Abstract: A turbine comprises a turbine wheel having radial blades and supported in a housing for rotation about an axis. An annular inlet passageway extends radially inwards towards the turbine wheel, the inlet passageway being defined between first and second facing annular walls. An annular array of vanes extend across the inlet passageway. Each vane has a trailing edge extending adjacent the turbine wheel blades, wherein the trailing edge of each vane deviates from a straight line over at least a portion of its length defined between its ends.

Abstract: A semiconductor package comprises a first chip, a substrate, a middle layer, a second chip, and an encapsulant. The first chip has an active surface and a high-frequency element defining a high-frequency area on the active surface. The substrate supports the first chip and is electrically connected to the first chip. The middle layer is disposed on the first chip and has a recess corresponding to the high-frequency area. The second chip is disposed on the middle layer and electrically connected to either the first chip or the substrate. The encapsulant encapsulates the first chip, the middle layer, the second chip, and a part of the substrate.

Abstract: A predetermined number of license units for each of a plurality of individually selectable pieces of digital content in a digital content suite are checked out when each piece of digital content is executed by a customer in a customer club. Execution of a requested digital content is granted when the number of license units to execute the requested digital content is less than or equal to the total number of available units for the club. Access is granted for execution of the requested digital content by a license manager based on whether the required units of the requested digital content are greater than the available units on the requesting customer computer network. If the requested digital content cannot be executed immediately, the required units can be locked up and charged to the customer club available units or left uncharged.

Abstract: An MRIS gradient coil structure has coiled tubes for carrying a cooling medium to cool the coil structure. The inlet and outlet (15, 26) of the coiled tubes are insulated electrically from the remainder thereof by a ceramic insulator (20).

Abstract: A manufacturing method of a semiconductor device for a wire-bonding and flip-chip bonding package mainly comprises the following steps. First, a chip having a plurality of bonding pads and a passivation layer exposing the bonding pads is provided. Next, an under bump metallurgy layer having an aluminum layer, a nickel-vanadium layer and a copper layer is formed on each of the bonding pads. Then, a portion of the copper layer and the nickel-vanadium layer formed over some of the bonding pads is removed so as to leave a portion of the copper layer and the nickel-vanadium layer remained over some of the bonding pads to form patterned copper layers and patterned nickel-vanadium layers. Next, a plurality of solder bumps are formed on the patterned copper layers. Finally, a reflowing process is performed to have the solder bumps secured to the patterned copper layers. In addition, a semiconductor device formed by the manufacturing method is provided.

Abstract: A two stage hydrodesulfurizing process for producing low sulfur distillates. A distillate boiling range feedstock containing in excess of about 3,000 wppm sulfur is hydrodesulfurized in a first hydrodesulfurizing stage containing one or more reaction zones in the presence of hydrogen and a hydrodesulfurizing catalyst. The liquid product stream thereof is passed to a first separation stage wherein a vapor phase product stream and a liquid product stream are produced. The liquid product stream, which has a substantially lower sulfur and nitrogen content then the original feedstream is passed to a second hydrodesulfurizing stage also containing one or more reaction zones where it is reacted in the presence of hydrogen and a second hydrodesulfurizing catalyst at hydrodesulfurizing conditions. The catalyst in any one or more reaction zones is a bulk multimetallic catalyst comprised of at least one Group VIII non-noble metal and at least two Group VIB metals.

Abstract: A manufacturing method of a flip chip package mainly comprises the following steps. Initially, a chip having an active surface with a plurality of bumps formed thereon is provided. Next, the active surface of the chip is faced to and disposed on an upper surface of a substrate. In such manner, the chip will be electrically connected to the substrate and a gap between the chip and the substrate will be formed. Afterwards, an underfill is filled in the gap and then a first curing process is performed to have the underfill partially hardened to have the underfill transformed into a partially hardened underfill. Finally, the combination of the chip, the substrate and the partially hardened underfill is flipped over to have the substrate located above the chip, then a second curing process is performed to have the partially hardened underfill into a fully hardened underfill, and then flipping over the combination of the chip, the substrate and the fully hardened underfill.

Abstract: A bumping process is disclosed. The bumping process comprises the steps of: providing a wafer having a plurality of bonding pads and a passivation layer, wherein the passivation layer exposes the bonding pads; forming an UBM layer over the wafer to cover the bonding pads; forming two or more photoresist layers over the wafer, wherein the photoresist layers have different exposure and development characteristics; forming at least one or more stair-shaped openings in the photoresist layers by a single exposure corresponding to the bonding pads; filling solder into the stair-shaped openings to form a plurality of solder bumps; removing the entire photoresist layer. The bumping process can provide bumps with higher heights, so that the connection between chips and carriers becomes more reliable.

Abstract: A grabbing member comprises at least two moveable grabbing arms which are moveable from a first configuration to a second configuration. The arms are moved toward one another from the first configuration to a second configuration such that the arms are capable of grabbing the item which may be a bundle of envelopes, books or other printed materials. A movement mechanism is provided such that the grabbing member is capable of moving the items from outwith a container or box to inside the box. A box closure apparatus is also provided for closing at least two lids of a box about an opening of the box. A work station comprising a viewing means which is arranged to permit 360 degrees of viewing area of envelopes to an operator is also provided.

Abstract: A dual-channel, double-filtering, multi-pass OSA having a narrow spectral linewidth response and high ORR comprises a diffraction grating (DG), two input ports (P1?, P1?) for directing first and second input light beams (LR, LT) onto the grating; a retroreflector (RAM1) for returning the dispersed light beams to the grating for dispersion again; two intermediate output ports (P2?, P2?) for receiving the twice-dispersed light beams; two secondary input ports (P3?, P3?) coupled to the intermediate output ports by polarization-maintaining waveguides (PMF2?, PMF2?) for directing the light beams onto the grating a third time, with their SOPs having a predetermined orientation relative to the SOPs of the first and second light beams when first incident upon the grating, the retroreflector (RAM1) returning the three-times-dispersed light beams to the grating for dispersion a fourth time; and two output ports (P4?, P4?) for receiving the light beams after dispersion the fourth time.

Abstract: A coil has foil conductor windings which are formed into self leads and provide a stable mount to a printed circuit board or the like. End portions of the foil windings, having conductive opposite sides, are cut and formed into stacks. The stack configuration forms the self leads of the foil winding and facilitates the winding's exit from the coil. The self leads extend from the coil and are formed to reach to the printed circuit board (PCB). The self leads are strong enough to mount the coil to the PCB. The ends of the self leads are trimmed to fit through holes in the PCB. After insertion, the layers of the self leads are bent in opposing directions to substantially block the hole, prevent extraction, and prevent solder from flowing through the holes. The self leads are then soldered to the board. A bobbin having discontinuous flanges facilitates the exits of the self leads from the coil. The invention is useful in coils, inductors, transformers, and the like.

Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.

Abstract: For each of the injection holes on the face of a plate member which is disposed in a fuel passage, grooves are provided which run along the circumferential direction of the respective injection holes, and at the positions of the grooves, fuel overflows are formed. As a result, contracted fuel flow portions are formed in the injection holes, so that the maximum flow velocity of fuel is increased at the injection hole outlet portions. Thus, a fuel injection valve for an internal combustion engine is provided, in which the atomization performance near the injection holes is effectively enhanced.

Abstract: A display device has a driver including a level converter formed of polysilicon MISTFTs. The level converter includes first, second and third N-channel MISTFTs (NMISTFTs) and first, second and third P-channel MISTFTs (PMISTFTs). Gate and first terminals of the first NMISTFT and PMISTFT, and a gate terminal of the third PMISTFT are coupled to an input terminal via a capacitance. Second terminals of the second NMISTFT and PMISTFT, and a gate terminal of third NMISTFT are coupled to the input terminal via a capacitance. A first terminal of the third PMISTFT, and second terminals of the first NMISTFT and PMISTFT are coupled to a high voltage. A second terminal of the third NMISTFT, gate and first terminals of the second NMISTFT and PMISTFT are coupled to a low voltage. A second terminal of the third PMISTFT and a first terminal of the third NMISTFT are connected to an output terminal.

Abstract: An under bump metallurgy structure is applicable to be disposed above the wafer and on the bonding pads of the wafer. The wafer comprises a passivation layer and an under bump metallurgy structure. The passivation layer exposes the wafer pads, and the under bump metallurgy structure including an adhesive layer, a first barrier layer, a wetting layer and a second barrier layer are sequentially formed on the bonding pads. Specifically, the material of the second barrier mainly includes lead.

Abstract: A karabiner comprises a generally C-shaped body, with its free ends curved towards each other and forming a gap therebetween, a gate for closing the gap, and a roller mounted in a recess at one end of the body to act as a runner for ropes and the like.

Abstract: A system and related method for generating an illustration of a first device, with the first device being one device of a plurality of such devices, the system having a plurality of illustration templates with each illustration template corresponding to one device of the plurality of devices, a device for choosing one illustration template corresponding the first device of said plurality of devices, and a device for modifying the illustration template for the first device responsive to features of the first device for generating an illustration thereof.

Abstract: A metering device for flowable products, in particular, dairy products, has a metering cylinder, a valve cylinder coaxially arranged therein, a ring-shaped metering piston, a mouthpiece closing off the metering cylinder at the bottom side and having a coaxial cylindrical dispensing opening, and a central valve piston. The valve cylinder constitutes the central valve piston wherein the metering cylinder is arranged coaxially in an outer supply cylinder that is connected with its upper side to the product reservoir. The metering cylinder is axially movable from a lower closing position, in which it closes off the metering chamber by engaging with its end face the mouthpiece, into an upper opening position. The metering chamber communicates with the surrounding annular supply chamber in the supply cylinder via a supply opening between the end face of the metering cylinder and the mouthpiece.

Abstract: A cold-storage appliance includes an open-topped insulating container defining an external surface; an insulating lid adapted to close the open top of the container; a cooling means adapted to cool the interior of the container; and a structure supporting the container, the lid and the cooling means; wherein the container is mounted to the structure for movement relative to the structure and the lid to open the container and afford access to its interior or to close the container.

Abstract: A circuit includes i sensors interconnected in an (n×m) matrix circuit with n row conductors and m column conductors, where i, n, and m are natural numbers different than zero and where 1?i?n×m, each of the n row and m column conductors include a first and a second conductor end. The first conductor end of the n row conductors and the m column conductors is connectable to an evaluation circuit, and each of the i sensors are connected between two respective conductors from the n row and the m column conductors. A first conductor end of an at least one return conductor is connectable to the evaluation circuit and a second conductor end of the at least one return conductor is in contact with the second conductor end of one of the n row conductors or one of the m column conductors.