Abstract: A fuse housing for safe outgassing of a fuse is disclosed. The fuse housing features labyrinth walls disposed at opposing sides of the fuse housing. The labyrinth walls feature serpentine paths for the flow of outgassing material. At an end of the serpentine paths which is farthest away from a fuse element are vent channels. The vent channels are narrower in depth than that of the serpentine paths of the labyrinth walls, facilitating a suctioning effect during outgassing. Conductive material deposits along the serpentine paths so that the fuse maintains a high OSR rating. By directing and controlling the outflow of gases, the fuse housing is able to reduce the temperature of the gases produced. The fuse housing is also able to reduce the physical and observable effects of outgassing.

Abstract: Provided herein is are quick-assembly plug connectors. In some embodiments, an assembly may include a body, and a contact carrier within the body, the contact carrier including a main body including a plurality of openings each operable to receive a contact, and a plurality of legs extending from the main body, each of the plurality of legs coupled with the body.

Abstract: An automobile antenna assembly including a housing adapted for installation on a roof of an automobile, the housing having a base portion and a fin portion extending from the base portion, a radio antenna disposed within the fin portion, and a photo radiation intensity sensor disposed within the base portion, the photo radiation intensity sensor including a first light detecting element located on a first side of the fin portion and a second light detecting element located on a second side of the fin portion opposite the first side, wherein at least a portion of the base portion is translucent for allowing light to be received by the first and second light detecting elements, the fin portion providing a light barrier between the first light detecting element and the second light detecting element.

Abstract: Provided herein are coil support structures and methods of retaining a printed circuit board assembly (PCBA) of a relay. In some embodiments, a bi-stable relay assembly may include a coil support structure, having a central section extending between a first end section and a second end section, and set of biasable fasteners extending from the first end section and the second end section, wherein each of the set of biasable fasteners includes a sloped engagement surface and a retention slot. The coil support structure may further include a PCBA coupled to the first and second end sections of the coil support structure, wherein the coil support structure extends within the retention slot of each of the set of biasable fasteners.

Abstract: Provided herein is a fuse assembly including an anti-rotation device. In some embodiments, the fuse assembly may include a fusible device connected to a conductive component, wherein the conductive component is operable to connect to a terminal of a power source and a securement device coupled to the fusible device. The securement device may include a body including a recess operable to receive the fusible device and a support post extending from the body, wherein the support post is operable to engage the power source to reduce rotation of the securement device and the fusible device relative to the power source.

Abstract: A circuit protection device including a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a quantity of solder disposed on a dielectric chip and having a melting temperature that is higher than a trip temperature of the PTC device, wherein the a surface of the dielectric chip exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the surface to create a galvanic opening in the backup fuse.

Abstract: A semiconductor device substrate assembly may include a first substrate, comprising: a first insulator plate; and a first patterned metal layer, disposed on the first insulator plate, wherein the first insulator plate comprises a first material and a first thickness. The assembly may include a second substrate, comprising: a second insulator plate; and a second patterned metal layer, disposed on the second insulator plate, wherein the second insulator plate comprises the first material and the first thickness. The assembly may also include a third substrate, disposed between the first substrate and the second substrate, comprising: a third insulator plate; and a third patterned metal layer, disposed on the third insulator plate, wherein the third insulator plate comprises a second material and a second thickness, wherein at least one of the second material and the second thickness differs from the first material and the first thickness, respectively.

Abstract: A pPTC heating device having areas with different power densities distributed over the surface of the device. The device is constructed using a base layer composed of a pPTC material having a layer of sectioned conductive plates disposed over and under the layer of pPTC such as to control the path of the current through the device, thereby controlling resistance of the device and the power density of the device.

Abstract: Circuitry and techniques for providing a bidirectional switch in devices for overcurrent protection and voltage protection are disclosed herein. In one embodiment, a circuit may include a first reverse-blocking insulating gate bipolar transistor (IGBT), having a first gate terminal, first collector terminal and a first emitter terminal. The circuit may include a second reverse-blocking IGBT, having a second gate terminal, a second collector terminal, electrically coupled to the first emitter terminal, and a second emitter terminal, electrically coupled to the first collector terminal. As such the first IGBT and the second IGBT may define a first current path, extending from the first collector to the second emitter; and a switch control circuit, coupled to send a control signal to at least one of: the first gate terminal and the second gate terminal, during an overcurrent event.

Abstract: Devices herein may include conductor lines connected between a power supply and load, each of the conductor lines coupled to an AC contactor and a contactor control circuit, wherein the contactor control circuit is operable to open and close one or more contactors of the AC contactor. The devices may further include a current transformer coupled to the conductor lines, the current transformer operable to output a secondary current corresponding to a primary current magnitude of an electrical current not flowing to the load, wherein the AC contactor is connected between the power supply and the load. Devices may further include a zero cross detection circuit operable to generate an interrupt at each of a plurality of zero crossings for a microprocessor, and determine whether to open the one or more contactors of the AC contactor in a predetermined optimum interval calculated with respect to the zero crossing points.

Abstract: A semiconductor device module. The semiconductor device module may include a first substrate; and a semiconductor die assembly, disposed on the first substrate. The semiconductor die assembly may include a first semiconductor die, bonded to the first substrate; a second semiconductor die, disposed over the first semiconductor die; and an electrical connector, disposed between the first semiconductor die and the second semiconductor die, wherein the semiconductor die assembly comprises an insulated gate bipolar transistor (IGBT) die and a freewheeling diode die.

Abstract: A fault protection arrangement may include a neutral grounding resistor, the neutral grounding resistor comprising a ground end and a non-ground end. The fault protection arrangement may include a neutral grounding resistance monitor assembly, coupled to the neutral grounding resistor, where the neutral grounding resistance monitor assembly includes a sense circuit, coupled to the ground end of the neutral grounding resistor; and an injection signal generator, arranged to generate a frequency of 240 Hz or greater.

Abstract: A single bolt fuse assembly and method to connect a single bolt fuse to a circuit or device are disclosed. The single bolt fuse assembly enables the single bolt fuse to be used on any electrical device having a hole suitable for receiving a threaded shaft and connectable to a circuit or device that electrically connects to a female battery or power cable. The apparatus includes a separate high-conductive metal terminal that mates with the stud that mechanically attaches the fuse between the electrical devices. The stud is insulated to avoid becoming part of the electrical circuit and to ensure proper operation of the fuse. By mechanically attaching the stud to the metal terminal, the stud is unlikely to get separated from the fuse.

Abstract: Provided are trimmed parallel element protection devices. Some protection devices may include a substrate and first and second terminals at opposite ends of the substrate. The protection devices may further include a first fusible and a second fusible element extending between the first and second terminals, wherein at least one of the first and second fusible elements includes a trimmed portion.

Abstract: A reed switch including a cylindrical enclosure with two ends, a first blade and a second blade is disclosed. The first blade has a first lead, a first web, and a first contact, and the first web is bent at a first angle as compared to the first lead. The second blade has a second lead, a second web, and a second contact, and the second web is bent at a second angle as compared to the second lead. The first contact is disposed adjacent to the second contact with a gap between them.

Abstract: Exemplary embodiments of the present disclosure of a fuse may include a fuse body having a first portion and a second portion. The first and second portions may be configured to mate together thereby forming an internal cavity. A first inner termination and a second inner termination may be at least partially attachable to the first and second portions of the fuse body at respective first and second ends. A fusible element may be disposed in the cavity of the fuse body and extendable from the first inner termination at the first end of the fuse body to the second inner termination at the second end of the fuse body. The fusible element may be attachable to the first inner termination at a first connection and the second inner termination at a second connection. The first and second connections may be inspectable when the fuse is in an assembled state.

Abstract: A novel electrical box to house one or more ISO micro relays, is adapted to support IP67 and IP69K Ingress Protection ratings. The housing of the electrical box is molded with blade sockets that correspond to blade positions of the ISO micro relay. The housing is also molded with terminal seats and cylindrical openings which vary, depending on the blade socket, enabling terminals of different sizes, orientations, and positions relative to the respective blades, to be easily inserted into the back of the housing. The resulting position of the terminals ensures that electrical connections to the ISO micro relay are made and ingress protection of components inside the electrical box is ensured.

Abstract: A novel heater is disclosed for a temperature sensitive actuator. The heater is a polymeric positive temperature coefficient (PPTC) device consisting of conductive filler and semi-crystalline polymer. The PPTC heater is strategically designed to have a predetermined self-regulation temperature suited to whatever application utilizes the heater. Physical characteristics of the PPTC heater, such as gap width and thickness, enable the current flow through the heater to be strategically controlled.

Abstract: A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

Abstract: A miniature circuit breaker for providing short circuit and overload protection is disclosed herein. The miniature circuit breaker features a field effect transistor (FET), which may be a depletion mode metal oxide semiconductor FET (D MOSFET), a junction field-effect transistor (JFET), or a silicon carbide JFET, the FET being connected to a bi-metallic switch, where the bi-metallic switch acts as a temperature sensing circuit breaker. In combination, the D MOSFET and bi-metallic switch are able to limit current to downstream circuit components, thus protecting the components from damage.