Abstract: An electrical contactor capable of coping with an electrical test under a high temperature environment and realizing reliable positioning is provided, An electrical contactor includes: a planar body portion formed of a conductive member; an upper arm having a cantilever beam structure, including an upper base extending integrally and continuously upward from the body Portion, an upper supporting portion extending in a horizontal direction from the upper base along the body portion, and a first distal end extending vertically upward from the upper supporting portion to make electrical contact with a first contact target; a lower arm having a cantilever beam structure, including a lower base extending integrally and continuously downward from the body portion, a lower supporting portion extending in a horizontal direction from the lower base along the body portion, and a second distal end extending vertically downward from the lower supporting portion to make electrical contact with a second contact target; a f

Abstract: A wiring board design support apparatus, in which a plurality of vias are arranged on a wiring board, includes a design information storage unit that stores design information of vias and wirings to be arranged on the wiring board, and a wiring board via arrangement unit that moves, on a basis of the design information, positions of lattice points arranged with same intervals in vertical and horizontal directions by a given moving amount in a vertical direction and a horizontal direction while alternately changing a moving direction in the horizontal direction of the lattice points for each row of the lattice and alternately changing a moving direction in the vertical direction of the lattice points for each column of the lattice, so as to arrange vias at positions of the lattice points after movement.

Abstract: A probe card includes a probe having a spring property and a probe head that holds the probe. The probe head includes a guide portion that holds the probe such that the probe can move in an axis direction Z. The guide portion includes a heat radiation structure that absorbs heat of the probe generated by energization and emits the heat to the outside of the probe.

Abstract: An electrical connection device includes: a probe head (20) including a guide hole (200), in which a shape perpendicular to an extending direction of the guide hole (200) is a shape formed by round-chamfering corner portions of a polygonal shape; and a probe (10) held by the probe head (20) in a state of penetrating the guide hole (200), wherein notches which go along an axial direction of the probe (10) are formed on angle regions of the probe (10), the angle regions facing the corner portions (200C) of the guide hole (200).

Abstract: Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3; and a dielectric film 6. The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3, so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2. The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13, during an inspection of the object to be inspected.

Abstract: A sheet layering jig of the present invention include a sheet holding portion that includes a sheet holding side face to hold sheets and is arranged on a stage so that the sheet holding side face faces a work space; an electrode holding portion that includes an electrode holding side face to hold electrodes and is arranged on the stage so that the electrode holding side face faces the work space, a sheet holding guide that holds the sheets along the sheet holding side face, an electrode holding guide that holds the electrodes along the electrode holding side face, and a magnetic circuit that generates magnetic force to generate a gap between the sheets.

Abstract: An intermediate structure unit for a secondary cell according to the present invention is the intermediate structure unit for a secondary cell having a secondary cell and a test structure unit on a common substrate. Each of the secondary cell and the test structure unit includes a first electrode layer and a second electrode layer. A plurality of layers are layered at the secondary cell between the first electrode layer and the second electrode layer. The plurality of layers include at least a metal oxide semiconductor layer and a charging layer. A party of the plurality of layers is formed at the test structure unit between the first electrode layer and the second electrode layer.

Abstract: To maintain the horizontalness of a probe card even, if the number of measured DUTs is increased. An electrical connecting apparatus according to the present, disclosure comprises a support member having a lower surface region in which a level part is formed and a wiring board provided adjacent to the lower surface of the support member, and to be connected to a testing device side. The electrical connecting apparatus comprises: a connection unit having multiple connection terminals; a probe substrate electrically connecting multiple probes to the connection terminals; multiple anchors arranged on the upper surface of the probe substrate; and multiple supports functioning as supports between corresponding ones of the anchors and the support member via the wiring board and the connection unit.

Abstract: A method for manufacturing oxide semiconductor secondary cells concurrently and evenly on a plurality of chips. A method for manufacturing a chip on which an oxide semiconductor secondary cell is mounted, the oxide semiconductor secondary cell that is formed by layering a first electrode, a charging function layer, and a second electrode being layered on a circuit. The method includes a layering process to layer and form the oxide semiconductor secondary cells integrally at regions corresponding to a plurality of chips formed on a wafer without separately forming oxide semiconductor secondary cells at regions corresponding to the respective chips, and a separating process to perform separation into individual oxide semiconductor secondary cells corresponding to the respective chips by performing pattern etching on the integrally-formed oxide semiconductor secondary cells to eliminate regions not corresponding to the respective chips except for regions corresponding to the respective chips.

Abstract: The present invention provides a probe card holder including a plate-shaped frame formed with an opening approximately the same size as the probe card, a plurality of card bottom surface holding portions that are provided around a peripheral edge of the opening in the frame and that hold a bottom surface of the probe card while biasing the bottom surface, and a plurality of card top surface supporting portions that support the top surface of the probe card. Each card bottom surface holding portion includes an L-shaped member with a base portion and a bottom surface supporting portion, a knob that is linked to a tip end portion of the base portion and a biasing member that is disposed between the knob and the top surface of the frame and that biases the bottom surface supporting member upward toward the bottom surface of the frame.

Abstract: A probe includes: a probe base body having a first end as a portion that contacts a test object in an inspection and a second end that contacts a contact point member; a covering member that covers the probe base body between the first end and the second end; and an enlarged diameter portion 6 provided at an exposed portion on the second end side of the probe base body. The probe is attached in a bent-deformed state by pressing a terminal portion on the first end side of the covering member against a base portion of the contact inspection device. The second end of the probe base body is pressed against a contact point of the contact point member by opposing force due to the pressing.

Abstract: To improve wiring housing property, with preferable work efficiency, without deviation in the vertical direction or the horizontal direction, without expanding via arrangement areas.