Abstract: The invention provides exemplary systems and methods for releasably securing a data storage device within a data storage system. In one exemplary embodiment, the invention comprises a cabinet which defines an enclosure. The data storage device is removably held within the enclosure. A cover is further provided which comprises a pivot end and a latch end. The pivot end is pivotally attached to the data storage device so that pivoting of the cover will release the data storage device at least partially from the enclosure. A cover latch is operably attached to the latch end, with the cover latch engaging the data storage device to prevent pivoting of the cover when the cover is closed.

Abstract: The present invention advantageously provides a method for conditioning a polishing pad used for chemical mechanical polishing of a semiconductor wafer surface. The method involves directing a fluid at a relatively high pressure toward the surface of the pad, thereby roughening the surface of the pad and removing particles embedded in pores of the pad. This process provides for uniform conditioning across the surface of the pad and excludes the use of particles which might become disposed on the pad, unlike some other conventional conditioning methods. The exclusion of abrasive particles prevents scratching of wafers which may subsequently undergo CMP using the polishing pad. The conditioning fluid hereof may, among other things, be a typical CMP slurry or variation thereof, or may be deionized water.

Abstract: An optical system is provided with an adaptable window element at a Fourier plane for spatial filtering. Having a window element made up of individually addressable pixels provides a substantial improvement in the spatial filtering adaptability and precision. When combined with a computer and sensor, the window may become part of a negative feedback loop, thereby providing the optical system with more consistent reproducibility, higher reliability with graceful degradation, and more precise control over final results.

Abstract: Apparatus and method for testing of memory locations containing both test data and test check bits are provided. The apparatus includes a memory controller that communicates with memory devices. In a test mode of operation using a test mode control bit, the memory controller receives test data, together with test check bits that have values corresponding to at least some of the values of the test data. The test data and test check bits are written to desired memory locations of the memory devices. The memory controller is involved in a subsequent read of these same memory locations and receives the test data and test check bits from those previously written memory locations. The memory controller determines whether a correspondence exists between the test check bits that were written and the test check bits that were read. Any lack of correspondence is indicative of one or more memory location faults.

Abstract: A process of making an IC wafer including a surface with improved uniformity, planarity and a reduced likelihood of creating stringers is disclosed.

Abstract: A Motion Picture Experts Group (MPEG) multiplexed data bitstream includes encoded video and audio data units, which are prefixed with headers including Presentation Time Stamps (PTS) indicating desired presentation times for the respective data units. The data units are decoded, and presented at a fixed time after decoding, such that the fixed time can be subtracted from the PTS to provide a desired decoding time. The bitstream is parsed, the video and audio headers are stored in video and audio header memories, and the associated video and audio data units are stored in video and audio channel memories respectively. A first interrupt is generated each time a header is stored, and a host microcontroller responds by storing the PTS from the header and the starting address of the corresponding data unit in the channel memory as an entry in a list.

Abstract: An integrated circuit die includes a plurality of semiconductor cells and first and second power supply conductors. The power supply conductors have different relative polarities and are electrically coupled to the plurality of semiconductor cells. A power supply de-coupling capacitor is formed within the die and is electrically coupled between the first and second power supply conductors.

Abstract: A cell scheduler for a distributed shared memory switch architecture including a controller for scheduling transmissions of cells from output queues of the switch structure pursuant to one of several different scheduling modes. The controller receives a mode selection input, segregates the output queues into groups, assigns priority rankings to the groups, and applies one of scheduling disciplines at each group of output queues as determined by the mode selection input and the priority rankings. The groups of output queues include a group of per-Virtual Channel (VC) queues and at least one group of First In-First Out (FIFO) queues. The scheduling disciplines include a Weighted Fair Queuing (WFQ) scheduling discipline applied by the controller at the group of per-VC queues and a Round Robin (RR) scheduling discipline applied by the controller at the at least one group of FIFO queues. The priority rankings comprising a highest priority ranking which is assigned to the group of per-VC queues.

Abstract: An analogue to digital converter system for digitizing a stream of analogue symbols, the analogue to digital converter system includes an analogue to digital converter for sampling the symbols at predetermined sample timings and a feedback loop for adjusting the sample timings. The feedback loop includes an eye opening detector connected to an output of the analogue to digital converter and responsive to successive digitized symbol samples to determine eye opening signals. The eye opening detector includes a deviation detector for determining a deviation signal representative of a deviation of a digitized symbol sample value with respect to a mean sample value. Preferably, a variance measurement calculator calculates the variance of these deviations. A feedback control is responsive to successive eye opening signals to generate timing control signals for adjusting the sample timings.

Abstract: A method for maintaining login service parameters includes a step of allocating space for and storing a login service parameter portion of a logged in port. A login service parameter of a logged in port is then compared with stored login service parameter structures. If the login service parameter of the logged in port, except for a login service parameter portion thereof, is identical with one of the stored login service parameters, a step of adding a first pointer to that stored login service parameters structure into the stored login service parameter portion structure is carried out. A new login service parameter portion structure is allocated and the process repeated, thereby creating a linked list of login service parameter portion structures, each login service parameter portion structure pointing to both the stored login service parameter structure and to a next login service parameter portion structure.

Abstract: A DBS receiver front end which includes a tuner chip and a demodulator/decoder chip. The tuner chip converts a receive signal to a baseband signal using a tuning frequency signal generated from a tank circuit. The design of a package for the tuner chip maximally spaces the pins associated with high frequency signals by placing them on opposite sides of the chip (in the case of two high frequency signal sources) or (in the case of three high frequency signal sources) in a triangle formation with widely spaced vertices wherein at least two of the pins are adjacent to corners of the package. For two or more high frequency signal sources, a good determination of pin locations can be determined according to the formula P.sub.i =C+i.multidot..left brkt-bot.N/M.right brkt-bot., i=1, . . . , M, where P.sub.i are the pin numbers, N is a total number of pins around the perimeter of the package, M is a total number of the high frequency signal sources, and C is an offset number.

Abstract: An A/D converter has an auto-zeroed latching comparator with an input offset voltage. The latching comparator is repetitively switched between an offset adjustment mode and a conversion mode. When the comparator is in the offset adjustment mode, the comparator compares the reference voltage to itself and generates an offset measurement output based on the comparison. A feedback circuit adjusts the input offset voltage based on the offset measurement output. When the comparator is in the conversion mode, the comparator compares the input signal to the reference voltage and generates the digital output signal based on the comparison.

Abstract: A first-in-first-out (FIFO) memory system. The FIFO memory system contains a first fall-through FIFO having an input and an output. A pointer-based FIFO having an input and an output, wherein the input of the pointer-based FIFO is connected to the output of the first fall-through FIFO. The FIFO memory system also includes a second fall-through FIFO having an input and an output, wherein the input of the second fall-through FIFO is connected to the output of the pointer-based FIFO, wherein data placed into the input of the first fall-through FIFO appears at the output of the second fall-through FIFO in a first-in-first-out basis.

Abstract: A semiconductor package having positioned therein a protection layer which protects the integrated circuit chip from electrostatic discharge (ESD) damage. The protection layer is made of a material that has at steady state a high electrical resistance, but when a high ESD potential is applied to it, it becomes highly conductive. A preferred material is SurgX.TM., which is a polymer. The layer is positioned to shunt the potential away from the chip, and can be positioned operatively between a signal lead and a power plane or between different signal leads. That is, the protection layer can be sandwiched between the lead and the conductive member, or the lead can be within the layer. Another preferred construction incorporates the protection material in a tape construction as a thin layer sandwiched between and bonded to a layer of leads and a ground plane.

Abstract: A wrap back test system and method for providing local fault detection within a section of an integrated I/O interface core device on an integrated circuit is disclosed. The system and method of this invention is suitable for use in any I/O interface having both a transmitter and a receiver section. The wrap back of input test data, prior to reformatting for transmission, to the receiver's data alignment stage permits fault detection within the core of an integrated I/O interface. By illustration, in a serializer/deserializer I/O, the wrap back of alignment pattern encoded parallel data, prior to serialization, to the receiver's data alignment stage permits identifying faults in just this portion of the I/O transceiver. The wrap back test system and method of this invention permits fault isolation of within the boundaries of the I/O core and independent of external logic or testers.

Abstract: In a SCSI controller, unexpected messages are automatically received in response to an attention signal by receiving all of the bytes constituting the message and storing those bytes in an available register file selected from a plurality of register files in the controller. Once the entire message has been received and stored, a determination of an appropriate response is initiated. The register files are also used to hold selection information during a bus-initiated selection, so additional architecture is not required.

Abstract: A method of depositing a low carbon content, high density TiN thin film on a substrate. A substrate is placed within a deposition chamber, and the pressure within the deposition chamber is adjusted to the deposition pressure. A portion of the total thickness desired of the TiN thin film is deposited. The portion of the TiN thin film contains an amount of carbon. Carbon is scavenged from the portion of the TiN thin film deposited by introducing scavenger gases into the deposition chamber. The scavenger gases are chosen so as to be reactive with carbon. The pressure within the deposition chamber is adjusted to the scavenger pressure, and a plasma of the scavenger gases is created within the deposition chamber. The steps from deposition through scavenging are repeated until the desired thickness of TiN is deposited, and the substrate having the desired thickness of TiN deposited thereon is removed from the deposition chamber.

Abstract: A memory device which tests the memory array under typical operating conditions. In one embodiment, the memory device incorporates a heating element to heat the memory array to a predetermined operating temperature, and a BIST (built-in self test) unit to test the memory array at the predetermined operating temperature. This may advantageously provide a method for detecting and repairing faulty memory locations that would not normally test faulty under initial power-up conditions. Broadly speaking, the present invention contemplates a memory device which comprises a memory array and a heating element on a substrate. The memory array is configured to receive a read/write signal on a read/write line, configured to receive an address on an address bus, configured to provide data to a data bus when the read/write signal indicates a read operation, and configured to store data from the data bus when the read/write signal indicates a write operation.

Abstract: The present invention concerns a DBS receiver which serves to combine the functions of variable rate demodulation, convolutional decoding, de-interleaving and block decoding. The demodulation stage includes a novel circuit for clock synchronization. By combining the functions of these components this device provides a higher level of utility as measured in terms of reliability, simplicity, flexibility, cost effectiveness, and integration of board layout while maintaining optimum-quality signal processing.

Abstract: A low-gain, low-jitter VCO circuit implemented in CMOS provides center frequency adjustment to overcome process variations. Further, noise immunity is improved by using a separate feedback loop to provide the nominal current biasing for the oscillator chain. This feedback loop coarsely sets the center frequency. The actual control of the oscillation frequency is achieved by a second current source, whose output is added to the nominal bias current to provide a total bias to the oscillator. This second current source "fine tunes" the oscillator frequency responsive to a control signal. Because two separate current sources are used, the circuit can realize a high oscillation frequency with a low VCO gain. Another feature provides for adjusting the center frequency in response to a digital input word provided via external pins, or from internal logic or memory. The center frequency thus can be calibrated by measurement at the time of manufacture, or changes later by the end user or by other circuitry.