Abstract: An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.

Abstract: A system includes a gaming table, at least one light sensor, an electronic system, and a central computer. The gaming table includes a tabletop covered by a fabric. The at least one light sensor is positioned in proximity to a player position at the gaming table. In addition, the at least one light sensor is positioned beneath the fabric to detect light intensity through the fabric. The electronic system is communicably coupled to the at least one light sensor. Furthermore, the electronic system is operable to detect changes in light intensity at the at least one light sensor. The central computer is communicably coupled to the electronic system. Additionally, the central computer is operable to perform at least one operation based on a status of the at least one light sensor.

Abstract: A plurality of electrochemical corrosion protection systems (30) for underground buried structure installed geographically dispersed are utilized so as to predict an earthquake. Changes in amounts of current flowing through closed loop electric circuits (W) for electrochemical corrosion protection in the electrochemical corrosion protection systems (30) are detected and an earthquake is predicted based on the detected changes in the amounts of current.

Abstract: A method of forming a device includes providing a first substrate having a first area and a second area, forming a range compensating material over the first substrate so that the first material is disposed over the first area and not disposed over the second area, implanting ions into the first area and the second area to form first and second cleave planes at first and second depths, respectively, each of the first and second cleave planes being defined by a concentration of the implanted ions, removing the range compensating material, and cleaving the first substrate along a cleave profile including the first and second cleave planes.

Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE<WL, WH<WL and 0.8<WH/WE?1.2.

Abstract: An ultrasonic extraction performance checking device and method for an ultrasonic extractor for detecting and analyzing a chemical composition of a consumer product. The ultrasonic extraction performance checking device includes a hanging frame which is hung inside the ultrasonic extractor and matched with the ultrasonic extractor, and a hanging frame plane checking device which is detachably and vertically or horizontally placed in the hanging frame and clamped with an alloy foil. The alloy foil is surrounded by a tensioning fixture. The tensioning fixture causes the alloy foil to generate a surface tension of 5 to 15 N and to be tightened and fixed to the bottom surface of the hanging frame plane checking device.

Abstract: A method for management of a land base includes interfacing a machine or equipment to a computer running a geographical information system (GIS) application such that the computer is configured to monitor the operations performed by the equipment or machine on the land base and store the operations as map points, lines, or polygons on at least one data layer within the GIS application. The method further includes displaying the GIS application to the operator at the point and time of performing the operations.

Abstract: A light-emitting device includes a substrate and a first light-emitting unit. The first light-emitting unit is disposed on the substrate, and includes a first semiconductor layer, a first light-emitting layer, and a second semiconductor layer. The first semiconductor layer is disposed on the substrate. The first light-emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The second semiconductor layer is disposed on the first light-emitting layer. The first semiconductor layer has a first sidewall and a second sidewall. A first angle is between the substrate and the first sidewall. A second angle is between the substrate and the second sidewall. The first angle is smaller than the second angle.

Abstract: A light emitting device including a first light emitting unit, a second light emitting unit, a heat dissipation substrate, a plurality of first bumps and a plurality of second bumps is provided. The heat dissipation substrate is disposed between the first light emitting unit and the second light emitting unit. The first bumps are connected between the first light emitting unit and the heat dissipation substrate. The second bumps are connected between the second light emitting unit and the heat dissipation substrate.

Abstract: A light emitting diode and manufacturing method thereof are provided. The light emitting diode includes a first-type semiconductor layer, a light emitting layer, a second-type semiconductor layer, a first metal layer, a first current conducting layer, a first bonding layer and a second current conducting layer. The light emitting layer is located between the first-type semiconductor layer and the second-type semiconductor layer. The first metal layer is located on and electrically connected to the first-type semiconductor layer. The first metal layer is located between the first current conducting layer and the first-type semiconductor layer. The first current conducting layer is located between the first bonding layer and the first metal layer. The first current conducting layer is connected to the first-type semiconductor layer by the first current conducting layer and the first metal layer. The first bonding layer has through holes overlapped with the first metal layer.

Abstract: A connector (10), for example, an F-connector, has a barrel (12), which may be threaded, a front flange (14), a frame insert (16), a rear flange (20), a body section (22) between the frame insert (16) and the rear flange, an insulator (60) in the barrel, and a center conductor (24) running through the insulator. The body section forms a slot (18) between the frame insert and the rear flange. The rear flange has two sections (20A, 20B), which mirror each other. A section may be a rectangular block with a curved cutoff; the curved cutouts face each other and, together, provide a passageway for the conductor. The conductor is preferably beryllium-copper with a tin plating. The insulator is preferably a high-temperature thermoplastic, such as a heat-resistant polyamide nylon which can withstand a temperature of 270° C. for 1 minute.

Abstract: A piston is arranged to move in a cylinder to define a variable volume chamber, and can expand in two directions under the influence of pressure in the variable volume chamber to provide sealing against the cylinder. The piston can comprise a primary foot and a secondary foot arranged to move relative to each other in a first direction. The primary foot and the secondary foot can each comprise plural segments arranged to move relative to each other in a second direction. The piston may be suitable for use in an inner rotor, where it forms the end of a projection of the inner rotor and fully exits and reenters the cylinders.

Abstract: A multi-modal emotion recognition system is disclosed. The system includes a data input unit for receiving video data and voice data of a user, a data pre-processing unit including a voice pre-processing unit for generating voice feature data from the voice data and a video pre-processing unit for generating one or more face feature data from the video data, a preliminary inference unit for generating situation determination data as to whether or not the user's situation changes according to a temporal sequence based on the video data. The system further comprises a main inference unit for generating at least one sub feature map based on the voice feature data or the face feature data, and inferring the user's emotion state based on the sub feature map and the situation determination data.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: A light emitting diode (LED) including an epitaxial stacked layer, first and second reflective layers which are disposed at two sides of the epitaxial stacked layer, a current conducting layer and first and second electrodes and a manufacturing thereof are provided. The epitaxial stacked layer includes a first-type and a second-type semiconductor layers and an active layer. A main light emitting surface with a light transmittance >0% and ?10% is formed on one of the two reflective layers. The current conducting layer contacts the second-type semiconductor layer. The first electrode is electrically connected to the first-type semiconductor layer. The second electrode is electrically connected to the second-type semiconductor layer via the current conducting layer. A contact scope of the current conducting layer and the second-type semiconductor layer is served as a light-emitting scope overlapping the two layers, but not overlapping the two electrodes.

Abstract: A ?LED including an epitaxial stacked layer, a first electrode and a second electrode is provided. The epitaxial stacked layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. The epitaxial stacked layer has a first mesa portion and a second mesa portion to form a first type conductive region and a second type conductive region respectively. The first electrode is disposed on the first mesa portion. The second electrode is disposed on the second mesa portion. The second electrode contacts the first type doped semiconductor layer, the light emitting layer and the second type doped semiconductor layer located at the second mesa portion. Moreover, a manufacturing method of the ?LED is also provided.

Abstract: A periprosthetic fracture repair solution that provides a variety of fracture fixation options should a fracture occur after total hip, knee, or especially a total shoulder arthroplasty, and provides associated methods and apparatus for application of provided fixation. The ability to pre-engineer fracture fixation contingent solutions into humeral components provides for a distinct clinical advantage in the planning and execution for periprosthetic fracture fixation. Said methods and apparatus include targeting devices which allow for intimate association of fixed angle locking screws in pre-drilled holes in an existing prosthetic or other components including additional fixation components. Such apparatus and methods further include the use of alignment devices and other components to allow for ease of repair of periprosthetic fractures utilizing the pre-engineered solutions.

Abstract: Disclosed are drive chip, drive circuit and drive method capable of eliminating LED ghost. The drive chip comprises a processing unit, a blanking unit and a constant current drive unit. By blanking unit, parasitic capacitances of each row of scanning lines of an LED array is discharged during a blanking period, eliminating an upper ghost without needing to pull down additional circuits such as a resistor, no caterpillar effect or the reverse bias of LED lamp beads; charging parasitic capacitance of each column of scanning lines of the LED array, eliminating lower ghost. By constant current drive unit, constant current control is performed on LED lamp beads. Performing blanking and constant current control individually in two time periods, when displaying LED lamp beads, parasitic capacitance and both upper and lower ghosts are eliminated.