Abstract: In an embodiment a nanostamping method includes forming a nanostructure in a layer of optical embossing material on a first carrier substrate by a forming stamp having a nano-relief, wherein the nanostructure comprises a plurality of nano-elevations which are connected via an embossing material base, generating a coated nanostructure by covering the nano-elevations with a filler material layer, wherein the filler material layer and the optical embossing material comprise different refractive indices, applying a second carrier substrate on the coated nanostructure, detaching the first carrier substrate and removing a material of the embossing material base.

Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.

Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.

Abstract: In an embodiment a lamp includes a lamp body extending in a first direction along a longitudinal axis between a proximal base portion and a light-reflective distal front surface, the distal front surface extending transverse to the longitudinal axis and having an outer edge and a linear array of a plurality of solid-state light sources arranged distally of the distal front surface of the lamp body, the linear array of solid-state light sources extending in a second direction transverse to the longitudinal axis and having a length in the second direction longer than a width across the second direction, wherein the light-reflective distal front surface tapers from the outer edge towards the linear array of solid-state light sources and comprises two opposed surface portions each extending from the outer edge to a linear inner edge line.

Abstract: An optical arrangement for disinfection in apparatuses operating with air or a liquid comprises at least one radiation source or at least one group of radiation sources, which emits or jointly emit radiation in the ultraviolet wavelength range, at least one beam collecting optical unit, which collects the radiation emitted by the radiation source or the group of radiation sources, a number of beam delivering optical units, each configured to receive the radiation collected by the at least one beam collecting optical unit, and also a number of effect zones spatially separated from one another, into which the radiation delivered via the beam delivering optical units is emitted in order to bring about a disinfecting effect.

Abstract: In an embodiment an optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a radiation exit surface and side surfaces running transversely with respect to the radiation exit surface, the optoelectronic semiconductor chip configured to emit primary radiation through the radiation exit surface, a conversion element arranged on the radiation exit surface, the conversion element configured to convert at least part of the primary radiation into secondary radiation and including a stack of at least two conversion layers and a reflective element laterally surrounding the optoelectronic semiconductor chip, wherein a lateral extent of the conversion layers decreases from a layer which is closest to the radiation exit surface to a layer which is most distant from the radiation exit surface, wherein the conversion element includes a part laterally extending beyond the radiation exit surface and being concavely curved, wherein the conversion element is partly arranged on the reflectiv

Abstract: In an embodiment an optoelectronic component includes a carrier, an optoelectronic semiconductor chip and an encapsulation, wherein the semiconductor chip is fixed on a mounting surface of the carrier and is electrically conductively connected with the carrier, wherein the encapsulation is located around the semiconductor chip and covers the mounting surface at least partially, wherein the encapsulation includes a first layer and a second layer, wherein the first layer is arranged between the mounting surface and the second layer, wherein each of the first layer and the second layer is based on a silicone, and wherein the first layer and the second layer are directly adjacent to each other in a region of an interface.

Abstract: Disclosed are various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.

Abstract: The invention relates to a method for producing a multiplicity of vertically emitting semiconductor laser diodes, including providing a growth substrate, epitaxially growing an epitaxial semiconductor layer sequence including an active layer for generating electromagnetic radiation and including a sacrificial layer, wherein the sacrificial layer is disposed between the growth substrate and the active layer, forming trenches in the semiconductor layer sequence, resulting in a multiplicity of semiconductor layer stacks being formed and portions of the sacrificial layer being exposed, applying a carrier onto the epitaxial semiconductor layer sequence, and detaching the growth substrate by electrochemically etching the sacrificial layer, wherein an electrochemical etchant has access to the sacrificial layer through a cut-out in the growth substrate and/or through a cavity in the carrier. The invention also relates to a vertically emitting semiconductor laser diode.

Abstract: An optoelectronic component for a LiDAR module includes a carrier, a laser light source, and a detector element. The laser light source is designed for the generation of coherent electromagnetic radiation of a wavelength L1. The detector element is designed for coherent detection of incoming electromagnetic radiation of the wavelength L1 depending on a local oscillator signal. The laser light source and the detector element are arranged opposite one another on different sides of the carrier such that, during operation, electromagnetic radiation generated from the laser light source is coupled into the detector element via a first main surface through the carrier as the local oscillator signal and is coupled out via a second main surface.

Abstract: The invention relates to an illumination arrangement comprising a light-emitting optoelectronic element and an optical device for beam conversion of electromagnetic radiation generated by the light-emitting optoelectronic element. The light emitting optoelectronic element comprises a plurality of emission areas arranged in matrix form; and each emission region is associated with a main beam direction. At least a portion of the emission areas is arranged such that the centers of the emission areas lie on a curved surface.

Abstract: The invention relates to an optoelectronic semiconductor component, comprising a first semiconductor layer stack, which comprises a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second conductivity type. The optoelectronic semiconductor component additionally has a first contact element and a second contact element. The first semiconductor layer stack and the second semiconductor layer are arranged one above the other. The second semiconductor layer is electrically connected to the second contact element. A part of a first main surface of the first semiconductor layer stack adjoins the first contact element, and a part of the first main surface of the first semiconductor layer stack is structured such that both a plurality of protruding regions as well as connection regions are formed.

Abstract: Disclosed are various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.

Abstract: An optical device includes a display and an optical sensor. The display includes display circuitry. The optical sensor is arranged behind the display. The optical sensor includes an emitter for emitting light through the display and a receiver for receiving light reflected back through the display. An absorption of the display is wavelength dependent and the absorption of the display is 50% at a first wavelength. The emitter is configured to emit light at a second wavelength greater than the first wavelength.

Abstract: The invention relates to a component including a semiconductor body and at least one converter layer, wherein the semiconductor body includes at least one active region having an active zone, the active zone being designed to produce electromagnetic radiation. The semiconductor body has at least one vertical recess. A side wall of the recess is formed by a vertically extending facet of the active region, said facet being a radiation passage surface of the active region. The converter layer covers the recess in a top view or at least partly fills the recess. The invention also relates to a method for producing a component.

Abstract: The invention relates to a method for producing a plurality of surface-emitting semiconductor laser diodes, including the following steps:—providing a growth substrate,—applying a mask layer with a plurality of openings onto the growth substrate, so that regions of the growth substrate are exposed through the openings,—applying a first intermediate layer at least onto the exposed regions of the growth substrate, the first intermediate layer having a quasi two-dimensional material, and—epitaxial growing of an epitaxial semiconductor layer sequence on the first intermediate layer, wherein the epitaxial semiconductor layer sequence has an active layer for generating electromagnetic radiation.

Abstract: Disclosed herein is a cooling device, comprising a cooling plate and a cooling cap, for cooling a heat source, mounted to an outer interface surface of the cooling plate, by means of a cooling fluid. Several spiral-shaped fins are integrated into the cooling plate to form a structure in the shape of a multi-spiral. The fins are arranged next to each other in a mutual distance to form spiral-shaped flow channels for a cooling fluid. An inlet for inflowing the cooling fluid at the center of the multi-spiral fins structure is integrated into the cooling cap. The cooling cap is configured and arranged on the cooling plate so that the inlet is positioned above the center of the multi-spiral fins structure.

Abstract: The invention relates to various driver circuits, controls and arrangements for supplying loads, in particular light-emitting diodes, displays or even video walls.

Abstract: An arrangement or a projection headlight with a modulator, in particular with a DMD, is disclosed. In this case, a projection lens of the arrangement not only images the image content of the modulator in the surrounding area, but also images the surrounding area on the modulator. The modulator can thus guide the imaging of the surrounding area to a camera and reflect light from a light source into the surrounding area.

Abstract: An optoelectronic converter element includes a substrate, which includes a material having a thermal conductivity of greater 25 W/(m*K), openings being formed in the substrate, and a luminophore located in the openings, thereby defining converter regions.