Abstract: An optoelectronic component includes a carrier including a mounting face, wherein at least one optoelectronic semiconductor chip configured to emit electromagnetic radiation is arranged above the mounting face, a molding material is arranged above the mounting face, the optoelectronic semiconductor chips are embedded into the molding material, a cavity is formed in the molding material, the cavity is empty, radiation emission faces of the optoelectronic semiconductor chips are not covered by the molding material, the cavity is accessible through an opening in the molding material, and an opening face of the opening is smaller than a sum of all radiation emission faces of the optoelectronic semiconductor chips.

Abstract: An optoelectronic component is disclosed. In an embodiment, an optoelectronic component includes a semiconductor chip configured to emit primary radiation having a peak wavelength between 420 nm inclusive and 480 nm inclusive and a conversion element including a first converter material configured to partially convert the primary radiation into secondary radiation in a green range of the electromagnetic spectrum and a second converter material configured to partially convert the primary radiation into a secondary radiation in a red region of the electromagnetic spectrum, wherein the second converter material including a first red phosphor of the formula (K,Na)2(Si,Ti)F6:Mn4+ and a second red phosphor of the formula(M?)2-x?Eux?Si2Al2N6 where M?=Sr, Ca, Ba, and/or Mg and 0.001?x??0.2, and wherein the optoelectronic device is configured to emit white total radiation.

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes an optical element including silicone as a polymer material, the silicone having repeating units of cyclic siloxane and of linear siloxane which are arranged in alternation, wherein the optoelectronic component is configured to emit radiation.

Abstract: An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment an optoelectronic semiconductor component includes a plurality of active regions configured to emit electromagnetic radiation, wherein the active regions are arranged spaced apart from each other, wherein the active regions have a main extension direction, wherein each active region has a core region, an active layer covering the core region at least in directions transverse to the main extension direction, wherein each active region has a cover layer covering the active layer at least in directions transverse to the main extension direction, wherein each active region has a current spreading layer at least partly covering sidewalls of each respective active region, and wherein a metal layer directly adjoins parts of the active regions and parts of the current spreading layers.

Abstract: The present invention is directed to a wavelength converter comprising: —a phosphor layer and—a filter layer, wherein the filter layer is directly attached to the phosphor layer and wherein the wavelength converter has an overall thickness of between 20 ?m to 80 ?m. Furthermore, the present invention is directed to a light emitting device assembly and methods for preparing a wavelength converter and methods for preparing a light emitting device assembly.

Abstract: A semiconductor chip, a method for producing a semiconductor chip and an apparatus having a plurality of semiconductor chips are disclosed. In an embodiment a chip includes a substrate and a semiconductor layer arranged at the substrate, wherein the substrate includes, at a side facing the semiconductor layer, a top side with a width B1 in a first lateral direction and, at a side opposite to the top side, a bottom side with a width B3 in the first lateral direction, wherein the substrate has a width B2 in the first lateral direction at a half height between the top side and the bottom side, and wherein the following applies to widths B1, B2 and B3: B1?B2<B2?B3, and B1?B2>B3.

Abstract: The presence of a stationary object is to be reliably recognized. Thereto, a presence detection device for detecting a presence of an object in its environment is provided, which comprises a movement detection unit for detecting an initial movement of the object in the environment of the presence detection device and for outputting a movement signal depending on the detection as well as a control unit for generating an activation signal depending on the movement signal. Moreover, the presence detection device comprises a camera, which can be activated by the activation signal, for obtaining a video signal of the environment of the presence detection device and an evaluation unit for generating a presence signal relating to the presence of the object by evaluating the video signal.

Abstract: A method of illuminating a face of a person including recording a first image imaging the face of the person, determining an eye region in the imaged face, and illuminating the face of the person, a first region corresponding to the eye region determined, of the face being illuminated such that dazzling of the eyes of the person can be reduced.

Abstract: A method for producing a component having a semiconductor body includes providing the semiconductor body including a radiation passage surface and a rear side facing away from the radiation passage surface, wherein the semiconductor body comprises on the rear side a connection location for the electrical contacting of the semiconductor body, providing a composite carrier including a carrier layer and a partly cured connecting layer, applying the semiconductor body on the composite carrier, such that the connection location penetrates into the partly cured connecting layer, curing the connecting layer to form a solid composite, applying a molded body material on the composite carrier after curing the connecting layer, wherein the molded body covers side surfaces of the semiconductor body, forming a cutout through the carrier layer and the connecting layer in order to expose the connection location, and filling the cutout with an electrically conductive material.

Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.

Abstract: First adapter (10) and second adapter (40) are each separately securable to a respective automotive light bar (200, 201) at mutually facing lateral light bar end caps (206). The adapters (10, 40) interfit, such as first adapter (10) having one or more tenons (14; 18) received in shape-conforming recess or mortise (44) of second adapter (40). The coupling assembly formed from interfit first and second adapters (10, 40) sufficiently supports a midspan region of conjoined light bars (200, 201) to permit omission of mounting L-brackets (208) conventionally required at the mutually facing light bar ends (206), thus allowing fewer holes to be drilled in vehicle roof or bumper (212) and resulting in an aesthetically cleaner presentation of the overall lengthened light bar assembly.

Abstract: First adapter (10) and second adapter (40) are each separately securable to a respective automotive light bar (200, 201) at mutually facing lateral light bar end caps (206). The adapters (10, 40) interfit, such as first adapter (10) having one or more tenons (14; 18) received in shape-conforming recess or mortise (44) of second adapter (40). The coupling assembly formed from interfit first and second adapters (10, 40) sufficiently supports a midspan region of conjoined light bars (200, 201) to permit omission of mounting L-brackets (208) conventionally required at the mutually facing light bar ends (206), thus allowing fewer holes to be drilled in vehicle roof or bumper (212) and resulting in an aesthetically cleaner presentation of the overall lengthened light bar assembly.

Abstract: A method and system for storing an electronic device, such as an LED 34 component having metallic conductive leads 36, 38 or a light engine 30 having LEDs soldered to a PCB 32, within a container 100 formed of paper material. The container interior surface 14, 16 is coated with a barrier 20 bounding the interior volume 18. Barrier 20 occludes an emission of sulfur-containing gas from the paper material into interior volume 18. Barrier 20 is a polymer, e.g. a thermoplastic material, either in the form of a sheet or a spray or liquid coating, preferably applied to the paper material blank 10 before it is folded into the container shape 100. Barrier 20 may further comprise electro-static discharge material.

Abstract: The disclosure relates to a method for operating a sensor arrangement including a first LIDAR and at least a second LIDAR sensor, wherein the first LIDAR sensor and the second LIDAR sensor(s) each repeatedly carry out measurements, wherein the measurements of the first and the second LIDAR sensors are carried out in respective first and second measuring time windows, at the beginning of which respective measurement beams are emitted by the first and the second LIDAR sensors and a check is made as to whether at least one reflected beam portion of the respective measurement beams is detected within the respective measuring first or second time windows.

Abstract: A lighting system including a set of lighting devices for lighting an environment that may be controlled by a method. The method may include receiving, from one or more image sensors (e.g. a RGB-D camera—W), an image signal including a sequence of images of the environment under different conditions of illumination and light reflection. The method may further include processing the image signal to provide a light source identification signal representative of light sources affecting the environment, and controlling the lighting devices as a function of the light source identification signal, and, possibly, of human occupancy and activity.

Abstract: Techniques and architecture are disclosed for mobile transport systems configured to determine vehicle positions within an area using light-based communication signals. The system includes a plurality of luminaires located in an area and configured to transmit luminaire position data recognizable by a sensor disposed on a vehicle. The sensor receives an image of a luminaire including a light-based communication signal encoded with luminaire position data. Luminaire position data can be combined with luminaire layout information to determine a known location of the luminaire. A vehicle position relative to the known luminaire location can be determined based on mathematical relationships. Vehicle orientation relative to the area can be determined based an asymmetric fiducial pattern or multiple known luminaire locations. The system can combine a vehicle position relative to a known luminaire location with vehicle orientation relative to the area to determine a vehicle position relative to the area.

Abstract: A method of operating a lighting device with a light-emitting component, in which the light-emitting component includes a plurality of pixels configured to illuminate a plurality of zones in a field of view, the light-emitting component includes a processing device including characterization data of the light-emitting component, and the pixels of the light-emitting component are operated as a function of the characterization data, wherein to determine characterization data prior to intended operation of the lighting device an intensity and/or a color location of the emitted light of a pixel or of each pixel is measured as a function of an operating current.

Abstract: The systems and method disclosed herein include a LCom-enabled luminaire configured to transmit a maintenance trigger encoded in an LCom signal in response to detecting an error or maintenance condition in the LCom-enabled luminaire, receive an access request, transmit maintenance information in response to the access request, and receive correction information to correct the error or maintenance condition. The systems and methods further include a receiver device configured to receive the maintenance trigger, generate the access request based on the maintenance trigger, transmit the access request to the LCom-enabled luminaire, receive maintenance information in response to the access request, and transmit control commands based on the maintenance information.

Abstract: In one embodiment of the invention, the semiconductor laser (1) comprises a semiconductor layer sequence (2). The semiconductor layer sequence (2) contains an n-type region (23), a p-type region (21) and an active zone (22) lying between the two. A laser beam is produced in a resonator path (3). The resonator path (3) is aligned parallel to the active zone (22). In addition, the semiconductor laser (1) contains an electrical p-contact (41) and an electrical n-contact (43) each of which is located on the associated region (21, 23) of the semiconductor layer sequence (2) and is configured to input current directly into the associated region (21, 23). The n-contact (43) extends from the p-type region (21) through the active zone (22) and into the n-type region (23) and is located, when viewed from above, next to the resonator path (3).

Abstract: Quantum dot polymer composites for on-chip light emitting diode applications are described. In an example, a composite for on-chip light emitting diode application includes a polymer matrix, a plurality of quantum dots dispersed in the polymer matrix, and a base dispersed in the polymer matrix.