Patents Assigned to Freescale Semiconductor
  • Patent number: 9201982
    Abstract: A processor implements a priority search tree on data elements. A data point having two component values is stored for each data element. A comparison is performed to determine an order for two data points. When the first component values of the two data points are equal, a comparison is made using the second component values. When the second component values of the two data points are equal, a comparison is made using the first component values.
    Type: Grant
    Filed: February 23, 2009
    Date of Patent: December 1, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Bo Lin, Wim Rouwet
  • Patent number: 9199840
    Abstract: A method of fabricating a sensor device includes forming a plurality of sensor structures on a wafer, covering the plurality of sensor structures with a polymer layer, and dicing the wafer into a plurality of die while each sensor structure remains covered by the polymer layer.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: December 1, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Dubravka Bilic, Stephen R. Hooper
  • Publication number: 20150339427
    Abstract: An integrated circuit hierarchical design tool apparatus comprises a processor arranged to support a block coupling reconfiguration unit. The block coupling reconfiguration unit is capable of receiving block layout data comprising block placement, terminal location data and intra-block connectivity data. The block coupling reconfiguration unit is arranged to identify from the block layout data a block placement level block having a terminal respectively coupled to a plurality of other block placement level blocks by a plurality of nets, and to provide the block with an additional terminal capable of providing the same function as the terminal. The block coupling reconfiguration unit is also arranged to replace a net of the plurality of nets that is coupled to the terminal with a replacement net coupled to the additional terminal.
    Type: Application
    Filed: January 7, 2013
    Publication date: November 26, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Asher BERKOVITZ, Inbar BEN-PORAT, Yossy NEEMAN
  • Publication number: 20150341429
    Abstract: A packet processing architecture includes a plurality of packet processing stages, wherein at least one of the packet processing stages includes multiple next processing stage modules that are operably coupled to respective further processing stages, wherein the multiple next processing stage modules are dynamically configurable.
    Type: Application
    Filed: January 10, 2013
    Publication date: November 26, 2015
    Applicant: Freescale Semiconductor, Inc.,
    Inventors: Stefania GANDAL, Noam EFRATI, Adi KATZ
  • Publication number: 20150338227
    Abstract: An electronic device is for providing navigation information for a driver of a vehicle. The device has a location unit for determining geographical location data based on satellite signals, a navigation processor coupled to at least one sensor comprising a sound sensor. The navigation processor is arranged for obtaining destination data, determining route data based on the geographical location data, the destination data and map data. The navigation information is calculated based on the route data. Subsequently, navigation assistance information is generated related to the route information and based on sound data as detected via the sound sensor. Advantageously, by using environmental sound, the navigation may be improved, because additional data and corrections of driver activity can be early generated based on the sound data.
    Type: Application
    Filed: November 22, 2012
    Publication date: November 26, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventor: JOACHIM KRUECKEN
  • Publication number: 20150340305
    Abstract: A packaged semiconductor device has lead fingers that define a cavity, and a first die located within the cavity. A second die abuts an inactive side of the first die. The second die is electrically connected to one or more of the lead fingers. A redistribution layer abuts an active side of the first die. Metal structures are situated on an outer surface of the redistribution layer. The redistribution layer electrically connects (i) one or more of the metal structures to one or more of the lead fingers and (ii) one or more of the metal structures to one or more bond pads on the active side of the first die.
    Type: Application
    Filed: May 20, 2014
    Publication date: November 26, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventor: Wai Yew Lo
  • Publication number: 20150342069
    Abstract: Traces are formed and electronic components are mounted on an interior surface of a housing of an electronic device. Various methods are disclosed for integrating the housing with the electronic components including vacuum molding, metal forming, injection molding, and 3D printing of traces. The housing may be used to save space and reduce the size of the electronic devices as well as reduce assembly times.
    Type: Application
    Filed: May 20, 2014
    Publication date: November 26, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventor: Chee Seng Foong
  • Publication number: 20150340980
    Abstract: A device for determining a rotor position in a polyphase electric motor having a first phase, a second phase and a third phase. A power control unit applies a first voltage on the first phase, and a second voltage on the second phase, the first voltage and the second voltage being periodic signals of opposite polarity, alternating between a first part and a second part of the alternating period, such as square waves. A sample unit samples a third voltage on the third phase for acquiring a first sample at a first instant in the first part and a second sample at a second instant in the second part, and a difference value between the first sample and the second sample. The difference value represents a mutual inductance between the stator coils due to the rotor position. A determination unit determines the rotor position based on the difference value.
    Type: Application
    Filed: January 9, 2013
    Publication date: November 26, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Ivan LOVAS, Pavel GRASBLUM, Libor PROKOP
  • Publication number: 20150336556
    Abstract: A homogeneity detection circuit, a valve driving system, a vehicle, an integrated circuit and a method of homogeneity detection in a valve driving system are provided. The homogeneity detection circuit comprises a first input, a second input and a comparison circuit. The first input receives a first signal being related to a first driving signal for driving a first valve. The second input receives a second signal being related to a second driving signal for driving a second valve. The comparison circuit compares the first signal with the second signal and generates a warning signal if predetermined differences are detected between the first driving signal and the second driving signal.
    Type: Application
    Filed: January 9, 2013
    Publication date: November 26, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Alexis HUOT-MARCHAND, Christelle FRANCHINI
  • Patent number: 9195621
    Abstract: A communication channel controller includes a queue, a memory map, and a scheduler. The queue to store a first memory transfer request received at the communication channel controller. The memory map stores information to identify a memory address range to be associated with a memory. The scheduler to compare a source address of the first memory transfer in the queue to the memory address range in the memory map to determine whether the source address of the first memory transfer request targets the memory, and in response allocate the first memory transfer request to a first communication channel of a plurality of communication channels in response to the first communication channel having all of its outstanding memory transactions to a common source address bank and source address page as a source address bank and a source address page of the first memory transfer request.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 24, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Kun Xu, Tommi M. Jokinen, David B. Kramer
  • Patent number: 9197403
    Abstract: An electronic device has a calibration arrangement for controlling a frequency characteristic of a PLL circuit having a phase comparator having an output for generating a phase difference signal, a voltage controlled oscillator and a divider. The divisor of the divider is programmable, and the oscillator is also directly modulated by an oscillator modulation signal. A modulation unit has a modulation input for receiving a modulation signal and generates the oscillator modulation signal and the divisor such that modulation generates a predefined change of the output frequency and a change of the divisor proportional to said predefined change. The calibration arrangement receives the phase difference signal, and has a ripple detector for providing a detector output signal by detecting a ripple on the phase difference signal correlated to edges in the modulation signal. A calibration control unit adjusts the oscillator modulation signal based on the detector output signal such that the ripple is reduced.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: November 24, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Laurent Gauthier, Dominique Delbecq, Jean-Stephane Vigier
  • Patent number: 9196557
    Abstract: A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: November 24, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jianshe Bi, Lanping Bai, Quan Chen, Liping Guo, Yanbo Xu
  • Publication number: 20150331044
    Abstract: A scan flip-flop for generating an output signal based on a first input signal, a clock signal, a test input signal, a Launch On Shift (LOS) signal, a test enable signal, and a reset signal includes a logic circuit, a multiplexer and a flip-flop circuit. The logic circuit receives an inverted clock signal, the test enable signal, a intermediate test enable signal, and the LOS signal, and generates an intermediate output signal that is an inherent LOS scan enable signal. The multiplexer receives the test input signal and the intermediate output signal, and outputs the test input signal. The flip-flop circuit receives the test input signal as a second input signal, the clock signal, and the reset signal, and generates the output signal.
    Type: Application
    Filed: May 19, 2014
    Publication date: November 19, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Reecha Jajodia, Gaurav Goyal, Ateet Mishra
  • Publication number: 20150331466
    Abstract: A method of managing a thermal budget, for at least a part of a processing system, is described. The method comprises, upon detection of a use case event, determining a thermal budget violation time window for a current use case scenario of the at least part of the processing system, and managing the thermal budget for the at least part of the processing system based at least partly on the determined thermal budget violation time window.
    Type: Application
    Filed: July 3, 2012
    Publication date: November 19, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: ANTON ROZEN, ROY DRUCKER, LEONID SMOLYANSKY
  • Publication number: 20150331040
    Abstract: An integrated circuit device comprises a first integrated circuit and a second integrated circuit wherein the first and second integrated circuits are comprised on a single semiconductor die. The second integrated circuit is a safety circuit arranged to monitor the operation of the first integrated circuit, report any detected faults and drive the device into a failsafe state if a fault is detected. The first integrated circuit may be a power management module for a safety critical system. An isolation barrier in the form of a trench is formed between the two integrated circuits so that the safety circuit is protected from any high voltage or thermal stresses arising in the first integrated circuit. The device has particular application to automotive safety-critical systems such as electric power steering systems.
    Type: Application
    Filed: July 2, 2012
    Publication date: November 19, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Valérie BERNON-ENJALBERT, Guillaume FOUNAUD, Yuan GAO, Philippe GIVELIN
  • Publication number: 20150331740
    Abstract: A safety device with an error indication function includes at least one ERROR pad configured between the error indication function and at least one normal function, and a set of multiplexers connected to the ERROR pad. The safety device further includes an error indication block and a functional block multiplexed by the set of multiplexers. The error indication block includes a fault collection and control unit for collecting and providing error occurrence information to the ERROR pad, and an ERROR pad select control register for storing ERROR pad selection and configuration information to control select inputs of the first set of multiplexers and provide the ERROR pad configuration information to the ERROR pad.
    Type: Application
    Filed: May 18, 2014
    Publication date: November 19, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Chandan Gupta, Neha Bagri, Ray C. Marshall
  • Publication number: 20150333556
    Abstract: A single power supply level shifter has first and second inverters in tandem that invert an input signal from a first voltage domain and provide a first inverted signal and an output signal in a second voltage domain. A charging control circuit charges a capacitor towards the second voltage when the input signal is high, and conducts a discharge current from the capacitor during a transition of the input signal from high to low to accelerate a corresponding transition of the first inverted signal from low to high. A third inverter controls a current reduction transistor in series with the first inverter, and a third control transistor connected between the input and the charging control circuit to accelerate the flow of discharge current during the transition of the input signal from high to low.
    Type: Application
    Filed: May 18, 2014
    Publication date: November 19, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventor: Gaurav Goyal
  • Publication number: 20150333568
    Abstract: A system for providing a first voltage generated by a main supply and a second voltage generated by a battery to an integrated circuit (IC) includes supply-selection, control logic and switching circuits. The supply-selection circuit includes first, second, and third transistors. The switching circuit includes fourth and fifth transistors that supply the first and second voltages to the IC when switched on. The supply-selection circuit selects and provides the higher of the first and second voltages to body terminals of the fourth and fifth transistors for maintaining required body-bias voltage conditions. The control logic circuit generates a first control signal as long as the first voltage is within a predetermined range for keeping the fourth transistor switched on and a second control signal when the first voltage is not within the predetermined range for switching on the fifth transistor to supply the second voltage.
    Type: Application
    Filed: May 18, 2014
    Publication date: November 19, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Ashita Batra, Mayank Jain
  • Patent number: 9190965
    Abstract: A radio frequency (RF) power transistor circuit includes a power transistor and a decoupling circuit. The power transistor has a control electrode coupled to an input terminal for receiving an RF input signal, a first current electrode for providing an RF output signal at an output terminal, and a second current electrode coupled to a voltage reference. The decoupling circuit includes a first inductive element, a first resistor, and a first capacitor coupled together in series between the first current electrode of the power transistor and the voltage reference. The decoupling circuit is for dampening a resonance at a frequency lower than an RF frequency.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: November 17, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Hussain H. Ladhani, Gerard J. Bouisse, Jeffrey K. Jones
  • Patent number: 9190708
    Abstract: An electromagnetic band gap device is provided, comprising: a conductive plane; a non-conductive substrate located over the conductive plane; and an electromagnetic band gap unit cell that includes a first via located in the non-conductive substrate and filled with a conductive material, a second via located in the non-conductive substrate and filled with the conductive material, a first conductive surface located on the non-conductive substrate over the first via, and a second conductive surface located on the non-conductive substrate over the second via, wherein the electromagnetic band gap unit cell is configured to operate as an LC resonant circuit in conjunction with the conductive plane, at least one gap is located in the electromagnetic band gap unit cell, the at least one gap being located in the first via, in the first conductive surface, in the second conductive surface, and in the second via.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: November 17, 2015
    Assignee: Freescale Semiconductors, Inc.
    Inventor: Walter Parmon