Abstract: A method for optimizing the area coverage of a wireless network may include a lamp to perform this method. The lamp may have an input for connecting a network, a power supply unit for supplying all components of the lamp with an electric power taken from the input, a control unit for controlling the components of the lamp, at least one light source from the power supply unit and controlled by the control unit, and a network access point for providing at least one wireless network. The lamp may include at least one antenna associated with the network access point. The light source and antenna may be arranged and designed such that the radiation characteristics of the light are congruent with the radiation characteristics of the antenna of the wireless network.

Abstract: The invention relates to a method for installing an executable computer program in an illumination system having a plurality of illumination devices which are controlled by means of a particular computer unit and have a lighting device and a transmitting device arranged in or directly on the lighting device, wherein the transmitting device wirelessly emits a signal having an item of identification information specific to the transmitting device, in which: data corresponding to the computer program to be installed are provided by a data source, the data are transmitted to the illumination devices and the computer program is automatically installed in the respective computer units of the illumination devices on the basis of the transmitted data, wherein a first of the illumination devices receives the data via a communication link, and in order to install the computer program in at least one second of the illumination devices, the first of the illumination devices transmits the data to the at least one second o

Abstract: Wavelength converters including coarse particles/grains of a red nitride phosphor are disclosed. In some embodiments the red nitride phosphor is a (Ca,Sr,Ba)2Si5N8:Eu phosphor with a D50 grain size or a D50 particle size that is ?5 microns. The red nitride phosphor may be encapsulated within an organic matrix or present in an inorganic matrix. In the latter case, the inorganic matrix may include fine grains with a D50 grain size <5 microns. Methods of making such wavelength converters and devices including such wavelength converters are also described.

Abstract: In various embodiments, an optical unit for a radiation source matrix is provided. The optical unit may include a plurality of coupling surfaces, which are arranged in at least one line, and at least one decoupling surface. At least one coupling surface, which is arranged at a line end of the line formed by the coupling surfaces arranged in at least one line, is widened when viewed in the direction of the at least one line.

Abstract: A method of producing an optoelectronic element with a light emitting component, includes arranging a sacrificial layer at least above a part of a light emitting side of the component, forming at least in a part of an outer surface of the sacrificial layer an inverted optic structure, covering the outer surface of the sacrificial layer by a light transparent layer, transferring the inverted optic structure to an inner side of the transparent layer, and removing the sacrificial layer and forming a gap between the component and the light transparent layer, wherein the light transparent layer includes at the inner side the optic structure.

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

Abstract: A lens that spreads light from a point light source includes a light entry side having a first Fresnel structure, a light exit side having a second Fresnel structure different from the first Fresnel structure, a section plane located entirely between the first and second Fresnel structures so that the lens is flat, and a central axis as an optical axis perpendicular to the section plane, wherein a height of Fresnel rings of the first Fresnel structure, referred to the section plane, increases in the direction away from the central axis, the Fresnel rings of the first Fresnel structure each have an entry surface facing towards the central axis and a deflecting surface facing away from the central axis, and Fresnel rings of the second Fresnel structure each have a mirror surface facing towards the central axis and an exit surface facing away from the central axis.

Abstract: Optimized routing in localized dense networks is provided. A packet is received at a first network device in a network. An optimal route for the packet to a neighbor network device in the network is determined using a Source Routing Table (SRT), wherein the SRT includes an optimized routing table and a standard routing table, and wherein the optimized routing table comprises a list of neighbor network devices that the first network device can route to directly and wherein the standard routing table comprises a ZigBee source routing table. The packet is routed using the optimal route.

Abstract: A method may include supplying electric power to a first light source and a second light source of at least two light sources by at least one ballast so that the first light source and the second light source emit a first source light and a second source light with a first and second spectral light distribution, respectively. The method further includes superimposing the first and second source light using an optical unit such that the lighting device outputs light with a spectral superposition light distribution. The method further includes detecting the light outputted from the lighting device using a light distribution sensor that provides a sensor signal corresponding to a spectral light distribution of the detected light. The method further includes comparing the sensor signal to a predefined spectral light distribution and adjusting the electric power supplied to the respective light source by the ballast based on the comparison.

Abstract: In an embodiment, a method for producing a plurality of optoelectronic semiconductor components is disclosed, wherein the method includes inserting a plurality of optoelectronic semiconductor chips with a suitable orientation into a linear feeding device, conveying the optoelectronic semiconductor chips to an injection device having an outlet opening, encapsulating the optoelectronic semiconductor chips with at least one cladding layer in the injection device and pressing the encapsulated optoelectronic semiconductor chips out of the outlet opening, wherein a compound of optoelectronic semiconductor chips is formed in which the optoelectronic semiconductor chips are connected to one another by the at least one cladding layer and separating the compound into a plurality of optoelectronic semiconductor components each component having an optoelectronic semiconductor chip which is at least partially encapsulated by the at least one cladding layer.

Abstract: Techniques and architecture are disclosed for mobile transport systems configured to determine vehicle positions within an area using light-based communication signals. The system includes a plurality of luminaires located in an area and configured to transmit luminaire position data recognizable by a sensor disposed on a vehicle. The sensor receives an image of a luminaire including a light-based communication signal encoded with luminaire position data. Luminaire position data can be combined with luminaire layout information to determine a known location of the luminaire. A vehicle position relative to the known luminaire location can be determined based on mathematical relationships. Vehicle orientation relative to the area can be determined based an asymmetric fiducial pattern or multiple known luminaire locations. The system can combine a vehicle position relative to a known luminaire location with vehicle orientation relative to the area to determine a vehicle position relative to the area.

Abstract: A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.

Abstract: A method for producing a plurality of optoelectronic components are disclosed.

Abstract: A method of producing a radiation-emitting semiconductor chip includes providing a growth substrate, epitaxially growing a buffer layer on the growth substrate such that a plurality of V-pits is generated in the buffer layer, epitaxially growing a radiation-generating active semiconductor layer sequence on the buffer layer, wherein the structure of the V-pits continues into the active semiconductor layer sequence, epitaxially growing a further layer sequence on the active semiconductor layer sequence, wherein the structure of the V-pits continues into the further layer sequence, selectively removing the further layer sequence from facets of the V-pits, wherein the further layer sequence remains on a main surface of the active semiconductor layer sequence, and epitaxially growing a p-doped semiconductor layer that completely or partially fills the V-pits.

Abstract: The present invention is directed to a method for preparing a glass device comprising the steps of: —preparing a mixture comprising: —at least two glass components, —a solvent, —at least one binder system, —optionally at least one defoamer, —blending the mixture to form a blend mixture, —grinding the blend mixture to form a grinded mixture, —casting the grinded mixture to form a layer, and —drying the layer to form a dried layer of a glass device. The present invention is further directed to a glass device, a wavelength converter and a light emitting device comprising the glass device and/or the wavelength converter.

Abstract: An electronic converter comprising a switching stage having at least one electronic switch, wherein the switching stage is configured to provide current pulses via a terminal; a first capacitor, wherein the first capacitor provides a first voltage. Specifically, the electronic converter further includes a second capacitor to provide a second voltage, comparison means configured to detect the difference between the first voltage and the second voltage, and determine a comparison signal which indicates whether this difference is greater than a threshold, and switching means configured to selectively transfer the current to the first capacitor or the second capacitor as a function of the comparison signal. The switching means may include a SCR, where the anode of the SCR is connected to the terminal that provides current pulses and where the cathode of the SCR is connected to the second capacitor.

Abstract: A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a light-transmissive substrate having a top surface, a bottom surface opposite the top surface, a first side and a second side surface arranged opposite the first side surface, a semiconductor body arranged on the top surface of the substrate and a contacting including a first current distribution structure and a second current distribution structure, wherein the first current distribution structure and the second current distribution structure are freely accessible from a side of the semiconductor body facing away from the substrate, and wherein the semiconductor chip, on the side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, is free of any connection point configured to electrically contact the first and second current distribution structures.

Abstract: A circuit assembly for operating a load may include an input for inputting an input voltage and/or current. The circuit assembly may further include an output for outputting an output voltage and/or current. The circuit assembly may further include an at least partially digital switching regulator with a feedback loop. A loop gain of the feedback loop may be frequency-dependent where the frequency ranges from 3 Hz to 20 Hz.

Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.