Patents Assigned to Micronics
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Publication number: 20210041480Abstract: An object of the present disclosure is to make it possible to improve electrical inspection of an object to be inspected by making the conduction characteristics of an electrical signal flowing through an electrical contactor better.Type: ApplicationFiled: July 28, 2020Publication date: February 11, 2021Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventors: YASUTAKA KISHI, MASAHIRO WAKAZAWA
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Patent number: 10906149Abstract: The invention provides a machine tool capable of expanding the slidable range of the moving unit without making the oil feeding system complicated. A machine tool in which a moving unit slides against a supporting unit with a sliding surface of the supporting unit facing a sliding surface of the moving unit, comprises a first oil groove formed on an unexposed portion of the sliding surface of the supporting unit; a second oil groove formed on an unexposed portion of the sliding surface of the moving unit; and an oil inlet formed on one of the first oil groove and the second oil groove. Lubricant fed through the oil inlet is supplied to the other of the first oil groove and the second oil groove.Type: GrantFiled: July 27, 2017Date of Patent: February 2, 2021Assignee: STAR MICRONICS CO., LTD.Inventor: Rui Ota
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Patent number: 10908182Abstract: An electrical connecting apparatus includes a contact unit provided on a substrate to contact an electrode terminal of a test subject in response to receipt of a load. The contact unit includes multiple plate-like members stacked in the thickness directions of the plate-like members and supported on the substrate in such a manner that a contact surface formed at an end surface of each of the plate-like members contacts a wiring pattern on the substrate. At least some of the multiple plate-like members are contacts including a base, and an arm having one end supported by the base and an opposite end where a tip portion to contact the electrode terminal is formed. The arm has a surface to contact a surface of an adjacent one of the plate-like members to form a conductive path connecting the tip portion and the wiring pattern through the adjacent plate-like member.Type: GrantFiled: June 14, 2017Date of Patent: February 2, 2021Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventor: Eichi Osato
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Patent number: 10901031Abstract: Provided is an electric connecting apparatus 10 including a plurality of probes 20, a probe substrate 16 connected to base end portions 20b of the probes 20, and a probe support body 18, when tip end portions 20a of the probes 20 are pressed by a device under test, preventing the adjacent probes 20 from interfering. The probe support body 18 includes a plate-like guide portion 30 including guide holes through which the probes 20 pass. The guide portion 30 includes an upper guide portion 31, a lower guide portion 32, and a middle guide portion 33. The probes pass through the guide holes of the upper guide portion 31, the middle guide portion 33, and the lower guide portion 32 to be guided toward the device under test. The middle guide portion 33 is provided to be movable in a perpendicular direction X perpendicular to a thickness direction Y.Type: GrantFiled: July 18, 2017Date of Patent: January 26, 2021Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Masatomo Uebayashi, Akihisa Akahira, Tomoaki Kuga
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Patent number: 10892452Abstract: A cell structure of the present invention includes first and second sheet shaped cells, each including a first electrode and a second electrode, and an insulating member arranged between the first and second sheet shaped cells. Here, the second electrode of the first sheet-shaped cell and the second electrode of the second sheet-shaped cell face each other. The first sheet shaped cell includes a tab portion extended on an XY plane to outside of the second sheet shaped cell and the second sheet shaped cell includes a tab portion extended on the XY plane to outside of the first sheet shaped cell. The second electrodes are connected through a tab lead arranged from the tab portion to the tab portion.Type: GrantFiled: December 13, 2016Date of Patent: January 12, 2021Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Gouichi Iwao, Makoto Kikuta, Masami Sano
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Patent number: 10859599Abstract: An electrical connection device includes: a probe (10); and a probe head (20) including a top portion (21) allowing penetration of the probe (10), a bottom portion (23) disposed closer to a distal end portion than the top portion (21) and allowing penetration of the probe (10), and an upper guide portion (24) and a lower guide portion (25), which are disposed between the top portion (21) and the bottom portion (23) and allow penetration of the probe (10), wherein the probe (10) is held in a curved state between the top portion (21) and the bottom portion (23), the probe (10) buckles by contact of the distal end portion with an inspection object (2), and at least a continuous portion of the probe (10), which ranges from a portion where the probe (10) in a buckling state penetrates the bottom portion (23) to a portion where the probe (10) penetrates the lower guide portion (25), is a high-rigidity portion (101) made to have higher rigidity than a buckling portion of the probe (10).Type: GrantFiled: April 3, 2018Date of Patent: December 8, 2020Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Takayuki Hayashizaki, Hisao Narita
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Publication number: 20200319245Abstract: An electrical contactor capable of coping with an electrical test under a high temperature environment and realizing reliable positioning is provided, An electrical contactor includes: a planar body portion formed of a conductive member; an upper arm having a cantilever beam structure, including an upper base extending integrally and continuously upward from the body Portion, an upper supporting portion extending in a horizontal direction from the upper base along the body portion, and a first distal end extending vertically upward from the upper supporting portion to make electrical contact with a first contact target; a lower arm having a cantilever beam structure, including a lower base extending integrally and continuously downward from the body portion, a lower supporting portion extending in a horizontal direction from the lower base along the body portion, and a second distal end extending vertically downward from the lower supporting portion to make electrical contact with a second contact target; a fType: ApplicationFiled: February 7, 2020Publication date: October 8, 2020Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventor: EICHI OSATO
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Patent number: 10775411Abstract: A probe card includes a probe having a spring property and a probe head that holds the probe. The probe head includes a guide portion that holds the probe such that the probe can move in an axis direction Z. The guide portion includes a heat radiation structure that absorbs heat of the probe generated by energization and emits the heat to the outside of the probe.Type: GrantFiled: October 13, 2016Date of Patent: September 15, 2020Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Tetsuya Yoshioka, Takashi Kawano, Shigeki Makise, Mika Nasu
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Patent number: 10776556Abstract: A wiring board design support apparatus, in which a plurality of vias are arranged on a wiring board, includes a design information storage unit that stores design information of vias and wirings to be arranged on the wiring board, and a wiring board via arrangement unit that moves, on a basis of the design information, positions of lattice points arranged with same intervals in vertical and horizontal directions by a given moving amount in a vertical direction and a horizontal direction while alternately changing a moving direction in the horizontal direction of the lattice points for each row of the lattice and alternately changing a moving direction in the vertical direction of the lattice points for each column of the lattice, so as to arrange vias at positions of the lattice points after movement.Type: GrantFiled: June 27, 2019Date of Patent: September 15, 2020Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Katsushi Mikuni, Ryuichi Yagisawa, Akitsugu Yamaguchi
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Patent number: 10768207Abstract: An electrical connection device includes: a probe head (20) including a guide hole (200), in which a shape perpendicular to an extending direction of the guide hole (200) is a shape formed by round-chamfering corner portions of a polygonal shape; and a probe (10) held by the probe head (20) in a state of penetrating the guide hole (200), wherein notches which go along an axial direction of the probe (10) are formed on angle regions of the probe (10), the angle regions facing the corner portions (200C) of the guide hole (200).Type: GrantFiled: April 3, 2018Date of Patent: September 8, 2020Assignee: Kabushiki Kaisha Nihon MicronicsInventor: Takayuki Hayashizaki
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Patent number: 10707516Abstract: A sheet layering jig of the present invention include a sheet holding portion that includes a sheet holding side face to hold sheets and is arranged on a stage so that the sheet holding side face faces a work space; an electrode holding portion that includes an electrode holding side face to hold electrodes and is arranged on the stage so that the electrode holding side face faces the work space, a sheet holding guide that holds the sheets along the sheet holding side face, an electrode holding guide that holds the electrodes along the electrode holding side face, and a magnetic circuit that generates magnetic force to generate a gap between the sheets.Type: GrantFiled: March 15, 2017Date of Patent: July 7, 2020Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Hidenori Ando, Makoto Kikuta, Gouichi Iwao
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Patent number: 10705122Abstract: Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3; and a dielectric film 6. The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3, so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2. The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13, during an inspection of the object to be inspected.Type: GrantFiled: March 21, 2017Date of Patent: July 7, 2020Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Yoshiyuki Fukami, Hidehiro Kiyofuji, Noboru Otabe
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Patent number: 10705151Abstract: An intermediate structure unit for a secondary cell according to the present invention is the intermediate structure unit for a secondary cell having a secondary cell and a test structure unit on a common substrate. Each of the secondary cell and the test structure unit includes a first electrode layer and a second electrode layer. A plurality of layers are layered at the secondary cell between the first electrode layer and the second electrode layer. The plurality of layers include at least a metal oxide semiconductor layer and a charging layer. A party of the plurality of layers is formed at the test structure unit between the first electrode layer and the second electrode layer.Type: GrantFiled: June 23, 2016Date of Patent: July 7, 2020Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Yuki Sato, Kazuyuki Tsunokuni, Tomokazu Saito
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Publication number: 20200191829Abstract: To maintain the horizontalness of a probe card even, if the number of measured DUTs is increased. An electrical connecting apparatus according to the present, disclosure comprises a support member having a lower surface region in which a level part is formed and a wiring board provided adjacent to the lower surface of the support member, and to be connected to a testing device side. The electrical connecting apparatus comprises: a connection unit having multiple connection terminals; a probe substrate electrically connecting multiple probes to the connection terminals; multiple anchors arranged on the upper surface of the probe substrate; and multiple supports functioning as supports between corresponding ones of the anchors and the support member via the wiring board and the connection unit.Type: ApplicationFiled: November 8, 2019Publication date: June 18, 2020Applicant: KABUSHI KAISHA NIHON MICRONICSInventors: TOSHIYUKI KUDO, TAKAYUKI NARUMI, YOSHINORI KIKUCHI, TAKAO YASUTA
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Patent number: 10686210Abstract: A method for manufacturing oxide semiconductor secondary cells concurrently and evenly on a plurality of chips. A method for manufacturing a chip on which an oxide semiconductor secondary cell is mounted, the oxide semiconductor secondary cell that is formed by layering a first electrode, a charging function layer, and a second electrode being layered on a circuit. The method includes a layering process to layer and form the oxide semiconductor secondary cells integrally at regions corresponding to a plurality of chips formed on a wafer without separately forming oxide semiconductor secondary cells at regions corresponding to the respective chips, and a separating process to perform separation into individual oxide semiconductor secondary cells corresponding to the respective chips by performing pattern etching on the integrally-formed oxide semiconductor secondary cells to eliminate regions not corresponding to the respective chips except for regions corresponding to the respective chips.Type: GrantFiled: June 20, 2016Date of Patent: June 16, 2020Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Kazuyuki Tsunokuni, Tatsuo Inoue, Tomokazu Saitoh, Juri Ogasawara, Takashi Tonokawa, Takuo Kudoh
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Publication number: 20200103442Abstract: The present invention provides a probe card holder including a plate-shaped frame formed with an opening approximately the same size as the probe card, a plurality of card bottom surface holding portions that are provided around a peripheral edge of the opening in the frame and that hold a bottom surface of the probe card while biasing the bottom surface, and a plurality of card top surface supporting portions that support the top surface of the probe card. Each card bottom surface holding portion includes an L-shaped member with a base portion and a bottom surface supporting portion, a knob that is linked to a tip end portion of the base portion and a biasing member that is disposed between the knob and the top surface of the frame and that biases the bottom surface supporting member upward toward the bottom surface of the frame.Type: ApplicationFiled: September 9, 2019Publication date: April 2, 2020Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventors: HIDEKI HIROTA, TAKAO YASUTA, TAKAYUKI NARUMI, YOSHINORI KIKUCHI
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Patent number: 10571488Abstract: A probe includes: a probe base body having a first end as a portion that contacts a test object in an inspection and a second end that contacts a contact point member; a covering member that covers the probe base body between the first end and the second end; and an enlarged diameter portion 6 provided at an exposed portion on the second end side of the probe base body. The probe is attached in a bent-deformed state by pressing a terminal portion on the first end side of the covering member against a base portion of the contact inspection device. The second end of the probe base body is pressed against a contact point of the contact point member by opposing force due to the pressing.Type: GrantFiled: September 27, 2017Date of Patent: February 25, 2020Assignee: Kabushiki Kaisha Nihon MicronicsInventor: Tomoaki Kuga
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Publication number: 20200050732Abstract: To improve wiring housing property, with preferable work efficiency, without deviation in the vertical direction or the horizontal direction, without expanding via arrangement areas.Type: ApplicationFiled: June 27, 2019Publication date: February 13, 2020Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventors: KATSUSHI MIKUNI, RYUICHI YAGISAWA, AKITSUGU YAMAGUCHI
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Patent number: D893588Type: GrantFiled: April 9, 2018Date of Patent: August 18, 2020Assignee: STAR MICRONICS CO., LTD.Inventor: Ryo Kurebayashi
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Patent number: D895719Type: GrantFiled: April 10, 2018Date of Patent: September 8, 2020Assignee: STAR MICRONICS CO., LTD.Inventor: Keisuke Tokuda