Abstract: In various embodiments, a light-emitting diode arrangement is provided. The light-emitting diode arrangement includes a first substrate with a first light-emitting diode which is arranged on the first substrate such that light emitted by it radiates in a main emission direction of the light-emitting diode arrangement, and a second substrate with a second light-emitting diode which is arranged on the second substrate such that light emitted by it radiates in the main emission direction of the light-emitting diode arrangement. The second substrate is arranged above the first substrate, such that the second substrate at least partly covers the first substrate.

Abstract: An electrode arrangement for a discharge lamp is provided, including an electrode unit including an electrode and an electrode plate, and a conductive connection unit for coupling to an energy source. The connection unit includes a connection unit plate. The arrangement includes a cylinder composed of a nonconductive material, said cylinder arranged between the electrode plate and the connection unit plate, and at least one conduction film which is arranged on an outer side of the cylinder and extends from the connection unit plate as far as the electrode plate and connects the connection unit plate and the electrode plate to one another. The arrangement includes a cap-shaped and integrally embodied protective film arranged on the electrode plate or connection unit plate, such that the film covers a plate side facing away from the cylinder and an outer lateral surface of the electrode plate or of the connection unit plate.

Abstract: A power supply circuit may include at least a first and a second current generator. Each current generator is implemented with an electronic converter comprising a switching stage, a current sensor generating a feedback signal, and a regulator circuit configured to drive the switching stage as a function of the feedback signal. Specifically, each current sensor is a low-side current sensor configured to generate a feedback signal indicative of the current received via the negative terminal of the respective current generator. The power supply circuit may include also include a control circuit configured for various tasks pertaining to the first and second generators.

Abstract: A method of manufacturing an optoelectronic component includes: A) providing a substrate, B) providing a metallic liquid arranged in a structured manner and in direct mechanical contact on the substrate and including at least one first metal, C) providing semiconductor chips each having a metallic termination layer on their rear side, the metallic termination layer including at least one second metal different from the first metal, and D) self-organized arranging the semiconductor chips on the metallic liquid so that the first metal and the second metal form at least one intermetallic compound having a higher re-melting temperature than the melting temperature of the metallic liquid, wherein the intermetallic compound is a connecting layer between the substrate and the semiconductor chips.

Abstract: A method of producing a plurality of laser diodes includes providing a plurality of laser bars in a composite, wherein the laser bars each include a plurality of laser diode elements arranged side by side, and the laser diode elements include a common substrate and a semiconductor layer sequence arranged on the substrate, and a division of the composite at a longitudinal separation plane extending between two adjacent laser bars leads to formation of laser facets of the laser diodes to be produced, and structuring the composite at at least one longitudinal separation plane, wherein a structured region is produced in the substrate.

Abstract: A laser diode includes a semiconductor body having a substrate and a semiconductor layer sequence arranged on the substrate, which includes an active zone that generates electromagnetic radiation, wherein the semiconductor body has a first main surface and a second main surface opposite the first main surface and at least one first and second laser facet, which are respectively arranged transversely to the first and second main surfaces, and at least one structured facet region located at a transition between the first main surface and at least one of the first and second laser facets, and the structured facet region includes at least a strained compensation layer or a recess.

Abstract: A semiconductor chip includes an electrically insulating layer including a first opening and a second opening, an electrically conductive first connection point, and an electrically conductive second connection point, wherein a carrier mechanically connects to a semiconductor body, the active region electrically connects to a first conductor body and a second conductor body, the electrically insulating layer covers the carrier on a side thereof facing away from the semiconductor body, the first connection point electrically connects to the first conductor body through the first opening, the second connection point electrically connects to the second conductor body through the second opening, the first conductor body is at a first distance from a second conductor body, the first connection point is at a second distance from the second connection point, and the first distance is less than the second distance.

Abstract: A method for transferring semiconductor bodies and a semiconductor chip are disclosed.

Abstract: A headlight includes a first LED cluster having a plurality of first LEDs arranged next to one another on a common first substrate, a second LED cluster having a plurality of second LEDs arranged next to one another on a common second substrate, and an output coupling optical unit having a plurality of optical elements, of which an optical element which comes first in a beam path of the LED clusters has, a light incidence surface which is common to the LED clusters. The LED clusters have a lateral distance from one another which is at least as great as an extent of the LED clusters in the same direction. The common light incidence surface has a locally delimited light incidence region directly in front of an associated LED cluster. The locally delimited light incidence region deviates from the basic shape of the light incidence surface.

Abstract: A method for setting up a lighting system comprising at least two luminaires, which are part of a network and each having a unique network address, wherein each luminaire has at least one sensor and one actuator, characterized by the steps of measuring the relative distance between respectively two luminaires by reading at least one sensor of the luminaire while simultaneously activating at least one actuator of the other luminaire, producing at least one data record, wherein each data record contains the network address of both luminaires and the relative distance of the luminaires from one another, and merging the data records to form a geo-localized network list and comparing the network list to a floorplan underlying the lighting system to determine the physical location of each luminaire.

Abstract: A semiconductor laser diode includes a semiconductor layer sequence with an active layer having a main extension plane and that generates light in an active region and emits light via a light outcoupling surface during operation, wherein the active region extends from a rear surface opposite the light outcoupling surface to the light outcoupling surface along a longitudinal direction, the semiconductor layer sequence includes a trench structure having at least one trench or a plurality of trenches on at least one side laterally next to the active region, and each trench of the trench structure extends in a longitudinal direction and projects from a top side of the semiconductor layer sequence in a vertical direction into the semiconductor layer sequence, and the trench structure varies in a lateral and/or vertical and/or longitudinal direction with respect to properties of the at least one trench or the plurality of trenches.

Abstract: Various embodiments provide an illumination system. The illumination system includes at least one effect lamp configured to emit radiation, a mobile lamp, which can be arranged on a mobile object and which is configured to emit radiation, and at least one control unit configured to control at least one of the effect lamp or the mobile lamp. The control unit is configured to control the effect lamp as a function of at least one of one or more state information items of the mobile lamp or of the effect lamp or of an object or in such a way that it controls the mobile lamp as a function of one or more state information items of at least one of the mobile lamp or of the effect lamp or of an object.

Abstract: Systems and methods disclosed herein include a light engine circuit board including a flexible substrate having a first interconnect region located at a first end of the flexible substrate and a second interconnect region located at a second end of the flexible substrate, in which the first interconnect region and the second interconnect region each comprise one or more solder strips, and one or more LEDs on the flexible substrate.

Abstract: The invention relates to a lighting device for providing a position identification signal, wherein the lighting device comprises a lighting means. A transmitting unit comprising an antenna element transmits the position identification signal in the form of a directed radio signal having a specifiable emission characteristic during intended operation, wherein the position identification signal comprises a position determination data regarding a position of the transmitting unit and/or of the lighting means. The invention further relates to a lighting system having a plurality of lighting devices. In addition, the invention relates to a method for operating a lighting device having a lighting means and a transmitting unit.

Abstract: A device and a connection carrier are disclosed. In an embodiment a device includes a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients, a semiconductor chip mechanically and electronically connected to the connection carrier and a metal layer arranged between the connection carrier and the frame, wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame, wherein the metal layer is not in electrically conductive connection, and wherein the metal layer projects beyond the frame in a lateral direction.

Abstract: A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.

Abstract: A radiation-emitting semiconductor body includes a semiconductor layer sequence including an active region that generates radiation, an n-conducting semiconductor layer and a p-conducting semiconductor layer, wherein the active region is arranged between the n-conducting semiconductor layer and the p-conducting semiconductor layer and the p-conducting semiconductor layer includes a first doping region with a first dopant and a second doping region with a second dopant different from the first dopant, and the p-conducting semiconductor layer includes a further doping region doped with the first dopant and has a thickness of at most 2 nm.

Abstract: A filament includes a plurality of strings including radiation-emitting semiconductor chips electrically connected in series; and a plurality of contact structures to contact the strings, wherein the contact structures electrically connect to semiconductor chips at ends of the strings such that the strings are electrically drivable via the contact structures, and the filament is configured such that the strings are electrically drivable at least separately from one another via the contact structures.

Abstract: A red-emitting phosphor comprising an Eu2+ doped nitridoaluminate phosphor is provided. The red emitting phosphor comprises an emission maximum in the range of 610 to 640 nm of the electromagnetic spectrum.

Abstract: In various embodiments, an illumination apparatus is provided. The illumination apparatus includes a housing, in which at least one radiation source is fixed. A phosphor that is fastened to the housing is arranged downstream of the radiation source. The phosphor is connected to a crack detector, which is used for crack monitoring of the phosphor. A signal path is provided. The signal path connects the crack detector to an evaluation unit that is fixed to the housing. The signal path is formed by at least two contact pins and a flexible printed circuit board that is connected to the crack detector.