Abstract: A package structure is provided. The package structure includes a substrate, a first electronic component, a first electrical connector, and a protective layer. The first electronic component is over the substrate. The first electrical connector is between the substrate and the first electronic component. The protective layer encapsulates the first electrical connector. The protective layer has a first curved lateral surface concave toward the first electrical connector and recessed with respect to a lateral surface of the first electronic component.

Abstract: An e-book reader in which destruction of a driver circuit at the time when a flexible panel is handled is inhibited. In addition, an e-book reader having a simplified structure. A plurality of flexible display panels each including a display portion in which display control is performed by a scan line driver circuit and a signal line driver circuit, and a binding portion fastening the plurality of display panels together are included. The signal line driver circuit is provided inside the binding portion, and the scan line driver circuit is provided at the edge of the display panel in a direction perpendicular to the binding portion.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a well, a plurality of channel sheets, a source/drain region, a contact, a gate electrode, a gate dielectric layer and a spacer. The gate electrode includes at least one inner gate electrode and a top gate electrode. The inner gate electrode is located between the plurality of channel sheets. The top gate electrode is located upon a top of the plurality of channel sheets. The top gate electrode includes a first stage top gate and a second stage top gate. The first stage top gate is stacked on the second stage top gate, and a first gate length of the first stage top gate is less than a second gate length of the second stage top gate. The gate dielectric layer surrounds the gate electrode. The spacer includes at least one inner spacer and a top spacer.

Abstract: A semiconductor device includes anti-fuse cells. The anti-fuse cells include a first active area, a first gate, a second gate, at least one first gate via, and at least one second gate via. The first gate and the second gate are separate from each other. The first gate and the second gate extend to cross over the first active area. The at least one first gate via is coupled to the first gate and disposed directly above the first active area. The at least one second gate via is coupled to the second gate. The first gate is coupled through the at least one first gate via to a first word line for receiving a first programming voltage, and the second gate is coupled through the at least one second gate via to a second word line for receiving a first reading voltage.

Abstract: An imaging element according to an embodiment of the present disclosure includes: a first substrate, a second substrate, and a third substrate that are stacked in this order. The first substrate including a sensor pixel that performs photoelectric conversion and the second substrate including a readout circuit are electrically coupled to each other by a first through wiring line provided in an interlayer insulating film. The second substrate and the third substrate including a logic circuit are electrically coupled to each other by a junction between pad electrodes or a second through wiring line penetrating through a semiconductor substrate.

Abstract: An overlay error measurement method includes disposing a lower-layer pattern over a substrate that includes disposing a first pattern having a first plurality of first sub-patterns extending in a first interval along a first direction and being arranged with a first pitch in a second direction crossing the first direction. The method includes disposing a second pattern having a second plurality of second sub-patterns extending in a second interval along the first direction and being arranged with a second pitch, smaller than the first pitch, in the second direction crossing the first direction. The second sub-patterns are disposed interleaved between the first sub-patterns. The method includes disposing an upper-layer pattern including a third pattern having the first pitch and at least partially overlapping with the lower-layer pattern over the lower-layer pattern and determining an overlay error between the lower-layer pattern and the upper-layer pattern.

Abstract: [Object] Provided is a novel and improved technology capable of distinguishing the treatment of a predetermined object recognized from image data depending on the situation. [Solving Means] Provided is an information processing apparatus including an image recognition unit configured to recognize an object from image data, a motion detection unit configured to detect motion in sensing data acquired by a sensor, and an object detection unit configured to detect an object recognized as a predetermined object by the image recognition unit and corresponding to a region in which motion has been detected by the motion detection unit.

Abstract: A duty cycle detector includes a current steering network configured to steer a first current into a second current to charge a first capacitor when a clock is in a first state, and to steer the first current into a third current to charge a second capacitor when the clock is in a second state; a first charge sharing switch configured to enable charge sharing between the first capacitor and a third capacitor when the clock is in the second state; a second charge sharing switch configured to enable charge sharing between the second capacitor and a fourth capacitor when the clock is in the first state; a first discharging network configured to discharge the first capacitor when the clock is in a first state; and a second discharging network configured to discharge the second capacitor when the clock is in a second state.

Abstract: An image processing method includes following operations: generating, by a processor, a sliding window for a target pixel in a plurality of pixels in image data; generating, by the processor, an original brightness histogram of the sliding window according to an original bit depth; generating, by the processor, a low-bit-depth brightness histogram of the sliding window according to a low bit depth; determining, by the processor, a target low-bit-depth range from the low-bit-depth brightness histogram according to the target pixel; extracting, by the processor, a partial original brightness histogram from the original brightness histogram according to the target low-bit-depth range; and performing, by the processor, a histogram equalization process on the partial original brightness histogram according to the original bit depth to generate a final brightness value of the target pixel.

Abstract: A die-to-die communication system and an operation method thereof are provided. The die-to-die communication system includes a transmitting device disposed at a first die and a receiving device disposed at a second die, wherein the first die and second die are disposed in a same integrated circuit package. The receiving device is coupled to the transmitting device via a communication interface. The transmitting device transmits a data unit stream to a data channel in the communication interface. The receiving device receives the data unit stream from the data channel in the communication interface. The receiving device returns transmission management information to the transmitting device via a feedback channel different from the data channel in the communication interface. In various embodiments, the transmission management information includes flow control information and/or error replay information.

Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit that is formed by stacking two or more integrated circuit (IC) dies to at least partially overlap and to share one or more interconnect layers that distribute power, clock and/or data-bus signals. The shared interconnect layers include interconnect segments that carry power, clock and/or data-bus signals. In some embodiments, the shared interconnect layers are higher level interconnect layers (e.g., the top interconnect layer of each IC die). In some embodiments, the stacked IC dies of the 3D circuit include first and second IC dies. The first die includes a first semiconductor substrate and a first set of interconnect layers defined above the first semiconductor substrate. Similarly, the second IC die includes a second semiconductor substrate and a second set of interconnect layers defined above the second semiconductor substrate.

Abstract: A method of exposing a wafer to a high-tilt angle ion beam and an apparatus for performing the same are disclosed. In an embodiment, a method includes forming a patterned mask layer over a wafer, the patterned mask layer including a patterned mask feature; exposing the wafer to an ion beam, a surface of the wafer being tilted at a tilt angle with respect to the ion beam; and moving the wafer along a scan line with respect to the ion beam, a scan angle being defined between the scan line and an axis perpendicular to an axis of the ion beam, a difference between the tilt angle and the scan angle being less than 50°.

Abstract: An imaging device with low power consumption is provided. A pixel includes a first circuit and a second circuit. The first circuit can generate imaging data and retain difference data that is a difference between the imaging data and data obtained in an initial frame. The second circuit includes a circuit that compares the difference data and a voltage range set arbitrarily. The second circuit supplies a reading signal based on the comparison result. With the use of the structure, reading from the pixel is not performed when it is determined that the difference data is within the set voltage range and reading from the pixel can be performed when it is determined that the difference data is outside the voltage range.

Abstract: An image sensor device is disclosed. The image sensor device includes a substrate having a plurality of pixel regions. The image sensor device also includes a first photodiode in a first pixel region, a source follower transistor coupled to the first photodiode, and a select transistor coupled to the source follower transistor. One of the source follower transistor and the select transistor is in a second pixel region that is different from the first pixel region. While the source follower and the select transistor can be allocated to different cells, either the source follower or the select transistor or both can be further allocated or split into different cells.

Abstract: An artificial intelligence (AI) accelerator device may include a plurality of on-chip mini buffers that are associated with a processing element (PE) array. Each mini buffer is associated with a subset of rows or a subset of columns of the PE array. Partitioning an on-chip buffer of the AI accelerator device into the mini buffers described herein may reduce the size and complexity of the on-chip buffer. The reduced size of the on-chip buffer may reduce the wire routing complexity of the on-chip buffer, which may reduce latency and may reduce access energy for the AI accelerator device. This may increase the operating efficiency and/or may increase the performance of the AI accelerator device. Moreover, the mini buffers may increase the overall bandwidth that is available for the mini buffers to transfer data to and from the PE array.

Abstract: Various embodiments of the present technology may provide methods and systems for position stabilization. The methods and systems for position stabilization may be integrated within an electronic device. An exemplary system may include a driver circuit responsive to a gyro sensor and a feedback signal from an actuator. The driver circuit may be configured to calibrate a gain applied to a drive signal based on the posture of the electronic device.

Abstract: A method of manufacturing a semiconductor structure includes providing a mask including a first substrate; a first mask layer disposed over the first substrate, including a plurality of first recesses extended through the first mask layer; a second mask layer disposed over the first mask layer and including a plurality of second recesses extended through the second mask layer; providing a second substrate including a photoresist disposed over the second substrate; and projecting a predetermined electromagnetic radiation through the mask towards the photoresist, wherein the first mask layer is at least partially transparent to the predetermined electromagnetic radiation, the second mask layer is opaque to the predetermined electromagnetic radiation, and at least a portion of the second mask layer is disposed between two of the plurality of second recesses.

Abstract: The present invention provides a radio frequency module including: an interposer; a plurality of antenna element groups that include first electrodes and a second electrode and are configured such that the first electrodes are aligned in line shapes in at least a first direction on a first surface of the interposer; and meta material portions that are provided at the interposer and affect electromagnetic properties of the plurality of antenna elements. The meta material portions include electromagnetic band gap structures provided by forming predetermined geometric patterns near both sides of the first electrodes along at least the first direction. The radio frequency module can thus have a reduced size and a broad band/a high gain.

Abstract: A group-III-nitride structure and a manufacturing method thereof are provided. In the manufacturing method, one or more grooves are formed by etching a first group-III-nitride epitaxial layer with a patterned first mask layer as a mask; then a second mask layer is formed at least on one or more bottom walls of the one or more grooves, and a first epitaxial growth is performed on the first group-III-nitride epitaxial layer to laterally grow and form a second group-III-nitride epitaxial layer with the second mask layer as a mask, where the one or more grooves are filled with the second group III-nitride epitaxial layer; a second epitaxial growth is then performed on the second group-III-nitride epitaxial layer to grow and form a third group-III-nitride epitaxial layer on the second group-III-nitride epitaxial layer and the patterned first mask layer.

Abstract: An imaging device may include an image sensor that generates frames of image data in response to incident light with an array of image pixels, and processing circuitry that processes the image data. The processing circuitry may include a transformation circuit that applies transforms to subsampled frames of image data that are generated using a subset of the image pixels to produce transform values, and a comparator circuit that compares the transform values. The processing circuitry may determine that motion has occurred between sequential frames if a difference between a first transform value corresponding to a first image frame and a second transform value corresponding to a second image frame exceeds a threshold value. In response to determining that motion has occurred, the image sensor may generate full-frame image data using all of the pixels of the array of image pixels.