Abstract: A vehicle seat assembly includes a seat cushion and a seat back. The seat back is pivotally coupled to the seat cushion for movement between a generally upright seating position and a folded flat position overlying the seat cushion. The seat back has a front seating surface and an opposite back surface. The back surface has a console with at least one compartment with a hinged lid for storing objects therein.
Type:
Grant
Filed:
December 1, 2006
Date of Patent:
April 28, 2009
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc.
Inventors:
Vikas Bhatia, Hamshivraj Singh Dhamrat, Robert Christopher Day, Masroor Fahim, Bill Deming, Michael Anthony Zielinski, George Mike Chalhoub
Abstract: The present invention relates to a three dimensional, malleable cell culture composition and method of forming the same comprising hyaluronic acid, chitosan and a polyelectrolytic complex of hyaluronic acid and chitosan. These three components in combination constitute an initial microenvironment for support of stromal cells, and their undifferentiated mesenchymal cell progeny. The tissue engineering device and method of forming the same comprising hyaluronic acid and chitosan and the use of said device with compositions of pluripotent cells and various formulations of cell culture media for repair of tissues is disclosed.
Abstract: A windshield wiper for an automotive vehicle having an elongated base and an elongated flexible blade extending outwardly in a first direction from the base. The blade has a free edge adapted to contact a windshield on an automotive vehicle. An elongated scraper also extends outwardly from the base at an acute angle relative to the blade so that a free edge of the scraper is spaced from and generally parallel to the free edge of the blade. The scraper is constructed of a material more rigid than the blade to remove adhered debris from the windshield upon transverse movement of the windshield wiper.
Type:
Grant
Filed:
June 6, 2007
Date of Patent:
April 28, 2009
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
Type:
Grant
Filed:
December 29, 2004
Date of Patent:
April 28, 2009
Assignee:
Advanced Chip Engineering Technology Inc.
Abstract: A programmable processor and method for improving the performance of processors by incorporating an execution unit operable to decode and execute single instructions specifying both a mask and a register containing data, the mask comprising fields that each correspond to a field of the data contained in the register, the execution unit is operable to detect some of the fields of the mask as having a predetermined value and identifying corresponding fields of the data contained in the register as write-enabled data fields; and cause the write-enabled data fields to be written to a specified memory location.
Abstract: A method of determining the presence and location of leaks in a pipeline (2) comprising inserting a leak location device capable of detecting and recording the occurrence of noise into the flow of fluid (1) within the pipeline (2); allowing the leak location device to travel through the pipeline (2) with the fluid flow; causing the leak location device to detect and record noise in the fluid; and causing the leak location device to record the time at which noise is detected. Generally the leak location device is retrieved from the pipeline (2) downstream to its insertion point.
Type:
Grant
Filed:
December 24, 2003
Date of Patent:
April 28, 2009
Assignee:
Advnaced Engineering Solutions Ltd.
Inventors:
Martin Thompson, Martin Francis Lucien Harper
Abstract: A method of reinforcing a metal panel or pipe of an existing structure comprising the steps of attaching a reinforcing metal layer to said metal panel or pipe in spaced apart relation to thereby form at least one cavity between inner surfaces of said metal panel and said reinforcing metal layer, injecting an intermediate layer comprised of an uncured plastics material into said at least one cavity, and curing said plastics material so that it adheres to said inner surfaces of said metal panel or pipe and said reinforcing metal layer.
Abstract: An adaptor for converting the oil filtering of engines, so equipped, from internal paper-based cartridge type oil filters to automotive type spin-on oil filters is disclosed herein. The adaptor includes a mount which has screw threads at one end to allow mounting to the oil filter cavity housing in the engine. The mount has screw threads at the other end to allow the mounting of a housing as well as the spin-on oil filter. An axial hollow port in the mount allows the flow of filtered, pressurized oil from the spin-on oil filter into the main engine oil galley. The housing attached to the mount provides a sealing surface for the spin-on oil filter to mate against, thus completing the installation. The housing includes ports for the delivery of pressurized, unfiltered oil from the engine oil filter cavity to the intake ports of the spin-on oil filter.
Abstract: Severely sterically hindered secondary aminoether alcohols are prepared by reacting organic carboxylic, organic carboxylic acid halides, acid anhydrides or a ketene with an alkyl, alkaryl or alkylhalo sulfonate to yield a sulfonic-carboxylic anhydride compound which is then reacted with a dioxane to cleave the ring of the dioxane, yielding a cleavage product which cleavage product is then aminated with an alkylamine and hydrolyzed with base to yield the severely sterically hindered secondary aminoether alcohol.
Type:
Grant
Filed:
February 1, 2005
Date of Patent:
April 28, 2009
Assignee:
ExxonMobil Research and Engineering Company
Inventors:
Michael Siskin, Alan Roy Katritzky, Kostyantyn Mykolayevich Kirichenko, Adeana Richelle Bishop, Christine Nicole Elia
Abstract: The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate.
Type:
Grant
Filed:
March 19, 2007
Date of Patent:
April 28, 2009
Assignee:
Advanced Chip Engineering Technology, Inc.
Abstract: A combination of differently sized structured packings in the wash zone of distillation towers is provides advantages at high vapor rates. The use of a large crimp structured packing below a smaller crimp size structured packing is advantageous for vacuum crude unit service where fouling resistance is desirable and liquid entrainment into the wash zone is a problem at high vapor rates. The tower may be operated at high vapor flux rates or C 0.4 ft/sec or higher (0.12 m/sec). An unexpected characteristic of the combinations is that the entrainment increases only slowly with increasing vapor flux rate up to Cs values of at least 0.55 ft/sec (0.17 m.sec), as compared to other packings such as random packing, grid packing and combinations of grid packing with structured packing which allow entrainment to increase sharply at high vapor rates.
Type:
Application
Filed:
September 30, 2008
Publication date:
April 23, 2009
Applicant:
ExxonMobil Research and Engineering Company
Inventors:
Theodore Sideropoulos, Andrew P. Sullivan, Arun K. Sharma, Berne K. Stober, Vikram Singh, Brian A. Albert
Abstract: A process for determining an optimum range of compositions for a nanocomposite thermoelectric material system, within which the material may exhibit generally high figure of merit values, is provided. The process is performed for a nanocomposite thermoelectric material system having a first component and a second component made from nanoparticles. The process includes selecting a plurality of material compositions for a nanocomposite thermoelectric material system to be investigated and calculating a thermal conductivity value and calculating an electrical resistance value for each material composition selected. In addition, at least one Seebeck coefficient is determined for the material compositions selected. Then, a plurality of figure of merit values are calculated using the calculated plurality of thermal conductivity values, the calculated plurality of electrical resistivity values and the determined at least one Seebeck coefficient.
Type:
Application
Filed:
October 19, 2007
Publication date:
April 23, 2009
Applicant:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: A flip chip package structure including a chip, a carrier, and a plurality of bumps is provided. The chip has a bonding surface and a plurality of bump pads thereon. The carrier is disposed corresponding to the chip and includes a substrate and a plurality of pre-solders. The substrate has a carrying surface and a patterned trace layer thereon. The patterned trace layer has a plurality of traces, and each of the traces has an outward protruding bonding portion corresponding to the bump. The line width of the bonding portion is greater than that of the trace. The pre-solders are disposed on the bonding portions, respectively. The bumps are disposed between the bump pads and the corresponding pre-solders such that the chip is electrically connected to the carrier through the bumps.
Type:
Application
Filed:
August 15, 2008
Publication date:
April 23, 2009
Applicant:
Advanced Semiconductor Engineering, Inc.
Inventors:
Jen-Chuan Chen, Chi-Chih Shen, Hui-Shan Chang, Tommy Pan
Abstract: A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors.
Type:
Application
Filed:
October 1, 2008
Publication date:
April 23, 2009
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: A vehicle navigation system through an area having a plurality of objects. A Voronoi decomposition on the area is first constructed having a number of edges surrounding the obstacles. A Voronoi field having a value between zero and an upper limit is calculated for geometric locations within the area such that the field reaches a maximum value within obstacles and a minimum value on the edges. A transversal cost between adjacent locations in the area from the position of the vehicle and toward a destination is calculated in which the transversal cost increases proportionately with the value of the field. A route is then planned from the position of the vehicle to the destination which minimizes the transversal cost.
Type:
Application
Filed:
October 22, 2007
Publication date:
April 23, 2009
Applicant:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: A programmable processor and method for improving the performance of processors by expanding at least two source operands, or a source and a result operand, to a width greater than the width of either the general purpose register or the data path width. The present invention provides operands which are substantially larger than the data path width of the processor by using the contents of a general purpose register to specify a memory address at which a plurality of data path widths of data can be read or written, as well as the size and shape of the operand. In addition, several instructions and apparatus for implementing these instructions are described which obtain performance advantages if the operands are not limited to the width and accessible number of general purpose registers.
Type:
Application
Filed:
October 31, 2007
Publication date:
April 23, 2009
Applicant:
MicroUnity Systems Engineering, Inc.
Inventors:
Craig Hansen, John Moussouris, Alexia Massalin