Abstract: Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 ?m or less.
Abstract: An assembly of a gadolinium target and a titanium backing plate, wherein the gadolinium target-titanium backing plate assembly has a solid-phase diffusion-bonded interface at a bonding interface between the gadolinium target and the titanium backing plate. An object of the present invention is to discover a backing plate that is suitable for the gadolinium sputtering target, explore the optimal bonding conditions, improve the deposition rate, stabilize the sputtering process, and prevent the occurrence of warpage and separation of the target material and the backing plate by increasing the bonding strength between the target material and the backing plate, as well as inhibit the generation of particles during sputtering.
Abstract: An IGZO sintered compact composed of indium (In), gallium (Ga), zinc (Zn), oxygen (O) and unavoidable impurities, wherein the IGZO sintered compact has a flexural strength of 50 MPa or more, and a bulk resistance of 100 m?cm or less. Provided is a sputtering target capable of suppressing the target cracks and reducing the generation of particles during deposition via DC sputtering, and forming favorable thin films.
February 19, 2016
Date of Patent:
December 25, 2018
JX Nippon Mining & Metals Corporation
Yohei Yamaguchi, Toshiya Kurihara, Koji Kakuta
Abstract: Provided is a high-purity titanium ingot having a purity, excluding an additive element and gas components, of 99.99 mass % or more, wherein at least one nonmetallic element selected from S, P, and B is contained in a total amount of 0.1 to 100 mass ppm as the additive component and the variation in the content of the nonmetallic element between the top, middle, and bottom portions of the ingot is within ±200%. Provided is a method of manufacturing a titanium ingot containing a nonmetallic element in an amount of 0.1 to 100 mass ppm, wherein S, P, or B, which is a nonmetallic element, is added to molten titanium as an intermetallic compound or a master alloy to produce a high-purity titanium ingot having a purity, excluding an additive element and gas components, of 99.99 mass % or more.
Abstract: A sputtering target having a composition of LiCoO2, wherein a resistivity of the target is 100 ?cm or less, and a relative density is 80% or higher. The sputtering target of the present invention is effective for use in forming a positive electrode thin film in all-solid-state thin-film lithium ion secondary batteries equipped in vehicles, information and communication electronics, household appliances, and the like.
Abstract: Provided is a novel lithium complex oxide containing molybdenum. A complex oxide represented by the following compositional formula: LixMyMozO wherein M is one or two or more selected from the group consisting of Mn, Ru, Sn, Mg, Al, Ti, V, Cr, Fe, Co, Ni, Cu, and Zn; x is in the range of 0.60 to 0.75; y is in the range of 0.15 to 0.25; and z is in the range of 0.075 to 0.20.
February 25, 2015
Date of Patent:
December 11, 2018
JX Nippon Mining & Metals Corporation, Tokyo University Of Science Foundation
Abstract: A high-purity calcium and method of producing same are provided. The method includes performing first sublimation purification by introducing calcium starting material having a purity, excluding gas components, of 4N or less into a crucible of a sublimation vessel, subjecting the starting material to sublimation by heating at 750° C. to 800° C., and causing the product to deposit or evaporate onto the inside walls of the sublimation vessel; and then, once the calcium that has been subjected to first sublimation purification is recovered, performing second sublimation purification by introducing the recovered calcium again to the crucible to the sublimation vessel, heating the recovered calcium at 750° C. to 800° C., and causing the product to similarly deposit or evaporate on the inside walls of the sublimation vessel thereby recovering calcium having a purity of 4N5 or higher.
Abstract: A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/?m2, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 ?m.
Abstract: The present invention provides a positive electrode active material for lithium ion batteries having excellent battery property. The positive electrode active material for lithium ion batteries is represented by composition formula: LixNi1?yMyO2+?, wherein M is Co as an essential component and at least one species selected from a group consisting of Sc, Ti, V, Cr, Mn, Fe, Cu, Zn, Ga, Ge, Al, Bi, Sn, Mg, Ca, B and Zr, 0.9?x?1.2, 0<y?0.7, ?>0.05, and an average particle size (D50) is 5 ?m to 15 ?m.
Abstract: In the electrolytic refining of lead in a sulfamate bath, the production of a white residue is suppressed, and a decrease in the lead concentration in the electrolytic solution is suppressed. A method for electrolytically refining lead in a sulfamate bath, comprising performing electrolytic refining at a decomposition rate of sulfamic acid controlled at 0.06%/day or less.
Abstract: An object of the present invention is to provide a method for recovering gold in an ore or a refining intermediate by sufficiently leaching gold in a raw material resulting from the ore or the refining intermediate in an acidic solution containing a copper ion, an iron ion and a halide ion, which can contribute to improve the recovery rate of gold.
Abstract: There is provided a copper-titanium alloy with large fluctuations in Ti concentration. The copper-titanium alloy for electronic components contains 2.0 to 4.0% by mass of Ti and, as a third element, 0 to 0.5% by mass in total of one or more selected from a group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P, with a balance being copper and unavoidable impurities, wherein when crystal grains having <100> orientation in a section parallel to a rolling direction are subjected to area analysis of Ti concentration in a matrix phase, a difference between a maximum Ti concentration and a minimum Ti concentration is 5 to 16% by mass.
Abstract: There is provided a titanium-copper alloy in which the adhesion strength with solder can be increased. The titanium-copper alloy comprises a base material and a plating layer provided on a surface of the base material, wherein the base material contains 1.5 to 5.0% by mass of Ti with a balance consisting of copper and unavoidable impurities, and the plating layer is selected from the group consisting of a Ni plating layer, a Co plating layer, and a Co—Ni alloy plating layer.
Abstract: An Fe-based magnetic material sintered compact containing BN, wherein the Fe-based magnetic material sintered compact has an oxygen content of 4000 wtppm or less. The present invention provides a sintered compact which enables the formation of a magnetic thin film in a thermally assisted magnetic recording media, and in which the generation of cracks and chipping is suppressed when the sintered compact is processed into a sputtering target or the like.
Abstract: A surface-treated copper foil is capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. A resin substrate is provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil has a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 ?m.
Abstract: This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 ?g/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 ?g/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.
Abstract: A sintered compact magnesium oxide target for sputtering has a purity of 99.99 wt % or higher excluding C, a density of 3.57 g/cm3 or higher, and a whiteness of 60% or less. To uniformly deposit a magnesium oxide film, a magnesium oxide target having a higher purity and a higher density is demanded. An object is to provide a target capable of realizing the above and a method for producing such a target. While a magnesium oxide sintered compact sputtering target is produced by hot-pressing a raw material powder, there is a problem in that color shading occurs in roughly ?60 (within a circle having a diameter of 60 mm) at the center part of the target. Conventionally, no particularly attention was given to this problem. However, in recent years, it has become necessary to investigate and resolve this problem in order to improve the deposition quality.
Abstract: A copper foil for producing graphene, having 60 degree gloss of 500% or more in a rolling direction and a direction transverse to the rolling direction, and an average crystal grain size of 200 ?m or more after heating at 1000° C. for 1 hour in an atmosphere containing 20% by volume or more of hydrogen and balance argon.