Patents Assigned to OmniVision Technologies
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Patent number: 9954020Abstract: A high-dynamic-range color image sensor includes (a) a silicon substrate having a photosensitive pixel array with a plurality of first pixels and a plurality of second pixels, (b) a color filter layer disposed on the silicon substrate and including at least (i) a plurality of first color filters positioned above a first subset of each of the plurality of first pixels and the plurality of second pixels and configured to selectively transmit light of a first color and (ii) a plurality of second color filters positioned above a second subset of each of the plurality of first pixels and the plurality of second pixels and configured to selectively transmit light of a second color, and (c) a dynamic-range extending layer disposed on the color filter layer and including grey filters disposed above the second plurality of pixels to attenuate light propagating toward the second plurality of pixels.Type: GrantFiled: December 30, 2016Date of Patent: April 24, 2018Assignee: OmniVision Technologies, Inc.Inventors: Chen-Wei Lu, Dajiang Yang, Oray Orkun Cellek, Duli Mao
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Patent number: 9952415Abstract: A trenched-substrate based lens manufacturing method includes depositing lens material on a first side of a substrate, wherein the first side of the substrate has a plurality of trenches. The method further includes shaping a plurality of lens elements from the lens material. The method includes shaping the plurality of lens elements, on a respective plurality of surface portions of the first side, by contacting a mold to the first side. Each of the surface portions are adjacent a respective one of the trenches. Additionally, the method includes accommodating an excess portion of the lens material in the trenches. A lens system, manufactured using this method, includes a substrate with a planar surface and a trench embedded in the planar surface. The lens system further includes a lens element molded on the planar surface adjacent to the trench.Type: GrantFiled: April 22, 2015Date of Patent: April 24, 2018Assignee: OmniVision Technologies, Inc.Inventors: Shao Fan Kao, Chia-Yang Chang
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Patent number: 9955090Abstract: An image sensor includes a plurality of photodetectors that are identically sized and fabricated in semiconductor material with identical semiconductor processing conditions. The photodetectors are organized into virtual high-low sensitivity groupings, each including a first photodetector and a second photodetector. A plurality of attenuators is disposed over the semiconductor material. Each one of the plurality of attenuators is disposed along an optical path between a microlens and the first photodetector of each virtual high-low sensitivity grouping such that all incident light directed into the first photodetector is directed through a respective one of the plurality of attenuators. There is no attenuator along a second optical path between a microlens and the second photodetector of each virtual high-low sensitivity grouping such that all the incident light directed into the second photodetector is not directed through one of the plurality of attenuators.Type: GrantFiled: July 20, 2016Date of Patent: April 24, 2018Assignee: OmniVision Technologies, Inc.Inventors: Dajiang Yang, Gang Chen, Oray Orkun Cellek, Xin Wang, Chen-Wei Lu, Duli Mao, Dyson H. Tai
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Patent number: 9947337Abstract: An echo canceller includes a fast Fourier transform (FFT) unit to provide frequency domain representation (FD) of an input. A multiband adaptive filter receives the FD of the input and provides an FD filter output, the adaptive filter is a finite input response (FIR) digital filter. Another FFT unit provides an FD of a microphone signal, and a summer adds the FD filter output to the FD of the microphone signal to provide echo-canceller FD output. A feedback subsystem uses the echo-canceller FD output to adjust filter coefficients of at least a first, a second, and a third frequency band of the multiband adaptive filter to minimize uncancelled output in the echo-canceller FD output. The feedback subsystem adjusts the filter coefficients of the second frequency band of the adaptive filter according to uncancelled output in the first, second, and third frequency bands of the echo-canceller FD output.Type: GrantFiled: March 21, 2017Date of Patent: April 17, 2018Assignee: OmniVision Technologies, Inc.Inventors: Chung-An Wang, Dong Shi
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Patent number: 9935144Abstract: An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor.Type: GrantFiled: November 28, 2016Date of Patent: April 3, 2018Assignee: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Chi-Chih Huang, En-Chi Li
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Patent number: 9936123Abstract: A digital widescreen camera has an anamorphic lens focusing a field of view nearly twice as wide as tall on a photosensor array having nearly square aspect ratio. In embodiments, the photosensor array has an 8-pixel tiling unit organized as four pairs of adjacent left and right pixels, a first pair having two red-responsive pixels, a second pair having two blue-responsive pixels, and a third pair having two green-responsive pixels. In embodiments, signals from the 8-pixel tiling unit are processed into signals equivalent to signals from two adjacent Bayer-pattern 4-pixel tiling units. The corresponding method of digital photography includes receiving light through an anamorphic lens onto a photosensor array. In embodiments, the photosensor array has an eight-pixel tiling with four pairs of adjacent left and right pixels, a first pair with two red-responsive pixels, a second pair with two blue-responsive pixels, and a third pair with two green-responsive pixels.Type: GrantFiled: August 4, 2016Date of Patent: April 3, 2018Assignee: OmniVision Technologies, Inc.Inventor: Kevin Johnson
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Patent number: 9936153Abstract: Apparatuses and methods for image sensors with pixels that reduce or eliminate flicker induced by high intensity illumination are disclosed. An example image sensor may include a photodiode, a transfer gate, an anti-blooming gate, and first and second source follower transistors. The photodiode may capture light and generate charge in response, and the photodiode may have a charge capacity. The transfer gate may selectively transfer charge to a first floating diffusion, and the anti-blooming gate may selectively transfer excess charge to a second floating diffusion when the generated charge is greater than the photodiode charge capacity.Type: GrantFiled: October 4, 2016Date of Patent: April 3, 2018Assignee: OmniVision Technologies, Inc.Inventors: Duli Mao, Trygve Willassen, Johannes Solhusvik, Keiji Mabuchi, Gang Chen, Sohei Manabe, Dyson H. Tai, Bill Phan, Oray Orkun Cellek, Zhiqiang Lin
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Patent number: 9935145Abstract: An image sensor includes a first pixel and a second pixel. The first pixel includes a first light sensitive element, a first light filter, and a first microlens. The second pixel is disposed adjacent to the first pixel and includes a second light sensitive element, a second light filter, and a second microlens. The first pixel is configured to direct at least some of the light received at the first microlens to the second light sensitive element of the second pixel to increase optical crosstalk so as to reduce color aliasing.Type: GrantFiled: October 29, 2015Date of Patent: April 3, 2018Assignee: OmniVision Technologies, Inc.Inventor: Raymond Wu
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Publication number: 20180090538Abstract: An image sensor includes a substrate, a plurality of light sensitive pixels, a first plurality of color filters, a plurality of reflective sidewalls, and a second plurality of color filters. The light sensitive pixels are formed on said substrate. The first plurality of color filters is disposed over a first group of the light sensitive pixels. The reflective sidewalls are formed on each side of each of the first plurality of color filters. The second plurality of color filters are disposed over a second group of light sensitive pixels and each color filter of the second plurality of color filters is separated from each adjacent filter of said first plurality of color filters by one of the reflective sidewalls. In a particular embodiment an etch-resistant layer is disposed over the first plurality of color filters and the second group of light sensitive pixels.Type: ApplicationFiled: September 26, 2016Publication date: March 29, 2018Applicant: OmniVision Technologies, Inc.Inventors: Xin Wang, Dajiang Yang, Qin Wang, Duli Mao, Dyson Hsin-Chih Tai
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Patent number: 9930229Abstract: An EMI shield for a camera module subassembly includes a first conductive portion covering an optical unit and a top surface of a circuit substrate of the camera module subassembly and a second conductive portion covering a bottom surface of the circuit substrate, such that the two portions are in contact. The EMI shield can also include an extension to cover a flexible circuit substrate and its connector, as well as can include an EMI attenuator over an aperture formed in the first conductive portion above the optical unit. The EMI shield of the invention provides improved EMI shielding and EM compatibility at the camera module packaging level, especially for frequencies in the megahertz and gigahertz range, by shielding substantially all of the camera module subassembly.Type: GrantFiled: July 14, 2016Date of Patent: March 27, 2018Assignee: OmniVision Technologies, Inc.Inventors: Qianyi Zhao, Heng Fan
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Patent number: 9927619Abstract: Embodiments of the present disclosure related to a head mounted display (HMD) that enable adjustment of lenses for a particular consumer. In some example embodiments, the HMD enables up to three-degrees of freedom of lens alignment with a consumer's pupils. For example, the HMD includes an actuation device or rotatable disc, both of which are in slidable engagement with at least one elongated members. Ends of the elongated members are coupled to a mirror/lens such that actuation of the actuation device or rotation of the disc translates the elongated member along an axis, which is in general alignment with a pupillary distance (PD) of the consumer. Additionally, the elongated members include mirror/lens interfaces to which the lenses are coupled. The mirror/lens interfaces are slidably and rotatably coupled to the elongated members thereby providing additional degrees of freedom for movement of the lenses.Type: GrantFiled: November 6, 2015Date of Patent: March 27, 2018Assignee: OmniVision Technologies, Inc.Inventor: Yen-Sung Wang
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Publication number: 20180082937Abstract: A microchip includes a passivation layer formed over underlying circuitry, a redistribution layer formed over the passivation layer, and a cap layer formed over the redistribution conductors of the redistribution layer and in contact with the passivation layer. The passivation layer and the cap layer have one or more compatibilities that provide sufficient adhesion between those two layers to prevent metal migration from the conductors of the redistribution layer between the interfaces of the passivation and cap layers. In one embodiment, the passivation and cap layers are each formed from an inorganic oxide (e.g., SiO2) using a process (e.g., PECVD) that provides substantially-uniform step coverage by the cap layer in trench and via regions of underlying circuitry. The invention increases the reliability of the microchip, because it eliminates metal migration, and the electrical shorting caused therefrom, in the redistribution layer.Type: ApplicationFiled: September 16, 2016Publication date: March 22, 2018Applicant: OmniVision Technologies, Inc.Inventors: Chi-Kuei Lee, Ying Chung, Ying-Chih Kuo, Wei-Feng Lin
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Patent number: 9921442Abstract: A novel method of forming an alignment layer of a liquid crystal display device includes the steps of providing a substrate (e.g., a processed silicon wafer, etc.) having an alignment layer material deposited thereon and applying a series of pulses from a pulse laser to anneal portions of the alignment layer material and alter its surface morphology. The method can include the step of depositing the alignment layer material (e.g., a spin-on dielectric including SiO2) over the substrate using a spin-on process prior to laser annealing. Applying the series of laser pulses creates a repetitive pattern of features that facilitate alignment of liquid crystals according to a laser scan trace. Liquid crystal display devices with laser-annealed alignment layer(s) are also disclosed. The alignment layers of the invention are quickly and inexpensively applied and are very robust under prolonged, high-intensity light stress.Type: GrantFiled: January 14, 2016Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Yin Qian, Dyson Hsin-Chih Tai, Ming Zhang, Chia-Chun Miao
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Patent number: 9924142Abstract: A method for processing a plurality of images of a scene recorded from different vantage points, where the plurality of images includes a color reference image captured by a Bayer type camera and at least one additional image, the method including (a) registering at least a portion of the plurality of images, and (b) generating a unitary color image from the plurality of images, wherein color information of the unitary color image is determined exclusively from the color reference image.Type: GrantFiled: November 21, 2013Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Yongshen Ni, Guansong Liu
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Patent number: 9922922Abstract: A microchip includes a passivation layer formed over underlying circuitry, a redistribution layer formed over the passivation layer, and a cap layer formed over the redistribution conductors of the redistribution layer and in contact with the passivation layer. The passivation layer and the cap layer have one or more compatibilities that provide sufficient adhesion between those two layers to prevent metal migration from the conductors of the redistribution layer between the interfaces of the passivation and cap layers. In one embodiment, the passivation and cap layers are each formed from an inorganic oxide (e.g., SiO2) using a process (e.g., PECVD) that provides substantially-uniform step coverage by the cap layer in trench and via regions of underlying circuitry. The invention increases the reliability of the microchip, because it eliminates metal migration, and the electrical shorting caused therefrom, in the redistribution layer.Type: GrantFiled: September 16, 2016Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Chi-Kuei Lee, Ying Chung, Ying-Chih Kuo, Wei-Feng Lin
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Patent number: 9923008Abstract: A wafer-level array camera includes (i) an image sensor wafer including an image sensor array, (ii) a spacer disposed on the image sensor wafer, and (iii) a lens wafer disposed on the spacer, wherein the lens wafer includes a lens array. A method for fabricating a plurality of wafer-level array cameras includes (i) disposing a lens wafer, including a plurality of lens arrays, on an image sensor wafer, including a plurality of image sensor arrays, to form a composite wafer and (ii) dicing the composite wafer to form the plurality of wafer-level array cameras, wherein each of the plurality of wafer-level array cameras includes a respective one of the plurality of lens arrays and a respective one of the plurality of image sensor arrays.Type: GrantFiled: April 9, 2014Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Raymond Wu, Robbert Emery
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Patent number: 9921393Abstract: A wafer-level lens forming method for forming an aperture wafer wherein the aperture wafer is stacked with one or more lens wafers to form apertured lens systems. The aperture wafer is formed by lithographically depositing an opaque layer on a transparent film, which is supported by a substrate. The aperture wafer is stacked with one or more lens wafers, and appropriate spacing between the wafers is set with spacer wafers. The substrate is removed, and the lens and aperture wafers are adhered together in a stack to form an optical system. The method avoids accumulation of residual material on the lens during the opaque-layer deposition process. The resulting optical system benefits from added flexibility of the lens system design due to the ability to locate the aperture with respect to one or more lenses independently of the lens wafers.Type: GrantFiled: September 4, 2014Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Min Ching Kao, Chia-Yang Chang
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Patent number: 9923024Abstract: An imaging sensor pixel comprises a highly resistive N? doped semiconductor layer with a front side and a back side. At the front side, there are at least a light sensing region, a transfer gate adjacent to the light sensing region and a P-well region. The P-well region surrounds the light sensing region and the transfer gate region, and comprises at least a floating diffusion region and a first electrode outside of the floating diffusion region, wherein a first negative voltage is applied to the first electrode. The transfer gate couples between the light sensing region and the floating diffusion region. At the back side, there is a back side P+ doped layer comprising a second electrode formed on the back side P+ doped layer, wherein a second negative voltage is applied to the second electrode. The second negative voltage is more negative than the first negative voltage.Type: GrantFiled: May 26, 2017Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Keiji Mabuchi, Sohei Manabe, Duli Mao
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Patent number: 9923009Abstract: An image sensor includes a plurality of photodiodes disposed in a semiconductor material between a first side and a second side of the semiconductor material. The image sensor also includes a plurality of hybrid deep trench isolation (DTI) structures disposed in the semiconductor material, where individual photodiodes in the plurality of photodiodes are separated by individual hybrid DTI structures. The individual hybrid DTI structures include a shallow portion that extends from the first side towards the second side of the semiconductor material, and the shallow portion includes a dielectric region and a metal region such that at least part of the dielectric region is disposed between the semiconductor material and the metal region. The hybrid DTI structures also include a deep portion that extends from the shallow portion and is disposed between the shallow portion and the second side of the semiconductor material.Type: GrantFiled: November 3, 2016Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Chih-Wei Hsiung, Duli Mao, Vincent Venezia, Gang Chen, Dyson H. Tai
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Patent number: 9919455Abstract: Suspended lenses in a spacer wafer and lens-in-a-pocket structures are replicated from UV-transparent molds. The fabrication of UV-transparent molds can include providing a substrate with pedestals, fabricating a lens on each pedestal using a step-and-repeat process, replicating an intermediate mold from the substrate with pedestals having lenses on the pedestals, and replicating a UV-transparent mold from the intermediate mold. The fabrication of UV-transparent molds can also include providing a substrate with holes, fabricating a lens in each hole and replicating a UV-transparent mold from the substrate with the holes having the lenses.Type: GrantFiled: August 22, 2012Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Regis Fan, Goran Rauker, George Barnes