Patents Assigned to OmniVision Technologies
-
Patent number: 9773829Abstract: A method of image sensor fabrication includes providing a semiconductor material, an insulation layer, and a logic layer, where the semiconductor material includes a plurality of photodiodes. A through-semiconductor-via is formed which extends from the semiconductor material, through the insulation layer, and into the logic layer. The through-semiconductor-via is capped with a capping layer. A metal pad is disposed in a first trench in the semiconductor material. Insulating material is deposited on the capping layer, and in the first trench in the semiconductor material. A resist is deposited in a second trench in the insulating material, and the second trench in the insulating material is aligned with the metal pad. The insulating material is removed to expose the capping layer, and a portion of the capping layer disposed proximate to the plurality of photodiodes is also removed. A metal grid is formed proximate to the plurality of photodiodes.Type: GrantFiled: February 3, 2016Date of Patent: September 26, 2017Assignee: OmniVision Technologies, Inc.Inventors: Yuanwei Zheng, Gang Chen, Duli Mao, Dyson Tai
-
Patent number: 9762833Abstract: Techniques and methods for reducing or preventing latch up in row decoder circuits are disclosed herein. An example apparatus may include an array of pixels, a row address decoder, and control circuitry. The row decode circuit including a plurality of decode circuits, each including at least two transistors having respective body terminals coupled to a first node. The control circuitry including a body biasing circuit coupled to the first node, the body biasing circuit to adaptively provide a bias voltage to the first node in response to an operating state of the imaging system and/or a change in one of two reference voltages based on a control signal provided by a bias control circuit.Type: GrantFiled: May 24, 2016Date of Patent: September 12, 2017Assignee: OmniVision Technologies, Inc.Inventors: Charles Qingle Wu, Yun Hak Koh
-
Patent number: 9759554Abstract: A projector panel includes pixel display, a display controller, and a pattern generator. The pattern generator is operative to output pixel data indicative of at least one application specific predetermined pattern. In a particular embodiment, the projector panel is a liquid-crystal-on-silicon panel. In another particular embodiment, the projector panel is adapted for selective use in either structured light projection systems or conventional video projection systems.Type: GrantFiled: August 2, 2013Date of Patent: September 12, 2017Assignee: OmniVision Technologies, Inc.Inventors: Sunny Yat-san Ng, Manuel Lu
-
Patent number: 9762825Abstract: A method for reducing ADC time for dark signals starts with pixel array capturing image data of frames including first frame and second frame. Pixel array includes visible pixels and black pixels (OPB). Scanning circuitry then selects OPB of first frame to be readout. OPB generate a dark signal when selected by scanning circuitry. Column readout circuitry included in readout circuitry then acquires the dark signal of first frame and processes the dark signal based on a ramp signal received from ramp generator included in readout circuitry to generate dark ADC output. Readout circuitry then determines a ramp timing offset based on the dark signal of first frame. The ramp timing offset is then applied to the second frame, which includes generating by the ramp generator the ramp signal for a second frame that includes the ramp timing offset. Other embodiments are described.Type: GrantFiled: December 30, 2015Date of Patent: September 12, 2017Assignee: OmniVision Technologies, Inc.Inventor: Hiroaki Ebihara
-
Patent number: 9757015Abstract: An imaging system for use in a spatially constrained location includes an image sensor for capturing an image, wherein the image sensor has (a) a first rectangular area containing a pixel array and connecting circuitry communicatively coupled with the pixel array and (b) a second rectangular area with only one shared side with the first rectangular area and containing support electronics for pixel array control and signal acquisition, where the support electronics is communicatively coupled with the connecting circuitry. An imaging method for use in a spatially constrained location includes (a) forming an image of a scene on a pixel array of an image sensor contained within a first rectangular area having a first side and (b) communicating electrical signals between the pixel array and support electronics located onboard the image sensor and contained within a second rectangular area sharing only one side with the first rectangular area.Type: GrantFiled: April 23, 2014Date of Patent: September 12, 2017Assignee: OmniVision Technologies, Inc.Inventor: Junzhao Lei
-
Patent number: 9756298Abstract: A color filter array includes a plurality of tiled minimal repeating units, each minimal repeating unit comprising an M×N set of individual filters. Each minimal repeating unit includes a plurality of imaging filters including individual filters having at least first, second, and third photoresponses, and at least one reference filter having a reference photoresponse, wherein the reference filter is positioned among the imaging filters and wherein the reference photoresponse transmits substantially the same percentage of wavelengths that remain unfiltered by filters of a different photoresponse than the incident wavelength. Other embodiments are disclosed and claimed.Type: GrantFiled: September 15, 2016Date of Patent: September 5, 2017Assignee: OmniVision Technologies, Inc.Inventors: Chen-Wei Lu, Jin Li, Yin Qian, Dyson H. Tai
-
Patent number: 9753298Abstract: A despeckle optical system for an image projector includes a diffuser, an in-plane vibrator, a microlens array, and a vibrator driver. The in-plane vibrator is coupled to vibrate the diffuser along a vibration plane. The vibrator driver is coupled to drive the in-plane vibrator and configured to drive the in-plane vibrator at different vibration amplitudes for averaging the intensity of speckle in display light that propagates through the diffuser via the microlens array.Type: GrantFiled: April 8, 2014Date of Patent: September 5, 2017Assignee: OmniVision Technologies, Inc.Inventor: Yi-Wei Liu
-
Patent number: 9748308Abstract: A method of fabricating an image system includes forming a first wafer that includes a first semiconductor substrate and a first interconnect layer. A pixel array is formed in an imaging region of the first semiconductor substrate and a first insulation-filled trench is formed in a peripheral circuit region of the first semiconductor substrate. Additionally, a second wafer is formed that includes a second semiconductor substrate and a second interconnect layer. A second insulation-filled trench is formed in a second semiconductor substrate, and the first wafer is bonded to the second wafer. A third interconnect layer of a third wafer is bonded to the second wafer. At least one deep via cavity is formed through the first and second interconnect layers and through the first and second insulation-filled trenches. The at least one deep via cavity is filled with a conductive material to form a deep via.Type: GrantFiled: May 26, 2016Date of Patent: August 29, 2017Assignee: OmniVision Technologies, Inc.Inventors: Yin Qian, Dyson H. Tai, Jin Li, Chen-Wei Lu, Howard E. Rhodes
-
Patent number: 9749569Abstract: High speed rolling image sensor includes pixel array disposed in first semiconductor die, readout circuits disposed in second semiconductor die and conductors. Pixel array is partitioned into pixel sub-arrays (PSAs). Each of the PSAs includes a plurality of pixels. Pixel groups include pixels that are non-contiguous, non-overlapping and distinct. Each pixel group includes pixels from different PSAs. Each pixel group is coupled to a corresponding analog-to-digital converter and memory unit tiles (ADMs) respectively included in readout circuits. ADMs respectively include (i) analog-to-digital (ADC) circuits that convert the image data from pixel groups from analog to digital to obtain ADC outputs, and (ii) memory units to store ADC outputs. Conductors are coupling pixel array to ADMs. Conductors include number of conductors per column of pixel array. Number of conductors per column of pixel array may be equal to number of pixels in PSA arranged in same column. Other embodiments are described.Type: GrantFiled: December 22, 2015Date of Patent: August 29, 2017Assignee: OmniVision Technologies, Inc.Inventors: Keiji Mabuchi, Sohei Manabe
-
Patent number: 9749562Abstract: A novel head mounted display includes a display/image sensor. In a particular embodiment the display/image sensor is formed on a single silicon die, which includes display pixels and light sensor pixels. The display pixels and light sensor pixels are each arranged in rows and columns, and the arrays of light sensor pixels and display pixels are interlaced. The center of each light sensor pixel is located between adjacent rows and adjacent columns of display pixels.Type: GrantFiled: November 13, 2015Date of Patent: August 29, 2017Assignee: OmniVision Technologies, Inc.Inventors: Takayuki Goto, Yin Qian, Chen-wei Lu
-
Patent number: 9748293Abstract: An image sensor package with a folded cover-glass sealing interface includes (a) an image sensor with a light-receiving surface, (b) a substrate having (i) a recessed surface to which the image sensor is bonded, (ii) a second surface facing in a direction parallel to optical axis of the image sensor, surrounding the recessed surface, and being further than the light-receiving surface from the recessed surface, and (iii) a third surface facing the optical axis, and adjoining and surrounding the second surface, and (c) a cover glass bonded to the substrate with a folded sealing-interface at the second surface and the third surface.Type: GrantFiled: August 2, 2016Date of Patent: August 29, 2017Assignee: OmniVision Technologies, Inc.Inventors: En-Chi Li, Chi-Chih Huang, Wei-Feng Lin
-
Patent number: 9740030Abstract: A near-eye display device includes (a) a display unit having a liquid-crystal-on-silicon (LCOS) display and a first polarizing beam splitter interface for (i) reflecting illumination light from an illumination module towards the liquid-crystal-on-silicon display and (ii) transmitting display light from the LCOS display based on the illumination light, and (b) a viewing unit having an imaging objective that forms an image of the LCOS display for the pupil based on the display light, and a second polarizing beam splitter interface for (i) reflecting reflected display light from the imaging objective towards the pupil and (ii) transmitting ambient light from an ambient scene towards a pupil, the second polarizing beam splitter interface and the first polarizing beam splitter interface being orthogonal to a common plane.Type: GrantFiled: May 15, 2014Date of Patent: August 22, 2017Assignee: OmniVision Technologies, Inc.Inventors: Yi-Wei Liu, Wei-Feng Huang, Yen-Sung Wang, Chun-Sheng Fan
-
Method and system of implementing an uneven timing gap between each image capture in an image sensor
Patent number: 9743025Abstract: Stacked chip imaging system comprising pixel array partitioned into pixel sub-arrays (PSAs) disposed in first semiconductor die and ADC circuitry including ADC circuits disposed in second semiconductor die. Each PSA is arranged into pixel groups. Each pixel group generates pixel data signals. Pixel array captures image data of first frame with first exposure time, second frame with second exposure time, third frame with third exposure time, and fourth frame with fourth exposure time. First, second, third and fourth exposure times are different. At least one of the pixel groups in each of the pixel sub-arrays is coupled to a different ADC circuit from pixels groups remaining in each of the pixel sub-arrays. ADC circuitry acquires the pixel data signals. For each frame, ADC circuits converts pixel data signal received from pixel groups respectively coupled thereto from analog to digital to generate ADC outputs. Other embodiments are also described.Type: GrantFiled: December 30, 2015Date of Patent: August 22, 2017Assignee: OmniVision Technologies, Inc.Inventor: Jie Shen -
Patent number: 9735950Abstract: An example burst mode clock data recovery circuit may include a clock recovery circuit coupled to receive a plurality of data signals, and provide a recovered clock signal in response. Each of the plurality of data signals includes data and an embedded clock signal, and the plurality of data signals may be based on an encoded symbol. The clock recovery circuit is coupled to generate the recovered clock signal in response to a first one of the plurality of data signals. A data recovery circuit may be coupled to receive the plurality of data signals and the recovered clock signal, and provide a plurality of recovered data signals in response to the recovered clock signal. The data recover circuit is coupled to delay each of the plurality of data signals, and capture each of the delayed plurality of data signals in response to the at least one clock pulse.Type: GrantFiled: October 18, 2016Date of Patent: August 15, 2017Assignee: OmniVision Technologies, Inc.Inventors: Min Liu, Zhizhong Xie, Charles Qingle Wu
-
Patent number: 9735196Abstract: A method of fabricating a pixel array includes forming a transistor network along a frontside of a semiconductor substrate. A contact element is formed for every pixel in the pixel array that is electrically coupled to a transistor within the transistor network. An interconnect layer is formed upon the frontside to control the transistor network with a dielectric that covers the contact element. A cavity is formed in the interconnect layer. A conductive layer is formed along cavity walls of the cavity and a dielectric layer is formed over the conductive layer within the cavity. A photosensitive semiconductor material is deposited over the dielectric layer within the cavity. An electrode cavity is formed that extends into the contact element. The electrode cavity is at least partially filled with a conductive material to form an electrode. The electrode, the conductive layer, and the photosensitive semiconductor material form a photosensitive capacitor.Type: GrantFiled: October 5, 2016Date of Patent: August 15, 2017Assignee: OmniVision Technologies, Inc.Inventors: Wu-Zang Yang, Chia-Ying Liu, Chih-Wei Hsiung, Chun-Yung Ai, Dyson H. Tai, Dominic Massetti
-
Patent number: 9728153Abstract: Displays and display driving methods implement a pixel set/reset scheme. Pixel cells of an example display each include a set terminal, a reset terminal, an output terminal, and a set/reset circuit. Responsive to receiving a set signal on the set terminal, the set/reset circuit asserts a first signal on the output terminal and maintains the first signal on the output terminal until a reset signal is received on the reset terminal. Responsive to receiving a reset signal on the reset terminal, the set/reset circuit asserts a second signal on the output terminal and maintains the second signal on the output terminal until a set signal is received on the set terminal. The optical output of the pixel depends on when the first signal and the second signal are asserted on the output terminal of the set/reset circuit during a predefined modulation period.Type: GrantFiled: October 21, 2014Date of Patent: August 8, 2017Assignee: OmniVision Technologies, Inc.Inventors: Yunsheng Wang, Sunny Yat-san Ng
-
Patent number: 9720076Abstract: A time of flight imaging system includes a light source coupled to emit light pulses to an object in response a light source modulation signal generated in response to a reference modulation signal. Each pixel cell of a time of flight pixel cell array is coupled to sense light pulses reflected from the object in response a pixel modulation signal. A programmable pixel delay line circuit is coupled to generate the pixel modulation signal with a variable pixel delay programmed in response to a pixel programming signal. A control circuit is coupled to receive pixel information from the time of flight pixel array representative of the sensed reflected light pulses. The control circuit is coupled to vary the pixel programming signal during a calibration mode to synchronize the light pulses emitted from the light source with the pulses of the pixel modulation signal.Type: GrantFiled: August 29, 2014Date of Patent: August 1, 2017Assignee: OmniVision Technologies, Inc.Inventors: Jian Guo, Rui Wang, Tiejun Dai
-
Patent number: 9716868Abstract: Embodiments are described of a color filter array including a plurality of tiled minimal repeating units. Each minimal repeating unit includes a primary set of four rhombic color filters positioned so that at least two vertices of each rhombic color filter contact a vertex of an adjoining rhombic color filter and so that the four rhombic filters form a central interstitial space and four peripheral interstitial spaces, wherein the primary set includes at least one color filter with a first spectral photoresponse, at least one color filter with a second spectral photoresponse, and at least one color filter with a third spectral photoresponse.Type: GrantFiled: March 3, 2016Date of Patent: July 25, 2017Assignee: OmniVision Technologies, Inc.Inventor: Duli Mao
-
Patent number: 9712774Abstract: A method of implementing dynamic ground sharing in an image sensor with pipeline architecture starts with a pixel array capturing image data. Pixel array includes pixels to generate pixel data signals, respectively. A readout circuitry acquires the image data from a row in the pixel array. An analog-to-digital conversion (ADC) circuitry included in the readout circuitry samples the image data from the row to obtain sampled input data. When the ADC circuitry is sampling, a ground sharing switch is closed to couple the pixel array and the ADC circuitry to a common ground. When the ADC circuitry is not sampling, the ground sharing switch is open to separate the pixel array and the ADC circuitry from the common ground. The ADC circuitry converts the sampled image data from analog to digital to obtain an ADC output. Other embodiments are described.Type: GrantFiled: January 14, 2016Date of Patent: July 18, 2017Assignee: OmniVision Technologies, Inc.Inventors: Tianjia Sun, Qingfei Chen, Chun-Ming Tang, Jingyi Liu
-
Patent number: 9711546Abstract: An image sensor pixel includes a first photodiode and a second photodiode disposed in a semiconductor material. The first photodiode has a first doped region, a first lightly doped region, and a first highly doped region. The second photodiode has a second full well capacity substantially equal to a first full well capacity of the first photodiode, and includes a second doped region, a second lightly doped region, and a second highly doped region. The image sensor pixel also includes a first microlens optically coupled to direct a first amount of image light to the first photodiode, and a second microlens optically coupled to direct a second amount of image light to the second photodiode. The first amount of image light is larger than the second amount of image light.Type: GrantFiled: March 2, 2016Date of Patent: July 18, 2017Assignee: OmniVision Technologies, Inc.Inventors: Jeong-Ho Lyu, Sohei Manabe