Abstract: A transceiver for use in a bidirectional optical communication link over a multimode channel is provided. The transceiver includes a single transverse mode light source in a transmitter. A waveguide or fiber based bidirectional coupler projects the transmitter mode to the high modes of the multimode channel. A detector coupled to predominantly all the modes of the channel via the waveguide or fiber based bidirectional coupler.

Abstract: An integrated circuit having an insulated conductor or within a semiconductor substrate and extending perpendicular to a plane of a semiconductor wafer or substrate on which the integrated circuit is fabricated, the conductor comprising a first region of doped semiconductor extending between a first device or a first contact and a second device or a second contact.

Abstract: A low voltage driver for a higher voltage LCD includes a plurality of LCD drive bias voltage input terminals; an LCD drive voltage output terminal; an input transistor switching circuit having at least one switch for each LCD drive bias voltage for selecting one of the bias voltages; an output transistor switching circuit, responsive to the input transistor switching circuit, for applying the selected one of the bias voltages to the LCD drive voltage output terminal, the transistors of the switching circuits having a predetermined breakdown voltage; a level shifter for providing switching voltages counterpart to the plurality of bias voltages; a logic circuit for enabling the first transistor switching circuit to select a one of the bias voltages and applying a set of counterpart switching voltages to the input and output transistor switching circuits for connecting the selected one of the bias voltages to the output terminal and applying a set of switching voltages to the input and output switching circuits

Abstract: A microelectronic device tester has a mounting member (for mounting a device), a drive shaft connected to the mounting member, and a vibration shaft mechanically in communication with the drive shaft. The drive shaft and vibration shaft are non-coaxial, and the drive shaft has a drive shaft proximal end and a drive shaft distal end. The drive shaft proximal end is connected to the mounting member, and the drive shaft distal end terminates proximal of the entire vibration shaft.

Abstract: Integrated devices and methods for packaging the same can include an external housing, an internal housing positioned within the external housing, and an external cavity formed between the external housing and the internal housing. An integrated device die can be positioned within the external cavity in fluid communication with an internal cavity formed by the internal lid. An air way can extend through the external cavity to the internal cavity, and can further extend from the internal cavity to the external cavity. The air way can provide fluid communication between the package exterior and the integrated device die, while reducing contamination of the integrated device die.

Abstract: A method of manufacture of a sensor, the method comprising, in a first fabrication facility, forming one or more components of the sensor on a substrate; and in a second fabrication facility depositing a sensor layer, such as a magnetoresistive sensor, onto the substrate or over the one or more components. Otherwise contaminating effects of depositing magnetoresistive materials can thus be confined to the second fabrication facility, permitting more advanced fabrication equipment and techniques to be employed in the first fabrication facility.

Abstract: A receiver apparatus models and corrects the frequency-dependent and the frequency-independent mismatches between I and Q paths jointly by polynomial estimations. The receiver apparatus may sample digitized I and Q path signals. The sampled data point may be modeled in equations with real and imaginary components. The sampled discrete time-domain data may be converted to frequency-domain data. Multiple statistics values based on the frequency-domain data may be computed. Coefficients for the polynomial equations may be estimated based on the computed statistic values. The channel mismatches may be estimated from the polynomial equations and used to compensate the mismatch either on the I path or the Q path.

Abstract: A variable gain amplifier has an attenuator having an input and a series of tap points, and a series of low-inertia switches, each switch coupled to a corresponding one of the tap points to steer outputs from the attenuator to an output terminal. An amplifier has an input cell, a load coupled to an output of the input cell, a buffer having an input coupled to the load, a feedback network coupled between an output of the buffer and the input cell, and a variable filter cell coupled to the input cell.

Abstract: Apparatus and methods for precision mixed-signal electronic circuit protection are provided. In one embodiment, an apparatus includes a p-well, an n-well, a poly-active diode structure, a p-type active region, and an n-type active region. The poly-active diode structure is formed over the n-well, the p-type active region is formed in the n-well on a first side of the poly-active diode structure, and the n-type active region is formed along a boundary of the p-well and the n-well on a second side of the poly-active diode structure. During a transient electrical event the apparatus is configured to provide conduction paths through and underneath the poly-active diode structure to facilitate injection of carriers in the n-type active region. The protection device can further include another poly-active diode structure formed over the p-well to further enhance carrier injection into the n-type active region.

Abstract: Disclosed is a micro-electro-mechanical switch, including a substrate having a gate connection, a source connection, a drain connection and a switch structure, coupled to the substrate. The switch structure includes a beam member, an anchor, an anchor beam interface and a hinge. The beam member having a length sufficient to overhang both the gate connection and the drain connection. The anchor coupling the switch structure to the substrate. The anchor beam interface coupling the anchor to the hinge. The hinge coupling the beam member to the anchor at a respective position along the anchor's length, the hinge to flex in response to a voltage differential established between the gate and the beam member. The switch structure having gaps between the substrate and the anchor in regions proximate to the hinges.

Abstract: Embodiments of the present disclosure may provide a charge redistribution DAC with two sets of capacitors that provides a DAC output by sharing charges between a plurality of pairs of capacitors in lieu of charging the capacitors using traditional external reference voltages. The charge redistribution DAC may comprise a plurality of pairs of first and second capacitors that each has a first side and a second side, and a group of first switches and a group of second switches. Each first or second switch selectively controls connection of the first side of a respective first or second capacitor to one of a pair of output signal lines according to a DAC input word. The charge redistribution DAC further may comprise a group of bridging switches each connected between second sides of paired first and second capacitors.

Abstract: A digital-to-analog converter (DAC) includes a resistor leg that is switchably connected to a first voltage reference via an n-channel MOSFET and to a second voltage reference via a p-channel MOSFET, and a generator circuit. The generator circuit further includes a first sub-circuit for generating a drive voltage (Vgn) and a second sub-circuit for a) offsetting the first drive voltage by an offset voltage to generate a second drive voltage, and b) supplying the second drive voltage to a gate of one of the first NMOS and the first PMOS.

Abstract: A package for an electronic chip including an optical component protects the chip and the component, while allowing for an optical connection of the component with another optical device. This is achieved, in various embodiments, by forming a well in a protective material deposited over the chip to expose the optical component, and by providing alignment features in the protective material to align and connect the optical component with another optical device.

Abstract: An operational amplifier can include a plurality of amplifiers connected to form a plurality of amplification paths extending from an input terminal to an output terminal of the operational amplifier. An amplifier in one of the amplification paths can include an intrinsic amplification-transistor capacitance connected between a first amplifier input and a first amplifier output, and a cross-coupling capacitor connected between the first amplifier input and a second amplifier output. A plurality of the amplification paths can include series-connected amplifiers connected in parallel with the cross-coupled amplifier. The cross-coupling capacitor can have a capacitance value selected as a function of the intrinsic capacitance and a gain experienced between the amplifier inputs and outputs. The operational amplifier can include an AC coupling capacitor connected in series with the cross-coupled amplifier. The operational amplifier can be arranged in feedback configuration.

Abstract: A system and method for reducing gain error and distortion in an operational amplifier due to errors in the second or integrator stage. A correction circuit may replicate an error current and insert the current into the signal stream to preempt the induction of an error at the amplifier's input. A capacitor may sample the error voltage at the input of the integrator stage of the amplifier and generate a replica of the error current in the integration capacitor to feed it into the input of the integrator stage. This eliminates any nonlinearity errors created by error currents in the compensation or integration capacitor at the second or integrator stage of the two-stage amplifier. Feeding the error current to the integrator stage may be facilitated with a unity gain buffer and a current mirror.

Abstract: A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.

Abstract: A microphone system implements multiple microphones on a single base. To that end, the microphone system has a base, and a plurality of substantially independently movable diaphragms secured to the base. Each of the plurality of diaphragms forms a variable capacitance with the base and thus, each diaphragm effectively forms a generally independent, separate microphone with the base.

Abstract: A switching device for heterojunction integrated circuits is disclosed. According to one aspect, the switching device is configured to protect a circuit from an electro-static discharge (ESD) event. The switching device includes a second base contact region that is configured to be electrically floating, a first base contact region and a collector contact region that are coupled to a first input terminal of the switching device, and an emitter contact region that is coupled to a second input terminal of the switching device. Due in part to capacitive coupling between the first base contact region and the second base contact region, the switching device exhibits a low transient trigger voltage and a fast response to ESD events. Further, the switching device exhibits a high DC trigger voltage (for example, greater than 20V), while maintaining relatively low leakage current during operation (for example, less than about 0.5 ?A at 20V DC.

Abstract: A system and method are provided for a PTAT cell with no resistors which can operate at low power, has less sensitivity to process variation, occupies less silicon area, and has low noise. Further, a system and method are provided to scale up the reference voltage and current through a cascade of unit cells. Still further, a system and method are provided for PTAT component to be fine-tuned, advantageously providing less process variability and less temperature sensitivity.

Abstract: A clock shifter circuit may receive a input clock in a first voltage domain and may generate a level-shifted output clock in a second voltage domain. The circuit may include a cross-coupled pair of transistor switches and a pair of capacitors. Each switch may have a drain coupled to one of the capacitors, a source coupled to a circuit supply voltage, and a gate coupled to the other capacitor. One capacitor may receive a true input clock version, while the other may receive a complement version. Each capacitor, in an alternating manner, may activate an opposing transistor switch to charge its capacitor during an active phase of its respective input clock. The circuit may generate the output clock from an output node connected between one of the transistor switches and its capacitor. The output clock may drive a load directly coupled to the output node.