes a plurality of circuit implementations of the functional nodes of the processor; and a plurality of signal paths implementing the communication paths linking the circuit implementations of the nodes. At least some of the signal paths are configured to pass signal values represented according to temporal patterns of signal levels on the signal paths. The processor also includes a plurality of circuit components for conversion between a signal value represented as a signal level (e.g., voltage or current level) and a signal value represented as a temporal pattern.

Abstract: Apparatus and methods for buffer linearization are provided. In certain implementations, an amplifier includes a buffer circuit and a gain circuit. The buffer circuit includes a buffer transistor pair used to buffer a differential input signal to generate a differential buffered signal. Additionally, the gain circuit includes a gain transistor pair configured to amplify the buffered differential signal to generate an amplified differential signal. The buffer circuit can include a linearization transistor pair configured to decrease the buffer circuit's output impedance and to provide feedback that reduces changes in the voltage of the differential buffered signal in response to displacement currents associated with the CJC or CGD capacitances of the gain transistor pair.

Abstract: A voltage regulator receives an unregulated DC input voltage supply and provides a regulated DC output voltage. A primary pass element and an external resistor are located in a primary current path through which a load current flows from the input terminal to the output terminal. The voltage regulator includes two control circuits that control the impedances of two pass elements. Power dissipation can be improved and the dropout voltage can be reduced by maintaining the voltage on an internal node of the voltage regulator.

Abstract: A programmable gain amplifier (“PGA”) may include a differential amplifier, a pair of input capacitors, a pair of feedback capacitors provided in feedback configuration about the amplifier, a first chop circuit, provided at an input of the PGA and an output of the PGA and a second chop circuit provided at an output of the PGA. The PGA also may include circuit systems to sample voltages across the input capacitors in a sampling phase. The sampled voltages may correspond to a difference between a common mode voltage of input signals to the PGA and a common mode voltage of the differential amplifier. The sampled voltage, thus, defines a common mode voltage at the amplifier's inputs during other phases of operation, when the chop circuits are operational.

Abstract: A microchip has a base die with a conductive interconnect and an isolation trench around at least a portion of the conductive interconnect, and a cap die secured to the base die. A seal, formed from a metal material, is positioned between the base die and the cap die to secure them together. The microchip also has a blocking apparatus, between the isolation trench and the metal seal, that at least in part prevents the metal material from contacting the interconnect.

Abstract: The present disclosure provides a stream processor, an associated stream controller and compiler, and associated methods for data processing, such as image processing. In some embodiments, a method includes defining a kernel pattern associated with an image frame, and processing the image frame using the defined kernel pattern. The method can further include generating a kernel switch lookup table based on the defined kernel pattern. In various implementations, the stream controller is operable to direct execution of kernels on the image frame according to the defined kernel pattern and the kernel switch lookup table.

Abstract: A continuous time input stage including a first digital-to-analog converter (DAC) including a first DAC code input, a second DAC including a second DAC code input, a first set of switches coupled to the output of the first DAC, a second set of switches coupled to the output of the second DAC, and an amplifier configured to receive the output of either the first DAC or the second DAC.

Abstract: Error sources relating to the drive signal applied to the resonator of an inertial sensor, such as in-phase offset errors relating to the drive signal and/or electronic pass-through of the drive signal to accelerometer sense electronics, are detected by modulating the drive signal and sensing accelerometer signals that are induced by the modulated drive signal. Error sources related to aerodynamics of an inertial sensor resonator are detected by modulating the distance between the resonator and the underlying substrate and sensing accelerometer signals that are induced by such modulation. Compensating signals may be provided to substantially cancel errors caused by such error sources.

Abstract: Apparatus and methods for electronic amplification are provided. In one embodiment, a method of electronic amplification includes amplifying a differential input voltage signal to generate a feed-forward signal, chopping the feed-forward signal at a chopping frequency to generate a chopped feed-forward signal, notch filtering the chopped feed-forward signal at the chopping frequency to generate a notched signal, generating an input offset correction signal based at least partly on the notched signal, and amplifying the differential input voltage signal using a signal amplification block to generate an output signal. Amplifying the differential input voltage signal using the signal amplification block includes chopping the input signal at the chopping frequency to generate a chopped input signal and combining the chopped input signal and the offset correction signal to reduce input offset error of the signal amplification block.

Abstract: Aspects of the present invention provide apparatuses and methods to provide significant gain enhancement for a cascode structure for a differential amplifier. The cascode structure of the differential amplifier can include first and second pairs of output transistors. The second pair of output transistors can be configured to approximately cancel modulation effects of the first pair of output transistors induced by changes in a differential output of differential amplifier, thereby resulting in conditions for providing enhanced gain.

Abstract: A system and method for manufacturing of a micro-transformer providing direct electrical isolation between a primary winding and a secondary winding while featuring tight magnetic coupling for a large possible step-up or step-down ratio. The micro-transformer may be implemented in an integrated circuit, and may include a magnetic core. A high stepping ratio, e.g. approximately 50 to 100, may be achieved by connecting multiple symmetric primary windings in parallel and multiple symmetric secondary windings in series, or vice-versa. A plurality of windings may be stacked vertically. The micro-transformer may be of particular utility in wireless sensor networks, thermal and vibrational energy harvesters, power converters, and signal isolators.

Abstract: Embodiments of the present invention may provide an improved apparatus and method for correcting timing errors associated with process, voltage, and temperature effects in asynchronous successive approximation register (SAR) analog-to-digital converters (ADC). A SAR ADC may include a timer comprising programmable timing circuits that may ensure that the different components of the SAR ADC are operating according to a timing scheme. Operation of the timing circuits may vary with process, voltage, and temperature, which may adversely affect the timing/accuracy of the SAR ADC. The ADC may include a reference circuit provided on the same integrated circuit as the SAR ADC that may provide a timing reference for the timing circuits. If the reference circuit indicates that the timing circuits are operating faster or slower than ideal, timing values within the timing circuits may be revised to compensate for such variations.

Abstract: Vertical mount package assemblies and methods for making the same are disclosed. A method for manufacturing a vertical mount package assembly includes providing a base substrate having electrical connections for affixing to external circuitry, and providing a package having a mounting region configured to receive a device therein. Flexible electrical leads are formed between the base substrate and the package. The flexible leads can include a plurality of aligned grooves to guide bending. After forming the flexible electrical leads, the package is rotated relative to the base substrate. The aligned grooves can constrain the relative positions of the substrates during rotation, and the beveled edges of the base substrate and package can maintain a desired angular relationship (e.g., perpendicular) between the base substrate and the package after rotation.

Abstract: Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.

Abstract: A continuous time input stage including a first digital-to-analog converter (DAC) including a first DAC code input, a second DAC including a second DAC code input, a first set of switches coupled to the output of the first DAC, a second set of switches coupled to the output of the second DAC, and an amplifier configured to receive the output of either the first DAC or the second DAC.

Abstract: Integrated devices and methods for packaging the same can include an external housing, an internal housing positioned within the external housing, and an external cavity formed between the external housing and the internal housing. An integrated device die can be positioned within the external cavity in fluid communication with an internal cavity formed by the internal lid. An air way can extend through the external cavity to the internal cavity, and can further extend from the internal cavity to the external cavity. The air way can provide fluid communication between the package exterior and the integrated device die, while reducing contamination of the integrated device die.

Abstract: Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements.

Abstract: An amplifier system may include a power stage having inputs for three different supply voltages and an output for coupling to a load, a controller to generate control signals to the power stage that cause the power stage to vary an output voltage applied to the load among more than three distinct voltage levels, a monitor to provide a first control signal to the controller based on an input voltage signal, and a feedback system to provide a second control signal to the controller based on comparison of the output voltage and the input signal.

Abstract: A system, method, and computer program product for dividing two binary numbers. The divider implements a fixed point division function using a floating point normalization architecture to yield the closest initial quotient approximation. The divider normalizes the input dividend and divisor to a range of [0.5, 1.0) by scaling each by necessary factors of two. The normalized inputs are submitted to a divider core that may be optimized for dividing inputs of such limited ranges. The divider core output is then rescaled by an appropriate factor of two, appropriately signed, and loaded into saturating registers for output in various formats. The divider core progressively outputs quotient bits in decreasing order of significance until a predetermined level of precision is reached, typically fewer bits than in a complete quotient, for faster output. One embodiment generates the six most significant quotient bits in one clock cycle.