Patents Assigned to JX Nippon Mining & Metals Corporation
  • LAMINATE OF CERAMIC LAYER AND SINTERED BODY OF COPPER POWDER PASTE
    Publication number: 20200043654
    Abstract: Provided is a laminate of a sintered body produced by sintering a copper powder paste and a ceramic substrate, which has improved adhesion between the sintered body and the ceramic substrate. A laminate with a copper powder paste sintered body laminated on a non-metal layer, wherein the copper powder paste sintered body has a crystal grain diameter of copper of 10 ?m or less, as determined from an EBSD map image, based on Area Fraction method, and has an average reliability index (CI value) of 0.5 or more in an analysis area.
    Type: Application
    Filed: July 9, 2019
    Publication date: February 6, 2020
    Applicant: JX Nippon Mining & Metals Corporation
    Inventor: Hideki FURUSAWA
  • Method of leaching copper from copper sulfide ore and method of evaluating iodine loss content of column leaching test of the copper sulfide ore
    Patent number: 10550450
    Abstract: A method of leaching copper from a copper sulfide ore which includes adding a potential adjustment agent for lowering a potential of a leaching solution obtained after leaching copper from the copper sulfide ore by using iodide ion and iron (III) ion, the leaching solution being stored in a tank for storing the leaching solution.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: February 4, 2020
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Shintaro Kawashiro, Akira Miura
  • COPPER ALLOY STRIP EXHIBITING IMPROVED DIMENSIONAL ACCURACY AFTER PRESS-WORKING
    Publication number: 20200032374
    Abstract: Provided is a Corson alloy having improved bending workability and also having high dimensional accuracy after press-working. A copper alloy strip which is a rolling material, the rolling material containing from 0 to 5.0% by mass of Ni or from 0 to 2.5% by mass of Co, the total amount of Ni+Co being from 0.2 to 5% by mass; from 0.2 to 1.5% by mass of Si, the balance being copper and unavoidable impurities, wherein the rolling material has a surface satisfying the relationship: 1.0?I(200)/I0(200)?5.0; wherein an area ratio of Cube orientation {100} <001> is from 2 to 10% in EBSD measurement of a rolling parallel cross section; and wherein a ratio: (an average crystal grain size of Cube orientation {100} <001> of the rolling parallel cross section)/(an average crystal grain size of the rolling parallel cross section) is from 0.75 to 1.5.
    Type: Application
    Filed: March 20, 2018
    Publication date: January 30, 2020
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Akihiro KAKITANI, Hironori IMAMURA
  • COPPER ALLOY STRIP EXHIBITING IMPROVED DIMENSIONAL ACCURACY AFTER PRESS-WORKING
    Publication number: 20200024695
    Abstract: Provided is a Corson alloy having improved bending workability and also having high dimensional accuracy after press-working. A copper alloy strip which is a rolling material, the rolling material containing from 0 to 5.0% by mass of Ni or from 0 to 2.5% by mass of Co, the total amount of Ni+Co being from 0.2 to 5% by mass; from 0.2 to 1.5% by mass of Si, the balance being copper and unavoidable impurities, wherein the rolling material satisfies the relationship: A0/A?1.000, in which A0 represents a projected area of an indentation remaining after carrying out a Vickers hardness test by maintaining a square pyramidal indenter for 10 seconds while applying a test force with a load of 1 kg to a surface of a base material and releasing the test force; and A represents an area connecting vertices of the indenter, and wherein the rolling material satisfies the relationship: 0.1?I(200)/I0(200)<1.
    Type: Application
    Filed: March 20, 2018
    Publication date: January 23, 2020
    Applicant: JX Nippon Mining & Metals Corporation
    Inventor: Akihiro KAKITANI
  • Method for recovering at least one valuable containing tungsten
    Patent number: 10538849
    Abstract: Provided is a method for efficiently separating and recovering tungsten and other valuable(s) from at least one valuable containing tungsten. The present invention relates to a method for recovering at least one valuable containing tungsten, comprising subjecting a raw material mixture comprising at least one valuable containing tungsten to electrolysis using an electrolytic solution containing at least one alcohol amine to dissolve tungsten in the electrolytic solution, electrodeposit a part of the valuable(s) onto a cathode used for the electrolysis and separate at least one valuable other than the valuable(s) electrodeposited onto the cathode as a residue in the electrolytic solution, and then separating and recovering each of the residue and the valuable(s) electrodeposited onto the cathode.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: January 21, 2020
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventor: Toshifumi Kawamura
  • Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
    Patent number: 10530084
    Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: January 7, 2020
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil
    Patent number: 10529992
    Abstract: The invention provides a surface-treated copper foil for a battery cell that is capable of providing good adhesiveness to an active substance and undergoes less detachment of roughening particles. The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 ?m or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: January 7, 2020
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki
  • Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus
    Patent number: 10519558
    Abstract: Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: December 31, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Tomota Nagaura, Masafumi Ishii
  • Sputtering target comprising Al—Te—Cu—Zr alloy, and method for producing same
    Patent number: 10519538
    Abstract: An Al—Te—Cu—Zr alloy sputtering target, comprising 20 at % to 40 at % of Te, 5 at % to 20 at % of Cu, 5 at % to 15 at % of Zr and the remainder of Al, wherein a Te phase, a Cu phase and a CuTe phase are not present in a structure of the target. An object of the present invention is to provide an Al—Te—Cu—Zr alloy sputtering target capable of effectively reducing particle generation, nodule formation and the like upon sputtering and further capable of reducing oxygen contained in the target.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: December 31, 2019
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventor: Yoshimasa Koido
  • Copper alloy sputtering target and method for manufacturing same
    Patent number: 10494712
    Abstract: Provided is a copper alloy sputtering target, wherein, based on charged particle activation analysis, the copper alloy sputtering target has an oxygen content of 0.6 wtppm or less, or an oxygen content of 2 wtppm or less and a carbon content of 0.6 wtppm or less. Additionally provided is a method for manufacturing a copper alloy sputtering target, wherein a copper raw material is melted in a vacuum or an inert gas atmosphere, a reducing gas is thereafter introduced into the melting atmosphere, an alloy element is subsequently added to a molten metal for alloying, and an obtained ingot is processed into a target shape. The present invention aims to provide a copper alloy sputtering target that generates few particles during sputtering, and a method for manufacturing such a sputtering target.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: December 3, 2019
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yasushi Morii, Tomio Otsuki
  • Copper-titanium alloy foil having plated layer
    Patent number: 10495840
    Abstract: The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: December 3, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Kenta Tsujie
  • Tantalum sputtering target and method for producing same
    Patent number: 10490393
    Abstract: A tantalum sputtering target, wherein, on a sputtering surface of the tantalum sputtering target, an orientation rate of a (200) plane exceeds 70%, an orientation rate of a (222) plane is 30% or less. By controlling the crystal orientation of the target, effects are yielded in that the discharge voltage of the tantalum sputtering target can be reduced so that plasma can be more easily generated, and the voltage drift during deposition can be suppressed.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: November 26, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Shinichiro Senda, Kotaro Nagatsu
  • PEPTIDE BINDING TO ARSENIC-CONTAINING MINERAL AND USE THEREOF
    Publication number: 20190345201
    Abstract: (Technical problems to be solved) Providing a method for selecting minerals containing arsenic (Means for solving the problems) A peptide comprising an amino acids sequence according to the following formula: (TSNQ)-(HPW)-(ED)-(HPWRK)-(LIVFA)-(LIVFA)-(LIVFA)-(TSNQ)-(HPW)-(LIVFA)-(TSNQ)-(LIVFA) wherein one amino acid is respectively selected from each group defined by paired parentheses.
    Type: Application
    Filed: September 15, 2017
    Publication date: November 14, 2019
    Applicants: SHIBAURA INSTITUTE OF TECHNOLOGY, JX NIPPON MINING & METALS CORPORATION
    Inventors: Mitsuo YAMASHITA, Akira MIURA
  • A NOVEL PEPTIDE AND USE THEREOF
    Publication number: 20190345200
    Abstract: (Technical problems to be solved) Providing a method for selecting an mineral of molybdenum. (Means for solving the problems) A peptide comprising an amino acids sequence according the following formula (1) and/or (2): (1) (ALRKNMD-FCPQSETGWHYIV)-(LIVFA)-(HPWRK)-(TSNQ)-(TSNQ)-(LIVFA)-(TSNQ)-(TSNQ)-(LIVFA)-(FYW)-(LIVFA)-(HPWRK) (2) (LIVFA)-(RHK)-(TSNQ)-(LIVFA)-(LIVFA)-(TSNQ)-(LIVFA)-(LIVFA)-(LIVFA)-(RHK)-(RHK)-(HPW) wherein one amino acid is respectively selected from each group defined by paired parentheses.
    Type: Application
    Filed: June 6, 2017
    Publication date: November 14, 2019
    Applicants: SHIBAURA INSTITUTE OF TECHNOLOGY, JX NIPPON MINING & METALS CORPORATION
    Inventors: Mitsuo YAMASHITA, Akira MIURA
  • Copper foil for printed circuit
    Patent number: 10472728
    Abstract: A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 ?m, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 ?m. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: November 12, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki
  • HIGH PURITY TIN AND METHOD FOR MANUFACTURING SAME
    Publication number: 20190338431
    Abstract: Provided is a high purity tin (Sn) having an extremely low oxygen content. A high purity tin having a tin purity of 5N (99.999% by mass, provided that carbon, nitrogen, oxygen and hydrogen are excluded) or more, wherein the high purity tin has an oxygen content of less than 10 ppb by mass, as measured by elemental analysis using Dynamic-SIMS.
    Type: Application
    Filed: July 17, 2019
    Publication date: November 7, 2019
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Toru IMORI, Kouichi TAKEMOTO
  • Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
    Patent number: 10464291
    Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 ?m or more.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: November 5, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi, Atsushi Miki
  • Electromagnetic shielding material
    Patent number: 10442159
    Abstract: Provided is an electromagnetic shielding material having improved electromagnetic shielding properties, light weight properties and formability. The present invention relates to an electromagnetic shielding material having a structure in which at least three metal foils are laminated via insulating layers, wherein all of combinations of the metal foils and the insulating layers making up the electromagnetic shielding material satisfy the equation: ?M×dM×dR?3×10?3, in which: the symbol ?M represents conductivity of each metal foil at 20° C. (S/m); the symbol dM represents the thickness of each metal foil (m); and the symbol dR represents the thickness of each insulating layer (m).
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: October 15, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Koichiro Tanaka, Kenji Sato
  • Method for removing iron from iron-containing solution and method for recovering valuable metals
    Patent number: 10443111
    Abstract: The present invention provides a method for removing iron from an iron-containing solution containing an iron ion, comprising adding a lithium ion battery cathode material containing manganese to an acidic sulfuric acid solution to obtain a cathode material-containing solution, and then precipitating a manganese ion as manganese dioxide in a mixed solution obtained by mixing the iron-containing solution with the cathode material-containing solution while precipitating the iron ion contained in the iron-containing solution as a solid.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: October 15, 2019
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Junichi Arakawa, Junichi Ito, Takuya Yokota
  • Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
    Patent number: 10448507
    Abstract: To provide a copper foil and a copper-clad laminate board that have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board that is folded in use or bent in use. A copper foil having a number of times of folding of 1 or more in a folding test under a prescribed condition for a copper-clad laminate board containing the copper foil having adhered thereto an insulating substrate.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: October 15, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Ryo Fukuchi