Patents Assigned to NXP
  • Patent number: 8853797
    Abstract: A MEMS device and method, comprising: a substrate; a beam; and a cavity located therebetween; the beam comprising a first beam layer and a second beam layer, the first beam layer being directly adjacent to the cavity, the second beam layer being directly adjacent to the first beam layer; the first beam layer comprising a metal or a metal alloy containing silicon; and the second beam layer comprising a metal or a metal alloy substantially not containing silicon. Preferably the second beam layer is thicker than the first beam layer e.g. at least five times thicker, and the first beam layer comprises a metal or alloy containing between 1% and 2% of silicon. The second beam layer provides desired mechanical and/or optical properties while the first beam layer prevents spiking.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V
    Inventor: Robertus T. F. van Schaijk
  • Patent number: 8854277
    Abstract: A millimeter-wave radio antenna module (600) comprising: an antenna substrate (603) having an antenna (602) provided on a face thereof; and a semiconductor die (601) comprising a wireless system IC, the die mounted on a face of the antenna substrate and configured to provide a signal to the antenna, wherein a ball grid array (605) is formed on a face of the antenna substrate for mounting the antenna module to a circuit board, the ball grid array being configured to define an air dielectric gap (606) between the antenna and the circuit board.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventors: Antonius Johannes Matheus De Graauw, Freek Egbert Van Straten
  • Patent number: 8855326
    Abstract: A microphone system is provided, wherein the microphone system comprises a microphone array comprising a plurality of microphone units each adapted to generate a primary signal indicative of an acoustic wave received from the respective microphone unit, a first echo cancellation unit, an integrator unit, and a combination unit, wherein the microphone system is adapted to generate a first dipole response and a monopole response from the primary signals, wherein the integrator unit is adapted to generate a first integrated dipole response by integrating the first dipole response, wherein the first echo cancellation unit is adapted to generate a first echo cancelled integrated dipole response from the first integrated dipole response, and wherein the combination unit is adapted to combine the monopole response and the first echo cancelled integrated dipole response.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventors: Rene Martinus Maria Derkx, Cornelis Pieter Janse
  • Patent number: 8853859
    Abstract: Aspects of the disclosure are directed towards an efficient wafer level chip-scale package, and methods or producing the packages. Various aspects are directed to protecting against humidity, contamination, mechanical damage, and current leakage while maintaining isolation and manufacturability of the plastic package and a ratio of active die size to package size.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: October 7, 2014
    Assignee: NXP B.V.
    Inventors: Olaf Pfenningstorf, Wolfgang Schnitt
  • Patent number: 8854847
    Abstract: A power management device comprises: an input for receiving a transient energy pulse; a first storage section and a second storage section for storing energy from the input; an output; a switching section for selectively connecting the input, first storage section, second storage section and output in at least first and second configurations, wherein in the first configuration the first and second storage sections are connected so as to distribute energy from the transient energy pulse between the first and second storage sections, in the second configuration the respective voltages across the first and second storage sections are combined additively to produce an output voltage at the output, whereby the output voltage after switching to the second configuration is greater than the output voltage before switching to the second configuration.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventor: Timothy Luke Farnsworth
  • Patent number: 8853816
    Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: October 7, 2014
    Assignee: NXP B.V.
    Inventors: Peter Gerard Steeneken, Roel Daamen, Gerard Koops, Jan Sonsky, Evelyne Gridelet, Coenraad Cornelis Tak
  • Patent number: 8855187
    Abstract: A signal processing method for enhancing the dynamic range of a signal is disclosed. The method comprises: a) forming an attenuated signal from an input signal; b) filtering each of the input and the attenuated signals such that the sum of their bandwidths is less than or equal to the bandwidth of a transmission channel; c) modulating a first one of the filtered input signal and the filtered attenuated signal, whereby the filtered input signal and the filtered attenuated signal occupy respective non-overlapping frequency ranges within the bandwidth of the transmission channel; and d) combining the modulated signal with the second one of the filtered input signal and the filtered attenuated signal to form a composite output signal.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: October 7, 2014
    Assignee: NXP B.V.
    Inventor: Friedrich Reining
  • Patent number: 8853798
    Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20) and a second metal portion (21); a passivation stack (24, 26, 28) covering the metallization stack; a gas sensor including a sensing material portion (32, 74) on the passivation stack; a first conductive portion (38) extending through the passivation stack connecting a first region of the sensing material portion to the first metal portion; and a second conductive portion (40) extending through the passivation stack connecting a second region of the sensing material portion to the second metal portion. A method of manufacturing such an IC is also disclosed.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventor: Matthias Merz
  • Patent number: 8855337
    Abstract: The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2, the method comprising the steps of dividing the first layer 2 into a microphone layer 5 and into an accelerometer layer 6, covering a front side of the microphone layer 5 and a front side of the accelerometer layer 6 with a continuous second layer 7, covering the second layer 7 with a third layer 8, forming a plurality of trenches 9 in the third layer 8, removing a part 10 of the wafer 1 below a back side of the microphone layer 5, forming at least two wafer trenches 11 in the wafer 1 below a back side of the accelerometer layer 6, and removing a part 12, 13 of the second layer 7 through the plurality of trenches 9 formed in the third layer 8. The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventors: Twan van Lippen, Geert Langereis, Martijn Goossens
  • Patent number: 8856500
    Abstract: A program is obfuscated by reordering its instructions. Original instruction addresses are mapped to target addresses in an irregular way, with position dependent address steps between the addresses of logically successive instructions. Preferably pseudo-random address steps are used, for example with address steps that have mutually opposite sign with equal frequency. The data processing device has an instruction flow control unit that updates instruction addresses according the position dependent address steps. The instruction flow control unit may comprise a circuit that contains secret information, which is not normally accessible from the outside, to control the updates. A lookup table may be used for example, with address steps, successor addresses or mapped address values. In an embodiment the mapping of original instruction addresses to target addresses may be visualized by means of a path (36) along points in an n-dimensional array, where n is greater than one.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: October 7, 2014
    Assignee: NXP B.V.
    Inventors: Marc Vauclair, Pieter J. Janssens
  • Patent number: 8854231
    Abstract: A vehicle parking assistance system is based on presenting a bird's eye view. The display has an input interface such as a touch-input display or a remote input device such as a joystick. In this case, by selecting a desired position on the display (which is presenting an image of an object or location in space for which the driver is wanting to know the range), the user is able to request a distance calculation between the vehicle and that location in space. The distance information can be provided as an audible message and/or as a visual overlay message onto the bird's eye view.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventors: Bijo Thomas, Biju Ravindran
  • Patent number: 8855252
    Abstract: The invention relates to an apparatus and a method for detecting and correcting input signals regarding click noise, using a first detector unit and a second correction unit, the detector unit differentiates the input signal and extracts the noise signal and compares the sum of two noise samples with a threshold value and in case this sum exceeds the threshold value a click is observed, while the correction unit corrects the input signal in the phase domain and differentiates it prior to outputting the corrected signal.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventors: Jasper Siemons, Gertjan Groot Hulze
  • Patent number: 8855353
    Abstract: The present invention relates to a headset device, an audio device and methods of receiving a radio signal via the headset device, wherein the headset device comprises at least one first conductor for supplying an audio signal to a respective ear-piece, a second conductor arranged in a loop configuration for providing a magnetic antenna, and a connector (50) having at least one respective first connecting portion (3, 4) for providing a connection to the at least one first conductor (140), a second connecting portion (1) for providing a connection to a first end of the second conductor (70), and a third connecting portion (2) for providing a connection to a second end of the second conductor (70), wherein an output of the magnetic antenna is provided between the second and third connecting portions (1, 2). At the audio device, an impedance transformer (10) is coupled to the second and third connecting portions at its primary side and to an amplifier (20) at its secondary side.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventor: Cor Meesters
  • Patent number: 8854143
    Abstract: Proposed is a bias circuit for a transistor in a C class amplifier. The bias circuit comprises: a class AB amplifier bias voltage generating means adapted to generate a bias voltage at an output terminal; and a transistor connected between the output terminal and a first reference voltage, the control terminal of the transistor being connected to a second reference voltage via a switch. Closure of the switch connects the second reference voltage to the control terminal of the transistor to cause a shift in the bias voltage generated by the class AB amplifier bias voltage generating means to achieve a predetermined class C bias voltage at the output terminal.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventor: Jean-Jacques Bouny
  • Patent number: 8856197
    Abstract: A system and method for processing data utilizes a matrix of processing units using an array of commands stored in memory to process input data words to generate output data words, which can be used in various applications.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventor: Xavier Chabot
  • Publication number: 20140295756
    Abstract: A Near Field Communication (NFC) device for contactless communication includes a transmitter being adapted to generate an electromagnetic carrier signal and to modulate the carrier signal according to transmitting data, an antenna having an inductor, which antenna is connected to and driven by the transmitter with the modulated carrier signal, and wherein connection points of the antenna are further connected to inputs of switches, the outputs of these switches being switchable between ground potential and inputs of a rectifier, the outputs of the rectifier being fed to power supply rails of the NFC device.
    Type: Application
    Filed: June 11, 2014
    Publication date: October 2, 2014
    Applicant: NXP B.V.
    Inventor: Erich Merlin
  • Publication number: 20140292287
    Abstract: A semiconductor device, comprising first and second field effect transistors arranged in a cascode configuration: wherein the first field effect transistor is a depletion mode transistor; and wherein the second field effect transistor comprises a first source to gate capacitance and a second additional source to gate capacitance connected in parallel to the first source to gate capacitance. A power factor correction (PFC) circuit comprising the semiconductor device. A power supply comprising the PFC circuit.
    Type: Application
    Filed: March 13, 2014
    Publication date: October 2, 2014
    Applicant: NXP B.V.
    Inventors: Philip RUTTER, Maarten SWANENBERG
  • Publication number: 20140291392
    Abstract: A smartcard communicating simultaneously with a smart phone and a point of sale, thereby allowing the smartcard to act as a bridge between the point of sale and the smart phone. The smart card is typically powered by the point of sale and typically communicates with the smart phone using BLUETOOTH Low Energy (BLE).
    Type: Application
    Filed: April 2, 2013
    Publication date: October 2, 2014
    Applicant: NXP B.V.
    Inventors: Philippe Teuwen, Cedric Colnot
  • Patent number: 8847466
    Abstract: The present invention relates to a piezoelectric bimorph switch, specifically a cantilever (single clamped beam) switch, which can be actively opened and closed. Piezoelectric bimorph switch are known from the prior art. Such a switch may be regarded as an actuator. Actuators are regarded as a subdivision of transducers. They are devices, which transform an input signal (mainly an electrical signal) into motion. Electrical motors, pneumatic actuators, hydraulic pistons, relays, comb drive, piezoelectric actuators, thermal bimorphs, Digital Micromirror Devices and electroactive polymers are some examples of such actuators. The switch of the invention comprises piezoelectric stack layers (121, 122), which form a symmetrical stack, wherein an electric field is always applied in the same direction as the poling direction of the piezoelectric layers.
    Type: Grant
    Filed: June 18, 2009
    Date of Patent: September 30, 2014
    Assignee: NXP B.V.
    Inventors: Olaf Wunnicke, Klaus Reimann
  • Patent number: 8844826
    Abstract: In a method of producing an integrated circuit (1, 91, 131) for a transponder (2, 112) a photoresist layer (11) is applied on a first surface (8) of a semiconductor device (3). A patterned mask (14, 94) is generated by lithographically patterning the photoresist layer (11), so that the photoresist layer (11) comprises at least one first via (12, 13). The patterned mask (14, 94) comprises a second surface (17) facing away from the first surface (8). The first via (12, 13) is filled with a first bump (15, 16) by depositing the first bump (12, 13) on the first surface (8). A conductive structure (18, 19, 98, 99, 132) is formed on the second surface (17) of the patterned mask (14, 94). The conductive structure (18, 19, 98, 99, 132) is electrically connected to the first bump (15, 16).
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: September 30, 2014
    Assignee: NXP B.V.
    Inventors: Reinard Rogy, Christian Zenz