Abstract: Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.

Abstract: A tubular member for an exhaust gas treatment device according to at least one embodiment of the present invention includes: a tubular main body made of a metal; and an insulating layer formed at least on an inner peripheral surface of the tubular main body. The insulating layer contains glass, and the glass has a content of an alkali metal element of 1,000 ppm or less.

Abstract: A honeycomb structure includes a pillar-shaped honeycomb structure body having a porous partition wall defining a plurality of cells serving as fluid through channels extending from a first end face to a second end face, and having a circumferential wall disposed so as to encompass the circumference of the partition wall, wherein a thickness of the partition wall is 50 to 132 ?m, a porosity of the partition wall is 40 to 55%, an open frontal area of pores on the surface of the partition wall per unit surface area of the partition wall is 10 to 15%, and a percentage (S0˜10/Sall×100%) of the ratio of an opening area S0˜10 of the pores having an opening diameter of 10 ?m or less to a total opening area Sall of the pores opened to the surface of the partition wall is 90% or more.

Abstract: A zeolite membrane complex comprises: a support; and a zeolite membrane formed on the support. The membrane is of SAT-type zeolite, and in an X-ray diffraction pattern obtained by X-ray irradiation to the zeolite membrane, a peak intensity around 2?=13.9° is 1.5 times or more a peak intensity around 2?=8.5°.

Abstract: A drying method for a separation membrane includes supplying a gas for drying to the separation membrane so that a value obtained by dividing the difference between a maximum value and a minimum value of a flow rate of the gas for drying on a membrane surface of the separation membrane by the minimum value of the flow rate is less than or equal to 15%. The gas for drying is less than or equal to 40 degree C. and contains a water-soluble gas that has a solubility in 1 cm3 of water of greater than or equal to 0.5 cm3 in conditions of 40 degree C. and 1 atmosphere.

Abstract: A honeycomb filter includes a pillar-shaped honeycomb substrate having a porous partition wall and a plugging portion provided so as to plug end at any one of the inflow end face side or the outflow end face side of the cell, wherein in a section orthogonal to the extending direction of the cell, the shape of the cell is hexagonal, the partition wall includes a first partition wall disposed between the inflow cell and the outflow cell and a second partition wall disposed between the inflow cells, and the first partition wall has a porous trapping layer on its surface for trapping particulate matter in exhaust gas, and the second partition wall has no trapping layer on its surface or has a trapping layer thinner than the trapping layer disposed on the surface of the first partition wall.

Abstract: Provided is a layered double hydroxide (LDH) separator including a porous substrate made of a polymeric material; and a hydroxide-ion conductive layered compound being a LDH and/or a LDH-like compound with which pores of the porous substrate are plugged. The LDH separator has a mean porosity of 0.03% to less than 1.0%.

Abstract: A honeycomb structure includes a pillar-shaped honeycomb structure body which has porous partition walls disposed to surround a plurality of cells Among the partition walls surrounding one of the cells, each of the partition walls constituting two opposite sides of the cell sandwiched therebetween is provided with a projection which project to extend into the cell and which is continuously provided in a direction in which the cell extends, and the area S1 of one region of the cell divided by a virtual line that virtually connects distal ends of the two projections in a section of the honeycomb structure body, and the area S2 of the other region (S1?S2) of the cell satisfy 70%?S1/S2×100%.

Abstract: A forging tool used to forge a workpiece in a cuboidal forging space, wherein (a): the forging space is formed when the bottom surface of the first die and the bottom surface of the second die are brought into contact with the contact surface of the third die, or (b): the forging space is formed when a first die contact surface provided in the first die and a second die contact surface provided in the second die are brought into contact with each other.

Abstract: A composite substrate includes in this order: a support substrate; an intermediate layer; and a piezoelectric layer, wherein the intermediate layer contains bubbles.

Abstract: An electrically heating converter includes: a pillar shaped honeycomb structure made of conductive ceramics, including: an outer peripheral wall; and a partition wall disposed on an inner side of the outer peripheral wall, the partition wall defining a plurality of cells, each of the cells penetrating from one end face to other end face to form a flow path; metal electrodes; conductive connecting portions arranged on a surface of the pillar shaped honeycomb structure; and a pressing member configured to press the metal electrodes against the conductive connecting portions, so that the metal electrodes are electrically connected to the pillar shaped honeycomb structure. Each of the conductive connecting portions has an electrical resistivity lower than that of the pillar shaped honeycomb structure.

Abstract: A focus ring placement table includes an annular ceramic heater on which a focus ring is placed, a metal base, an adhesive element bonding the metal base and the ceramic heater, an inner-peripheral-side protective element disposed between the metal base and the ceramic heater and bonded to an inner peripheral portion of the adhesive element, and an outer-peripheral-side protective element disposed between the metal base and the ceramic heater and bonded to an outer peripheral portion of the adhesive element. A coefficient of thermal expansion of the adhesive element is equal to or smaller than a coefficient of thermal expansion of the inner-peripheral-side protective element and is equal to or greater than a coefficient of thermal expansion of the outer-peripheral-side protective element.

Abstract: A member for a semiconductor manufacturing apparatus includes a disk-shaped or annular ceramic heater, a metal base, an adhesive element bonding the metal base and the ceramic heater, an adhesive protective element disposed between the ceramic heater and the metal base to extend along a periphery of the adhesive element, and an anti-adhesion layer disposed between the adhesive element and the protective element, the anti-adhesion layer preventing adhesion between the adhesive element and the protective element.

Abstract: A wafer placement table includes a ceramic substrate that has a wafer placement surface, a first electrode that is embedded in the ceramic substrate, a first power supply terminal that is inserted from a surface of the ceramic substrate opposite the wafer placement surface toward the first electrode, a first joint that joins the first electrode and the first power supply terminal to each other and a second electrode that is disposed between the wafer placement surface and the first electrode in the ceramic substrate. A linear portion that extends in the ceramic substrate from a position on the first electrode opposite the first joint to the wafer placement surface is composed of material of the ceramic substrate.

Abstract: A composite substrate according to includes: a support substrate; and a piezoelectric layer arranged on one side of the support substrate, wherein an amplitude of a waviness having a spatial frequency of more than 0.045 cyc/mm according to a shape of the support substrate is 10 nm or less.

Abstract: An electrically heating converter includes: a pillar shaped honeycomb structure made of conductive ceramics, including: an outer peripheral wall; and a partition wall disposed on an inner side of the outer peripheral wall, the partition wall defining a plurality of cells, each of the cells penetrating from one end face to other end face to form a flow path; metal electrodes; a leaf spring provided on each of the metal electrodes; and a pressing member configured to press each of the leaf springs against the pillar shaped honeycomb structure, so that the pillar shaped honeycomb structure is electrically connected to each of the metal electrodes.

Abstract: A heat exchanger includes a hollow pillar shaped honeycomb structure, a first outer cylindrical member, an inner cylindrical member, an upstream cylindrical member, a cylindrical connecting member, and a downstream cylindrical member. The heat exchanger further includes a valve mechanism having an on-off valve located on a downstream end portion side of the inner cylindrical member. The valve mechanism is rotatably supported by a bearing arranged on a radially outer side of the downstream cylindrical member, and the on-off valve is fixed to a shaft arranged so as to penetrate the downstream cylindrical member and the inner cylindrical member.

Abstract: A heat exchange member including: a honeycomb structure body including: partition walls extending from a first end surface to a second end surface to define cells forming flow passages for a first fluid; and an outer peripheral wall; and a covering member configured to cover the outer peripheral wall of the honeycomb structure body. The partition walls and the outer peripheral wall contain ceramic as a main component, and the outer peripheral wall surface has a peak count RPc according to JIS B 0601:2013 set to 55 pks/cm or larger.

Abstract: A bonded body has a supporting substrate composed of silicon, piezoelectric material substrate, and a bonding layer provided on a bonding surface of the supporting substrate and composed of a metal oxide. An amount of aluminum atoms on the bonding surface of the supporting substrate is 1.0×1011 to 1.0×1015 atoms/cm2.

Abstract: Provided is a method for producing a piezoelectric element in which a piezoelectric body substrate piece is subjected to polarization treatment and a piezoelectric element is produced. The method includes a first step in which the piezoelectric body substrate piece is held on a flat plate-shaped slightly adhesive sheet and a second step in which voltage is applied to the piezoelectric body substrate piece held on the slightly adhesive sheet and the piezoelectric body substrate piece is subjected to polarization treatment.