Abstract: An illumination system is disclosed that had a plurality of moveable reflective elements and associated actuators which may be configured to form an illumination mode. One or more of the actuators is arranged to move between first, second and third positions, and so move an associated moveable reflective element between first, second and third orientations, the first and second orientations being such that radiation reflected from the moveable reflective element forms part of the illumination mode, and the third orientation being such that radiation reflected from the moveable reflective element does not form part of the illumination mode.

Abstract: Position and curvature information of a patterning device may be determined directly from the patterning device and controlled based on the determined information. In an embodiment, a lithographic apparatus includes a position determining system operative to determine a relative position of the patterning device. The patterning device may be configured to create a patterned radiation beam from a radiation beam incident on a major surface of the patterning device. The patterning device may have a side surface having an edge in common with the major surface. The position determining system may include an interferometer operative to transmit light to the side surface and to receive the transmitted light after the transmitted light has been reflected at the side surface. The position determining system is operative to determine a quantity representative of the relative position of the patterning device from the received reflected transmitted light.

Abstract: Liquid is supplied to a space between the projection system of a lithographic apparatus and a substrate. A flow of gas towards a vacuum inlet prevents the humid gas from escaping to other parts of the lithographic apparatus. This may help to protect intricate parts of the lithographic apparatus from being damaged by the presence of humid gas.

Abstract: Liquid is supplied to a space between the projection system and the substrate by an inlet. In an embodiment, an overflow region removes liquid above a given level. The overflow region may be arranged above the inlet and thus the liquid may be constantly refreshed and the pressure in the liquid may remain substantially constant.

Abstract: A control method is provided for controlling a heating of a thermal optical element, the thermal optical element having a matrix of heater elements. The method includes stabilizing a nominal temperature of the thermal optical element with a feedback loop to control the heating of heater elements; providing a desired temperature profile of the thermal optical element by a set point signal; determining a feedforward control of the heater elements from the set point signal; and forwardly feeding an output of the feedforward control into the feedback loop.

Abstract: An immersion liquid is provided comprising an ion-forming component, e.g. an acid or a base, that has a relatively high vapor pressure. Also provided are lithography processes and lithography systems using the immersion liquid.

Abstract: An immersion lithographic apparatus is provided with a liquid confinement structure which defines at least in part a space configured to contain liquid between the projection system and the substrate. In order to reduce the crossing of the edge of the substrate which is being imaged (which can lead to inclusion of bubbles in the immersion liquid), the cross-sectional area of the space in a plane parallel to the substrate is made as small as possible. The smallest theoretical size is the size of the target portion which is imaged by the projection system. In an embodiment, the shape of a final element of the projection system is also changed to have a similar size and/or shape in a cross-section parallel to the substrate to that of the target portion.

Abstract: Disclosed is a device manufacturing method and associated apparatus, the method comprising transferring a pattern from a patterning device onto a substrate. The method relates to the alignment of said patterning device and said substrate, and comprises imparting a radiation beam onto an alignment structure on said patterning device so as to obtain a resultant aerial image; scanning an image sensor in accordance with a scanning scheme, through a target volume containing said resultant aerial image, the relative positions of said image sensor and said substrate being known or subsequently determined; and measuring features of said image and thereby determining of the location of the alignment structure relative to the image sensor; wherein an alternative scanning scheme is used in which, for example two or more scans through the whole target volume are performed, having a total duration the same as a conventional single continuous scan.

Abstract: A lithographic apparatus for immersion lithography is disclosed in which a seal between different parts of the substrate table may be arranged to reduce the transmission of forces between the different parts.

Abstract: A BCP having first block of first monomer and second block of second monomer, adapted to undergo a transition from disordered state to ordered state at a temperature less than TOD, further including a bridging moiety having a functional group to provide hydrogen bonding between bridging moieties of adjacent first and second BCP molecules when in the ordered state and at a temperature in excess of a glass transition temperature Tg for the BCP. Composition including BCP comprising first block of first monomer and second block of second monomer, and a crosslinking compound having first and second terminal groups joined by a central moiety and arranged to crosslink second blocks of adjacent first and second BCP molecules by providing non-covalent bonding between the terminal groups and a functional group of the second monomer of the second blocks when the BCP is in the ordered state.

Abstract: A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.

Abstract: An immersion lithographic apparatus typically includes a fluid handling system. The fluid handling system generally has a two-phase fluid extraction system configured to remove a mixture of gas and liquid from a given location. Because the extraction fluid comprises two phases, the pressure in the extraction system can vary. This pressure variation can be passed through the immersion liquid and cause inaccuracy in the exposure. To reduce the pressure fluctuation in the extraction system, a buffer chamber may be used. This buffer chamber may be connected to the fluid extraction system in order to provide a volume of gas which reduces pressure fluctuation. Alternatively or additionally, a flexible wall may be provided somewhere in the fluid extraction system. The flexible wall may change shape in response to a pressure change in the fluid extraction system. By changing shape, the flexible wall can help to reduce, or eliminate, the pressure fluctuation.

Abstract: A holding device for an optical element in an objective has a mount that is connected to the objective, on the one hand, and at least indirectly to the optical element, on the other hand. Arranged between the mount and the optical element is a reinforcing element whose coefficient of thermal expansion corresponds substantially to the coefficient of thermal expansion of the optical element.

Abstract: The present invention provides a number of innovations in the area of computational process control (CPC). CPC offers unique diagnostic capability during chip manufacturing cycle by analyzing temporal drift of a lithography apparatus/ process, and provides a solution towards achieving performance stability of the lithography apparatus/process. Embodiments of the present invention enable optimized process windows and higher yields by keeping performance of a lithography apparatus and/or parameters of a lithography process substantially close to a pre-defined baseline condition. This is done by comparing the measured temporal drift to a baseline performance using a lithography process simulation model. Once in manufacturing, CPC optimizes a scanner for specific patterns or reticles by leveraging wafer metrology techniques and feedback loop, and monitors and controls, among other things, overlay and/or CD uniformity (CDU) performance over time to continuously maintain the system close to the baseline condition.

Abstract: A lithographic apparatus having an illumination system configured to condition a radiation beam, a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate; a projection system configured to project the patterned radiation beam onto a target portion of the substrate; and, an actuator arranged to exert a force on an object, wherein the apparatus includes a thermal expansion error compensator configured to avoid an error caused by thermal expansion of the object by any heat dissipated by the actuator or another heat source.

Abstract: A controller is provided that controls an actuator system having a plurality of actuators arranged to act on an object. The controller uses a gain balancing matrix to convert a first control signal, representing a set of forces desired to be provided to the center of gravity of the object into a second control signal, representing an equivalent set of forces to be provided by the plurality of actuators. The system is further configured such that a first gain balancing matrix is used at a first frequency band and a second gain balancing matrix is used at a second frequency band.

Abstract: A slit shaped area of a patterning device is illuminated to impart a radiation beam with a pattern in its cross-section. A projection system projects the patterned radiation beam onto a target portion of a substrate. As the radiation beam is scanned across the target portion of the substrate, a configuration of the projection system is adjusted and applies a pattern to the target portion. The adjusting may affect a magnitude of an image magnification component of the projection system, along the length of the slit shaped area, or an image distortion in a scan direction. The adjusting is arranged to compensate an effect on pattern overlay accuracy of a distortion of the patterning device.

Abstract: An imprint lithography apparatus is disclosed that has a first array of template holders, a second array of template holders, and a substrate table arranged to support a substrate to be imprinted, wherein the first array of template holders is arranged to hold an array of imprint templates that can be used to imprint a first array of patterns onto the substrate, and the second array of template holders is arranged hold an array of imprint templates that can be used to imprint a second array of patterns onto the substrate, the patterns imprinted by the second array being interspersed between the patterns imprinted by the first array.

Abstract: A projection system is provided that includes a sensor system that measures at least one parameter that relates to the physical deformation of a frame that supports the optical elements within the projection system, and a control system that, based on the measurements from the sensor system, determines an expected deviation of the position of the beam of radiation projected by the projection system that is caused by the physical deformation of the frame.

Abstract: In an immersion lithography apparatus or device manufacturing method, the position of focus of the projected image is changed during imaging to increase focus latitude. In an embodiment, the focus may be varied using the liquid supply system of the immersion lithographic apparatus.