Abstract: A fault protection arrangement. The fault protection arrangement may include a neutral grounding resistor including a first non-ground end, connected to a neutralizing point, and a second non-ground end. The fault protection arrangement may include a neutral grounding resistance monitor assembly, directly coupled to the second non-ground end of the neutral grounding resistor. The neutral grounding resistance monitor assembly may include comprising a signal source coupled to the neutralizing-point; a first current sense circuit coupled between the signal source and the neutralizing-point; a first voltage sense circuit coupled between the signal source and the neutralizing-point; a second current sense circuit, comprising a current sensor, coupled between the second non-ground end of the neutral grounding resistor and a protective earth connection.

Abstract: A fuse assembly including a fuse connected to two busbars, an injection molded base and an injection molded cover. The busbars are powder-coating with a powder-based adhesive or adhesion promoter, then cured in an oven. The busbars are then placed in the cavity image of an injection molding apparatus. Plastic is heated to a liquid form and injected into the cavity image. The resulting injection molded base is resistant to both dust and water, protecting the fuse inside.

Abstract: A floating two-terminal unipolar current limiting circuit arrangement implemented with enhancement mode devices and bipolar devices with a unique voltage-current operation curve. This operation curve makes this device particularly advantageous to instrumentation systems that are intended to experience large voltage transients and long-term exposure to voltages that would normally damage measurement equipment. The present current limiting device is designed to have a large impedance value prior to a “turn-on” voltage, then quickly transitions to a low-impedance state. When the conducted current exceeds a setpoint or a high-voltage event occurs, the current limiting device further transitions to the “cutoff” region, which transition resumes the initial high-impedance state. In one embodiment the threshold current may be set with internal components, while a further embodiment allows the current setpoint to be set by external components.

Abstract: Polymeric positive temperature coefficient (PPTC) bodies and fuse devices formed therefrom are described. In various embodiments, the PPTC bodies comprise a matrix polymer and a conductive filler comprising a compound of general formula Mn+1AXn, where M is a transition d metal element, A is a p-block element, X is carbon or nitrogen, and n is 1, 2 or 3.

Abstract: A power control switch assembly. The assembly may include a thyristor device, where the thyristor device includes a first device terminal, a second device terminal, and a gate terminal> The assembly may include a negative temperature coefficient (NTC) device, electrically coupled to the gate terminal of the thyristor device on a first end, and electrically coupled to the first device terminal of the thyristor device on a second end, wherein the NTC device is thermally coupled to the thyristor device.

Abstract: A sub-structure element support system is disclosed. The sub-structure element support system includes a novel molded structure designed to support an electrical element, such as a fuse. The molded structure is a protective and insulative sleeve for the electrical element and reduces forces on the electrical element during free-fall and operation conditions. The molded structure also facilitates automation during manufacturing and reduces cost.

Abstract: A fuse device including a fuse component, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the fuse component, and a phase change component, disposed in thermal contact with the fuse component. The fuse component may comprise a fuse temperature, wherein the phase change component exhibits a phase change temperature, the phase change temperature marking a phase transition of the phase change component, and wherein the phase change temperature is less than the fuse temperature.

Abstract: A sub-structure element support system is disclosed. The sub-structure element support system includes a novel molded structure designed to support an electrical element, such as a fuse. The molded structure is a protective and insulative sleeve for the electrical element and reduces forces on the electrical element during free-fall and operation conditions. The molded structure also facilitates automation during manufacturing and reduces cost.

Abstract: Aspects of the present disclosure include one or more power semiconductor device modules. A power semiconductor module can include: a power terminal, a housing, a heatsink and a protrusion, wherein the housing includes a first tab, and a first protrusion, and wherein the first tab contacts the substrate, and the first protrusion contacts the heatsink.

Abstract: A semiconductor die having a metal tab connected thereto. The metal tab includes at least one slot on at least one side of the metal tab, wherein the at least one slot i) creates an opening between at least two portions of the metal tab and ii) exposes the semiconductor die in relation to the metal tab. The semiconductor die can be a silicon (Si) die and the metal tab can be a copper (Cu) tab, where the at least one slot includes at least four slots corresponding to each of at least four sides of the metal, and wherein with respect to each of the at least four sides, each corresponding slot i) creates an opening between at least two portions of the Cu metal tab and ii) exposes the Si semiconductor die in relation to the Cu metal tab.

Abstract: A neutral grounding resistor fault protection arrangement. The fault protection arrangement may include a neutral grounding resistor, the neutral grounding resistor comprising a ground end and a non-ground end; a sense circuit, coupled to the non-ground end of the neutral grounding resistor; and a neutral grounding monitor, coupled to the non-ground end of the neutral grounding resistor, the neutral grounding monitor comprising an injection signal generator, the injection signal generator arranged to generate a frequency of 240 Hz or greater.

Abstract: A semiconductor device module. The semiconductor device module may include a first substrate; and a semiconductor die assembly, disposed on the first substrate. The semiconductor die assembly may include a first semiconductor die, bonded to the first substrate; a second semiconductor die, disposed over the first semiconductor die; and an electrical connector, disposed between the first semiconductor die and the second semiconductor die, wherein the semiconductor die assembly comprises an insulated gate bipolar transistor (IGBT) die and a freewheeling diode die.

Abstract: A resistance heater may include a polymer positive temperature coefficient (PPTC) material, arranged in a ring shape that defines a heater body; and an electrode assembly, comprising two or more electrodes arranged in contact with the heater body at two or more locations, wherein PPTC material comprises: a polymer matrix, the polymer matrix defining a PPTC body; and a conductive filler component, disposed in the polymer matrix.

Abstract: A self-limiting heater and method for building the self-limiting heater are disclosed. The self-limiting heater consists of a resistor and a PTC resistor coupled together in series with a power supply. Both resistive devices have good thermal coupling. The resistor has a minimal resistance change over changes in temperature while the resistance of the PTC resistor increases with an increase in temperature. The ohmic resistance ratio between the resistor and the PTC may be used to adjust the heater characteristics and limit the characteristic sharpness.

Abstract: Exemplary embodiments of the present disclosure of a fuse may include a fuse body having a first portion and a second portion. The first and second portions may be configured to mate together thereby forming an internal cavity. A first inner termination and a second inner termination may be at least partially attachable to the first and second portions of the fuse body at respective first and second ends. A fusible element may be disposed in the cavity of the fuse body and extendable from the first inner termination at the first end of the fuse body to the second inner termination at the second end of the fuse body. The fusible element may be attachable to the first inner termination at a first connection and the second inner termination at a second connection. The first and second connections may be inspectable when the fuse is in an assembled state.

Abstract: A fuse module including a mounting block formed of an electrically insulating material, the mounting block including a base portion and a wall portion disposed in a perpendicular relationship, the fuse module further including a fuse plate including an electrically conductive bus bar disposed on a bottom of the base portion, a fusible element electrically connected to the bus bar and disposed adjacent a front of the wall portion, and a fuse terminal electrically connected to the fusible element and disposed on a top of the base portion, the fuse module further including an electrically conductive terminal post extending from the top of the base portion and through the fuse terminal for facilitating connection to an electrical component.

Abstract: Exemplary embodiments of the present disclosure of a fuse may include a fuse body having a first portion and a second portion. The first and second portions may be configured to mate together thereby forming an internal cavity. A first inner termination and a second inner termination may be at least partially attachable to the first and second portions of the fuse body at respective first and second ends. A fusible element may be disposed in the cavity of the fuse body and extendable from the first inner termination at the first end of the fuse body to the second inner termination at the second end of the fuse body. The fusible element may be attachable to the first inner termination at a first connection and the second inner termination at a second connection. The first and second connections may be inspectable when the fuse is in an assembled state.

Abstract: A semiconductor device structure may include a semiconductor device, disposed at least in part in a semiconductor substrate, and a first insulator layer, disposed on a surface of the semiconductor device, and comprising a first contact aperture, disposed within the first insulator layer. The semiconductor device structure may also include a first contact layer, comprising a first electrically conductive material, disposed over the insulator layer, and being in electrical contact with the semiconductor device through the first contact aperture, and a second insulator layer, disposed over the first contact layer, wherein the second insulator layer further includes a second contact aperture, displaced laterally from the first contact aperture, by a first distance.

Abstract: A fuse including a fuse body, a fusible element disposed within the fuse body providing an electrically conductive pathway extending between a first end of the fuse body and a second end of the fuse body, and a heat shield disposed within the fuse body intermediate an interior surface of the fuse body and an exterior surface of the fuse body for mitigating heat flow therebetween.

Abstract: An optical rain sensor for detecting rainfall on a transparent substrate, the optical rain sensor including a housing disposed on a surface of the transparent substrate, a plurality of photo elements disposed within the housing, each photo element capable of being selectively activated to emit light and deactivated to receive light, and a controller operatively connected to the plurality of photo elements and configured to alternatingly drive the plurality of photo elements between a first mode of operation and a second mode of operation, wherein, in the first mode of operation, at least a first photo element is activated and at least a second photo element is deactivated and, in the second mode of operation, at least the second photo element is activated and at least the first photo element is deactivated.