Abstract: A control scheme for a dimmable lighting driver is provided. The control scheme may operate with a phase cut type dimmer (leading or trailing edge). In an embodiment, the control scheme is programmed or otherwise configured into a controller as a control algorithm. The control algorithm is configured to measure phase cut and zero crossing angles of the input mains waveform, and to subsequently maintain constant LED current commensurate with a user-set dimming level, with no flicker. The control algorithm may be implemented in software, such as a firmware-based routine executable by one or more controllers of a given driver. The one or more controllers may be, for example, an existing general purpose controller of the given driver, or a dedicated dimming controller. Numerous configurations will be apparent in light of this disclosure.

Abstract: A method and a device for inspecting an optoelectronic component are disclosed. In an embodiment, the method includes exciting at least one electromagnetic resonant circuit, formed by the at least one optoelectronic component and the connection board, such that the at least one optoelectronic component emits electromagnetic radiation, wherein exciting the electromagnetic resonant circuit comprises applying an electrical alternating voltage in the electromagnetic resonant circuit by generating a temporally variable electromagnetic alternating field by a first coil and a second coil, wherein the first coil and the second coil are movable with respect to the connection board.

Abstract: A device for converting the wavelength of electromagnetic radiation is disclosed. In an embodiment the device includes a carrier, a conversion layer configured to at least partly convert a wavelength of the electromagnetic radiation and an intermediate layer, wherein the conversion layer is connected to the carrier via the intermediate layer, and wherein the intermediate layer, at least in partial regions, includes a solid layer and a connection layer.

Abstract: There is herein described a light source that homogenizes the light produced by a large area array of forward directed LEDs mounted on highly reflective substrate, while achieving a low-profile form factor and maintaining high efficacy. The LED light source employs a diffuser comprised of two diffusing layers: a low scattering diffusing layer bonded to the LEDs and a high scattering diffusing layer that is bonded to the low scattering diffusing layer. The LED light source achieves good diffuse illumination with a thin diffuser by making use of a light channeling effect between the highly reflective substrate and the high backscattering from the high scattering diffusing layer.

Abstract: An optical element has a first surface and a second surface, wherein a tooth structure having a multiplicity of teeth oriented in a second direction is arranged on the first surface, a stepped lens having a multiplicity of steps oriented in a first direction is arranged on the second surface, and the tooth structure forms a total internal reflection lens.

Abstract: The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.

Abstract: A semiconductor laser includes a main body, a strip having a narrower width provided on the main body, and an active zone that generates light radiation, wherein surfaces of the main body laterally with respect to the strip and side surfaces of the strip are covered with an electrically insulating protective layer, an electrically conductive layer as a contact is provided on a top side of the strip, a cavity is provided between a side surface of the strip and the protective layer at least in a delimited section.

Abstract: A method for producing an optoelectronic semiconductor chip is disclosed. In an embodiment, the method includes providing a semiconductor body with a pixel region including different subpixel regions, each subpixel region having a radiation exit face, applying an electrically conductive layer onto the radiation exit face of a subpixel region, wherein the electrically conductive layer is suitable at least in part for forming a salt with a protic reactant, and depositing a conversion layer on the electrically conductive layer using an electrophoresis process, wherein the deposited conversion layer comprises pores.

Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization, the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, the wavelength-converting material extending as far as the second top side metallization.

Abstract: An optoelectronic component includes a housing that includes a rectangular basic shape with four sides. The sides each merge into one another at a corner point. At least two carrier arms of two contact elements of a lead frame are guided to an edge of the housing. The two carrier arms are arranged on different sides of the housing. The two carrier arms are each at different spacings from the two corner points of the side on which the carrier arms are arranged. The spacings differ at least in the width of a carrier arm.

Abstract: An electronic component, an optoelectronic component, a component arrangement, and a method for producing an electronic component are disclosed. In an embodiment, the method includes forming a sacrificial structure on a top side of a carrier by a photolithographic process from a photoresist layer, arranging an electronic semiconductor chip on the carrier after exposing the photoresist layer, molding a molded body around the sacrificial structure and around the electronic semiconductor chip such that a surface of the electronic semiconductor chip is at least partly not covered by the molded body, detaching the molded body from the carrier and removing the sacrificial structure, wherein removing the sacrificial structure results in a cutout being formed in the molded body.

Abstract: A bin insert for binning of light emitting devices comprises a hollow structural section (1). The hollow structural section (1) further comprises a top opening (13) and a bottom opening (14) at a top and a bottom end (11, 12) of the hollow structural section (1), respectively. A wall (15) extends along a main axis (10) between the top opening (13) and the bottom opening (14). Parallel segments (16) in the wall extend parallel with respect to the main axis (10). Inclined segments (17) in the wall (15) extend under a tilted angle and towards the main axis (10). The parallel segments (16) and the inclined segments (17) are arranged such as to confine an angulated falling path in the hollow structural section (1).

Abstract: The Power Supply Unit comprises an output providing electrical power between a positive power supply line and a common ground line and a communication line. An adjustable current generator responsive to an internal measurement signal generates an output current at the output, and a voltage source is coupled to the communication line. A current measurement unit measures a current through the communication line and generates the internal measurement signal depending on the measured current through the communication line. Specifically, the Power Supply Unit is configured to determine the voltage drop on the common ground line by applying via the voltage source two different voltages to the communication line.

Abstract: Described herein are ambient lighting devices, methods, and systems that utilize at least one multimode artificial ambient light source, a control unit, and a remote image sensor. The control unit couples to at least one artificial ambient light source and is configured to output at least one control signal to the at least one artificial ambient light source. The at least one multimode artificial ambient light source is configured to output light of varying color and color temperature in response to said at least one control signal. The remote image sensor couples to the at least one control unit and is configured to detect at least one color and intensity characteristic and output an output signal to the at least one control unit, based on said color and intensity characteristic detected.

Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

Abstract: Techniques are disclosed for designing light fixtures for flexible LED circuit boards. The flexible LED circuit boards include an array of LED packages and the surface of the flexible circuit boards is highly reflective. A flexible LED circuit board may be shaped to conform to a rigid preform and the preform may be concave, convex, corrugated, or have any other custom shape. The shape of the preform, as well as the location of the LEDs within the flexible LED circuit may determine the light distribution of the light fixture. Alternatively, the lighting fixture may have multiple rods held in place with side plates and a flexible LED circuit board may be woven between the rods. A set of hole patterns in the side plates determine the location of the rods and the rods will determine the shape of the flexible LED circuit.

Abstract: Techniques are disclosed for providing proper raster line alignment of a camera or other light-sensing device of a receiver device relative to a transmitting light-based communication (LCom)-enabled luminaire to establish reliable LCom there between. In accordance with some embodiments, proper alignment can be provided automatically (e.g., by the receiver device and/or other suitable controller). In accordance with some embodiments, proper alignment can be provided by the user. In some instances in which a user is to be involved in the alignment process, the receiver device may be configured, for example, to instruct or otherwise guide the user in the process of properly aligning the receiver device relative to a given transmitting LCom-enabled luminaire.

Abstract: A method for producing an organic light-emitting diode and an organic light-emitting diode are disclosed. In an embodiment, the method includes providing a substrate with a continuous application surface, generating multiple adhesion regions on the application surface, the adhesion regions being completely surrounded by the application surface, applying metal nanowires over the entire surface of the application surface, removing the metal nanowires outside of the adhesion regions by a washing process using a solvent such that the remaining metal nanowires completely or partly form a light-permeable electrode of the organic light-emitting diode, and applying an organic layer sequence onto the light-permeable electrode.

Abstract: According to the present disclosure, a method for producing a plurality of semiconductor chips is provided with the following steps: a) providing a composite assembly, including a carrier, a semiconductor layer sequence and a functional layer; b) severing the functional layer by means of coherent radiation along a singulation pattern; c) forming separating trenches in the carrier along the singulation pattern; and d) applying a protective layer, which delimits the functional layer toward the separating trenches, on in each case at least one side surface of the semiconductor chips to be singulated. The singulated semiconductor chips each includes a part of the semiconductor layer sequence, of the carrier and of the functional layer.

Abstract: A solid state light source driver circuit that operates in either a buck convertor or a boost convertor configuration is provided. The driver circuit includes a controller, a boost switch circuit and a buck switch circuit, each coupled to the controller, and a feedback circuit, coupled to the light source. The feedback circuit provides feedback to the controller, representing a DC output of the driver circuit. The controller controls the boost switch circuit and the buck switch circuit in response to the feedback signal, to regulate current to the light source. The controller places the driver circuit in its boost converter configuration when the DC output is less than a rectified AC voltage coupled to the driver circuit at an input node. The controller places the driver circuit in its buck converter configuration when the DC output is greater than the rectified AC voltage at the input node.