Abstract: A server for providing personal computer (PC) functionality to a user at a multimedia terminal processes commands from the user. The server includes a source upgrade processor, a client software component for receiving a command signal from the user, a display updater for combining signals and a video encoder for sending a digital audio/visual (A/V) data-stream to a multimedia terminal. The server enables concurrent computer application processing for multiple simultaneous thin client users each having a multimedia terminal using a communication link to connect them to the server.

Abstract: A circuit for freezing a video frame having a first field interlaced with a second field. The circuit generally comprises a memory and a filter. The memory may be configured to present a plurality of coefficient signals that define (i) a first coefficient set for the first field and (ii) a second coefficient set for the second field. The filter may be configured to present a new frame in place of the video frame. The new frame may be generated from either (i) the first field and the first coefficient set in response to freezing on the first field or (ii) the second field and the second coefficient set in response to freezing on the second field.

Abstract: The present invention is directed to a standard high volume battery charger that is capable of applying a seasoning cycle to batteries disposed within it as well as display battery measurements on a monitor through a user interface serial port. This battery charger comprises an enclosure including a power supply, a user interface connector and disposed with at least one sub-module comprising a mode control board and battery cavity. The mode control board has a user interface front panel, which is comprised of a battery section, battery status panel and a system status panel. The system status panel has disposed upon it two switches, that control the operation of the sub-module, which enable a user to select the application of a seasoning cycle to the batteries in the charger.

Abstract: An interface apparatus provides a connection between a host having an IEEE 1394 input/output port and a mass storage device having an ATA input/output port. A receive FIFO and a transmit FIFO within the interface apparatus operates to store small-size packets, or operates to store the buffer address of large-size packets, as the small and large size packets are respectively received from the host or transmitted to the host. In both the host receive and host transmit modes of operation of the interface apparatus, the small-size packets are found in the receive FIFO or the transmit FIFO, whereas the data content of large-size packets is stored in the buffer as the corresponding buffer address is stored in the receive FIFO or the transmit FIFO.

Abstract: A platen for use in a dry etching process for substrate production, the platen having a surface susceptible to chipping and/or particle generation from the dry etching process and a coating applied to at least a portion of the surface for rendering the surface less susceptible to chipping and/or particle generation, the coating comprising a silicon carbide coating

Abstract: A circuit generally comprising a tank circuit and an inverter circuit. The tank circuit may be configured to generate a first signal having a frequency of oscillation in response to a second signal. The inverter circuit may be configured to (i) generate the second signal in response to inverting the first signal and (ii) adjust a delay in generating the second signal in response to an input signal to change the frequency of oscillation.

Abstract: A printed circuit board having contacts in a contact array of rows and columns. Groups of n columns of the contacts are electrically connected to n−1 columns of vias disposed interstitially in a via array between the n columns of the contacts. A major vertical routing channel is formed between adjacent groups of n columns of the contacts and the n−1 columns of vias. First electrical traces are electrically connected to a first number of the vias. The first electrical traces are routed to an outside edge of the via array through the major vertical routing channel.

Abstract: A method for forming the electrical interconnect levels and circuit elements of an integrated circuit is provided by the present invention. The method utilizes a relatively thin layer of conductive material having a higher resistance than the metal typically used to form electrical interconnections, such as titanium nitride, to provide relatively short local interconnections between circuit elements of the integrated circuit. In addition, this same thin layer of conductive material is used to form macro elements such as capacitors, resistors, and fuses in the integrated circuit. By allowing the removal of space consuming transverse electrical interconnect lines from the interconnect levels, the present invention increases the routing density of the electrical interconnect levels.

Abstract: Cell overlap is removed from rows during a cell placement procedure for an integrated circuit chip. The rows are partitioned into subrows so that cells in each subrow have a common characteristic vector. Cell overflow is removed from each of the subrows by moving a cell of an overflowed row or exchanging two cells, at least one of which is in the overflowed subrow. The half-cells of the dual height cells are moved to cell positions in a suitable pair of rows based on a calculated movement penalty. The movement is accomplished to align the half-cells and minimize the penalty. In preferred embodiments, the process is carried out by a computer under control of a computer program.

Abstract: A process for forming a capacitive structure and a fuse structure in an integrated circuit device includes forming a first capacitor plate and first and second fuse electrodes in a first dielectric layer of the device. In a second dielectric layer overlying the first dielectric layer, a capacitor dielectric section overlying the first capacitor plate, and a fuse barrier section overlying and between the first and second fuse electrodes are formed simultaneously. In a conductive layer overlying the second dielectric layer, a second capacitor plate overlying the capacitor dielectric section, and a fuse overlying the fuse barrier section and contacting the first and second fuse electrodes are formed simultaneously. The capacitor dielectric section and the fuse barrier section may be defined simultaneously by selectively removing portions of the first dielectric layer during a single etching step.

Abstract: A circuit comprising a memory, a queue, and a translator. The memory may be configured to store a message at an address at least as great as a base address. The queue may be configured to store a descriptor, wherein the descriptor is configured to have (i) an index, (ii) a routing field, and (iii) fewer bits than the address. The translator may be configured to translate between the address and the index.

Abstract: A structure for programming a memory cell on an integrated circuit provides access at multiple mask levels of the integrated circuit to each of the programming voltages which may be used to program the memory cell. In an embodiment, the structure includes a conductive signal path extending through multiple horizontally conductive layers of the integrated circuit from a programming voltage pad (or node) to an input of the memory cell. The conductive signal path includes portions selected from multiple alternate path portions formed within the multiple horizontally conductive layers through which the signal path extends. An embodiment of a method for making a mask includes selecting one of multiple configurations of the programming structure portion to be formed using the mask. A computer-usable carrier medium may include digital representations of the alternative configurations for a programming structure portion from which a programming structure pattern may be selected.

Abstract: A method of chemically altering a silicon surface and associated dielectric materials are disclosed.

Abstract: An improved shadow directory technique allocates storage space for directories in pairs in a logical volume. One of the spaces in each pair is used for a directory for locating data in the logical volume. The other space is reserved for an updated copy (shadow) of the directory if the directory is ever to be changed or updated. After the shadow directory is stored, it becomes a new directory for locating the data in place of the previous directory. The storage space containing the previous directory is unused, but retained as allocated for the next shadow directory, if needed. Since directory storage spaces are not deallocated, the improved shadow directory technique enables a simplified sequential-allocation storage management in a primarily data-add environment.

Abstract: A method of detecting contamination on a backside of a semiconductor wafer includes the steps of positioning the backside of the wafer in contact with a detection surface of a contaminant sensor, and detecting deformation of the detection surface of the contaminant sensor. The contaminant sensor may be incorporated into a fabrication device such as a wafer handling device, or can be utilized in the construction of a stand-alone device. An apparatus for detecting contamination on the backside of a semiconductor wafer is also disclosed.

Abstract: An apparatus comprising a first circuit and a second circuit. The first circuit may be configured to obtain a number of service parameters from a network device. The second circuit may be configured to store (i) a first portion of the service parameters in a first group comprising identification parameters, a number of pointers, and a control field and (ii) one or more second portions of the service parameters in one or more second groups, each comprising a communication parameter and a counter. Each of the number of pointers points to a null address or one of the one or more second groups.

Abstract: An apparatus for demodulating digital video broadcast signals comprising data modulated on a plurality of spaced carrier frequencies, comprising a transform circuit and a timing synchronization circuit. The transform circuit may be configured to analyze digital sample values. The timing synchronization circuit may be configured to synchronize the transform circuit with symbol periods of the broadcast signal. The timing synchronization circuit may be further configured to operate in (i) a first mode for analyzing the digital sample values over a relatively wide timing range to establish synchronization and (ii) a second mode for analyzing the digital sample values over a relatively narrow range about a synchronization point.

Abstract: An apparatus comprising a first circuit and a second circuit. The first circuit may be configured to generate a first detection signal and a second detection signal in response to (i) an input signal, (ii) a first control signal, and (iii) a second control signal. The second circuit may be configured to generate a first output signal and a second output signal in response to (i) the first detection signal, (ii) the second detection signals, and (iii) a third control signal.

Abstract: An apparatus for constructing a number of integrated circuits from a single substrate is provided by the present invention. A number of integrated circuits are constructed on the single substrate. The individual integrated circuits are then separated by cutting the substrate with a dicing saw. A vacuum chuck is used to grasp the individual integrated circuits while a back grinding process is performed on the individual circuits to polish the circuits to a predetermined thickness. The integrated circuits are then placed into integrated circuit packages. By performing the back grinding process after the substrate has been divided into the separate individual circuits, the present invention eliminates the need to back grind portions of the substrate that are not further used, and tends to eliminate handling of the fragile thinned substrate.

Abstract: Clock cycle simulation involves modeling of clock cycles in a hardware module with a software model. Each simulated clock cycle involves several individual stages: Start, Execute, and End. During the start stage, output pin values for the model are calculated from an initial state of the module being simulated. Between the start stage and the execution stage, a combinatorial function of the modules outputs can be calculated. These calculated functions may be used as inputs to the modules in the execution stage. Afterwards, during the execute stage, input pin values are received by the model and the next state of the module is calculated based upon the current module state and the input pin values. Finally, during the last stage, i.e., the end stage, the internal state is updated; the internal state is defined as a set of the module's internal register and memory values.