Patents Assigned to Engineering
  • Patent number: 7511806
    Abstract: A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concave-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: March 31, 2009
    Assignee: Hitachi High-Tech Electronics Engineering Co., Ltd.
    Inventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ooshima, Hidetoshi Nishiyama, Tetsuya Watanabe
  • Patent number: 7510283
    Abstract: A system for diagnostically evaluating the health of tissue within the fundus of an eye includes a fs laser source, an adaptive optical assembly, an imaging unit, and a computer. The adaptive optical assembly focuses a laser beam to a focal point in the fundus of the eye, and scans the fundus tissue according to a predetermined scanning pattern. Illumination of anisotropic tissue within the fundus, such as the photoreceptors and the Henle-fiber layer, induces a Second Harmonic Generation (SHG) response. Red photons, with a wavelength (?) of about 880 nm, are converted to blue photons, with a wavelength of ?/2, through the process of photon conversion. An imaging unit senses the blue photon return light, and uses the return light to generate an image of the fundus. The computer processes the image, and compares it to a template of healthy tissue to evaluate the health of the imaged tissue.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: March 31, 2009
    Assignee: Heidelberg Engineering Optische Messsysteme GmbH
    Inventor: Josef F. Bille
  • Patent number: 7511232
    Abstract: The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed. The Ag film 4 is a metal free from oxidization at room temperature in the atmosphere. In a wet process, since only an exposed side of the Sn solder film 3 is oxidized by the cell reaction of Ag and Sn, an upper surface of the Ag film 4 on the solder film, which would otherwise affect the connection, is not oxidized. Since the Ag film 4 melts into the Sn solder simultaneously with melting of the Sn solder film 3, the Ag film 4 does not hinder the connection.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: March 31, 2009
    Assignee: Hitachi Kyowa Engineering Co., Ltd.
    Inventors: Shohei Hata, Naoki Matsushima, Takeru Fujinaga
  • Patent number: 7510909
    Abstract: A fabricating method of wafer protection layers and a wafer structure are provided. The fabricating method includes providing a wafer first. The wafer includes pluralities of chips and has an active surface, a corresponding reverse surface and a plurality of pre-cut trenches on the active surface. On the active surface, pluralities of bumps are disposed. Next, a first curing-type protection layer and a pellicle are disposed over the active surface. Afterwards, the first curing-type protection layer is asked to contact the active surface. Besides, a second curing-type protection layer is disposed on the reverse surface. Afterward, the first and the second curing-type protection layer are cured. Finally, the wafer is cut through the pre-cut trenches to separate the chips from the wafer.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: March 31, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Yu-Pin Tsai
  • Patent number: 7510130
    Abstract: A method provides in a fluid device an orifice aperture having an exact aperture size and easy changeability of that size. While being brought into communication with a connecting pipe through an intersecting inner aperture drilled in a lower plate of a device main body, two inner apertures with their one ends opening to a recessed portion are each provided with a female thread. An orifice member provided with a through-hole having an inside diameter corresponding to an orifice aperture and communicating with a hexagon socket into which a hexagon bar spanner wrench is internally fit, is threaded into each female thread whereby the orifice member is mounted. Finally, a covering member is sealingly threaded into an opening of the other end of each inner aperture. Air supplied from the connecting pipe passes through the through-hole serving as the orifice aperture and is blown into oil stored within the recessed portion from an end opening.
    Type: Grant
    Filed: December 5, 2002
    Date of Patent: March 31, 2009
    Assignee: Fuji BC Engineering Co., Ltd.
    Inventor: Tsutomu Inoue
  • Patent number: 7509936
    Abstract: An engine with a hybrid crankcase includes the crankcase being a composite construction having an exoskeleton formed of a non-ferrite material having no defined endurance limit as a material, the non-ferrite exoskeleton encapsulating a load bearing skeleton formed of a ferrite material, the ferrite material having a well defined endurance limit, whereby the skeleton acts to carry the highest engine loadings. A method of forming such an engine is further included.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: March 31, 2009
    Assignee: Engineered Propulsion Systems, Inc.
    Inventors: Steven M. Weinzierl, Michael J. Fuchs
  • Patent number: 7510299
    Abstract: A light tube for replacing fluorescent tubes including a bulb portion and a pair of end caps disposed at opposite ends of the bulb portion, and configured for illumination by a power supply circuit. A plurality of light emitting diodes are disposed inside the bulb portion and in electrical communication with a pair of end caps for illuminating in response to electrical current to be received from the power supply circuit.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: March 31, 2009
    Assignee: Altair Engineering, Inc.
    Inventors: Jos Timmermans, Jean C. Raymond, John Ivey
  • Patent number: 7510227
    Abstract: An automotive vehicle includes a floor, an outboard seat and an inboard seat. The floor extends transversely between opposite sides of the vehicle. The outboard seat and inboard seat are arranged in a transversely extending row along the floor of the vehicle, wherein the inboard seat is disposed at an inboard position and the outboard seat is disposed at an outboard position. The inboard seat is slidably coupled to the floor for transverse sliding movement between the inboard and outboard positions. The outboard seat is tiltable to accommodate displacement of the inboard seat between the inboard and outboard positions.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: March 31, 2009
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Jennifer Mahaffy
  • Patent number: 7509977
    Abstract: Devices and methods for evenly distributing sludge, including manure and industrial sludge, to numerous hoses, over a large range of sludge supply pressures. Some devices include a housing having an inlet for receiving sludge under pressure and several outlets disposed outwardly through the housing cylindrical wall for coupling to hoses. The devices can include a rotating plate within the housing sweeping one or more baffles over the outlets to momentarily occlude the outlets and reduce flow through the occluded outlets. The baffles can include a first portion secured to the plate and a second portion removably secured to the first portion and/or the plate. Changing the total length of the baffles can change the affective cross-sectional area of the outlets available for flow at any instant in time.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: March 31, 2009
    Assignee: Hydro Engineering, Inc.
    Inventor: Thomas R. Huffman
  • Patent number: 7510138
    Abstract: The present device provides a breakdown reel that includes a spool barrel, at least one flange and likely two, one disposed at each end of the barrel, and a locking mechanism such that the flange lockingly engages and removeably disengages the barrel. The locking mechanism is divided into two sections, one is conjoined with the barrel and the other is conjoined with the flange. The two sections of the locking mechanism provide the unique the locking and unlocking action.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: March 31, 2009
    Assignee: Pittsfield Plastics Engineering, Inc.
    Inventors: David Chiorgno, Peter J. Olsta
  • Patent number: 7510103
    Abstract: To deliver a liquid at high speed and with high accuracy. A device for delivering a fixed quantity of liquid, comprising a pump section for metering the delivered liquid to provide a desired amount consisting of a plunger chamber formed in a cylinder block, and a plunger reciprocating in the plunger chamber, a valve section for switching between liquid flow channels for suction and delivery, a reservoir section for reserving liquid adapted to communicate with the pump section depending upon the position of the valve section, and a delivery section having a delivery port for delivering liquid, the device being characterized in that the pump section and the valve section are disposed connected to each other and that the maximum advance position of the plunger is defined by a plane where the front end surface of the plunger contacts the valve section and pump section. The valve section is removably disposed in the pump section.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: March 31, 2009
    Assignee: Musashi Engineering, Inc.
    Inventor: Kazumasa Ikushima
  • Publication number: 20090078538
    Abstract: A bulk material handling accessory such as a conveyor belt cleaner for use in connection with a bulk material handling system. The bulk material handling accessory includes a main frame, a scraping member including an arm and a scraper blade pivotally attached to the main frame, and a damper mechanism coupled at one end to the main frame and at another end to the scraping member. A mounting mechanism is attached to the main frame for providing linear and rotational movement of the main frame and the associated scraping member and damper mechanism. The damper mechanism includes a damper having a piston and a housing having a fluid chamber. The viscosity of the fluid within the fluid chamber is selectively changeable to change the damping characteristics of the damper mechanism to accommodate changes in operating conditions.
    Type: Application
    Filed: December 3, 2008
    Publication date: March 26, 2009
    Applicant: Martin Engineering Company
    Inventors: R. Todd Swinderman, Cristian Vava
  • Publication number: 20090077906
    Abstract: Trailer shelters having foam head and side members are described herein. An over road trailer shelter configured in accordance with one embodiment includes a flexible head curtain configured to extend horizontally along a top portion of an opening in a warehouse or other building. The flexible head curtain can include at least one fabric flap hingeably attached to an exterior surface of a base fabric layer. The fabric flap is configured to protect the head member from damage resulting from repeated trailer contact. A trailer enclosure configured in accordance with another embodiment includes a head member that extends horizontally between first and second side members. Each of the side members and the head member includes a compressible foam portion covered by a fabric portion. In addition, each of the side members supports a flexible side curtain that extends inwardly to seal against the sides of the trailer.
    Type: Application
    Filed: September 24, 2007
    Publication date: March 26, 2009
    Applicant: 4Front Engineered Solutions, Inc.
    Inventors: Joseph J. Tramonte, JR., Ralph W. Moody
  • Publication number: 20090078582
    Abstract: An apparatus for electrolyzing sulfuric acid, the apparatus comprising an electrolytic cell comprising a cathode chamber having a cathode and an anode chamber having an anode, the cathode chamber and the anode chamber being separated by a diaphragm, a sulfuric acid tank configured to store the sulfuric acid, a supply pipe connecting the sulfuric acid tank to an inlet port of the anode chamber, a connection pipe connecting an outlet port of the cathode chamber to the inlet port of the anode chamber, a first supply pump provided on the supply pipe and configured to supply the sulfuric acid from the sulfuric acid tank to the cathode chamber through the supply pipe, and a drain pipe connected to an outlet port of the anode chamber and configured to supply to a solution tank a solution containing an oxidizing agent generated by electrolysis in the anode chamber.
    Type: Application
    Filed: November 20, 2008
    Publication date: March 26, 2009
    Applicants: Shibaura Mechatronics Corporation, Kabushiki Kaisha Toshiba, Chlorine Engineers Corp., Ltd
    Inventors: Nobuo Kobayashi, Yukihiro Shibata, Naoya Hayamizu, Masaaki Kato
  • Publication number: 20090079045
    Abstract: A quad-flat non-leaded (QFN) multichip package and a multichip package are provided. The QFN multichip package includes a lead frame, a first chip, a second chip and a molding compound. The lead frame has a plurality of first leads and second leads alternately arranged with each other. Each first lead includes a first connection portion and a first contact portion. Each second lead includes a second connection portion, a bending part and a second contact portion. The bending part is bent upward such that an interval is formed between the second contact portion and the first contact portion. The first chip is disposed between the first leads and the second leads. The second chip is disposed above the first chip. The molding compound encloses the first chip, the second chip, the first leads and the second leads, and further exposes the lower surfaces of the first and the second leads.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 26, 2009
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chih-Min Pao
  • Patent number: 7507907
    Abstract: A cable feed-through is provided in accordance with the present invention. The cable feed-through comprises a housing which can be fixed to an appliance, a fixing device for a cable held on the housing and a shield contact element held on the housing. The shield contact element comprises a bristle element for making contact with a cable shield with elastic and electrically conductive bristles.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: March 24, 2009
    Assignee: Lapp Engineering & Co.
    Inventors: Daniel Mueller, Peter Runze
  • Patent number: 7506486
    Abstract: A modular packaging system includes a base system configured to manipulate a product and configured to receive at least one of a group of packaging modules, wherein the base system is used with a variety of packaging modules depending on a desired packaged output. The system also includes a first packaging module selectively coupled to the base system, the packaging module having a first member coupled to the packaging module, the member configured to manipulate an object. The system may also include a second packaging module selectively coupled to the base system, the second packaging module having a lifting device coupled to the second packaging module, the lifting device configured to manipulate an object.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: March 24, 2009
    Assignee: Infinity Machine & Engineering Corp.
    Inventors: Thomas S. Wegner, Peter T. Hunnicutt, Douglas P. Wegner, Jeffrey D. Cogswell, Scott A. Santaga, Michael A. Yuenger
  • Patent number: 7507328
    Abstract: A process for the selective hydrodesulfurization of olefinic naphtha streams containing a substantial amount of organically-bound sulfur and olefins. The olefinic naphtha stream is selectively desulfurized in a hydrodesulfurization reaction stage. The hydrodesulfurized effluent stream is separated into a light and heavy liquid fraction and the heavier fraction is further processed in a mercaptan destruction reaction stage to reduce the content of mercaptan sulfur in the final product.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: March 24, 2009
    Assignee: ExxonMobile Research and Engineering Company
    Inventors: Edward S. Ellis, John P. Greeley, Vasant Patel, Murali V. Ariyapadi
  • Patent number: 7507327
    Abstract: Refractory or hard sulfur found in a hydrocarbon stream containing refractory sulfur heterocycle compounds, particularly those exhibiting steric hindrance, is removed from the stream by contacting it with a sodium reagent comprising a sodium component, having free sodium, supported on a solid support component. If the hydrocarbon stream contains more labile or easy sulfur, then it is treated, typically by hydrodesulfurization, to remove at least most of the labile sulfur before it is contacted with the sodium reagent. This is useful for bringing the sulfur level of middle distillate fuel streams, such as diesel and jet fuel fractions, down to a level of less than about 10 wppm, employing conventional hydrodesulfurizing catalysts and conditions.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: March 24, 2009
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Jeffrey M. Dysard, Zhigou Hou, Jonathan M. McConnachie, Andrzej Malek, Ramesh Gupta, William E. Lewis
  • Patent number: 7508068
    Abstract: One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
    Type: Grant
    Filed: February 1, 2007
    Date of Patent: March 24, 2009
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Atsuhiro Yoshizaki, Keiichi Mashino, Hiromichi Anan, Yoshitaka Ochiai