Abstract: A socket for a lamp includes a connection which is prepared for retaining at least one light source, an optical element which is prepared for optical coupling to the light source, and a bearing. The optical element is movably mounted by the bearing for adaptation to a position of a light exit unit of a connectable light source.

Abstract: A fastening device for fastening lighting devices to T-shaped profiles of a false ceiling. The fastening device may include a shaped flat body of electrically insulating material having conductive tracks embedded therein. The conductive tracks may have first ends and second ends that protrude from opposite ends of the flat body. The conductive tracks may be configured for establishing an electrical connection between a lighting device and a power supply source located above the false ceiling.

Abstract: In various embodiments, a backlighting device is provided. The backlighting device may include a plurality of semiconductor light sources arranged in a plane and serving for generating light radiation, and a side wall arranged laterally with respect to the semiconductor light sources, where the side wall is inclined with respect to the plane predefined by the semiconductor light sources, and wherein the side wall is retroreflective at a side which can be irradiated with light radiation of the semiconductor light sources.

Abstract: An optoelectronic semiconductor chip (10) is specified, comprising a p-type semiconductor region (4), an n-type semiconductor region (6), and an active layer arranged between the p-type semiconductor region (4) and the n-type semiconductor region (6), said active layer being designed as a multiple quantum well structure (5), wherein the multiple quantum well structure (5) comprises quantum well layers (53) and barrier layers (51), wherein the barrier layers (51) are doped, and wherein undoped intermediate layers (52, 54) are arranged between the quantum well layers (53) and the barrier layers (51). Furthermore, a method for producing the optoelectronic semiconductor chip (10) is specified.

Abstract: The invention relates to a method for structuring a nitride layer (2), comprising the following steps: A) providing a nitride layer (2) formed with silicon nitride of a first type, B) defining regions (40) of said nitride layer (2) to be transformed, and C) inserting the nitride layer (2) into a transformation chamber for the duration of a transformation period, said transformation period being selected such that—at least 80% of the nitride layer (2) regions (40) to be transformed are transformed into oxide regions (41) formed with silicon oxide, and—remaining nitride layer (2) regions (21) remain at least 80% untransformed.

Abstract: An optoelectronic semiconductor component has a semiconductor body, wherein the semiconductor body includes a semiconductor layer sequence having a first semiconductor layer, a second semiconductor layer and an active region that generates or receives radiation disposed between the first semiconductor layer and the second semiconductor layer; the semiconductor body has a functional region in which the first semiconductor layer electrically conductively connects to a first terminal layer and the second semiconductor layer electrically conductively connects to a second terminal layer; an isolating layer is arranged on a side of the first terminal layer facing away from the semiconductor body; an interruption is formed in the isolating layer which at least locally delimits an inner subregion of the isolating layer in a lateral direction; the interruption encloses the functional region in the lateral direction; and in a plan view of the semiconductor component, the interruption overlaps with the active region.

Abstract: Techniques and user interfaces (UIs) are disclosed for controlling a solid-state luminaire having an electronically adjustable light beam distribution. The disclosed UI may be configured, in accordance with some embodiments, to provide a user with the ability to control, by wireless and/or wired connection, the light distribution of an associated solid-state luminaire in a given space. The UI may be hosted by any computing device, portable or otherwise, and may be used to control any given light distribution capability provided by a paired luminaire. In accordance with some embodiments, the user may provide such control without need to know details about the luminaire, such as the quantity of solid-state lamps, or their individual addresses, or the address of the fixture itself. In some cases, the disclosed techniques may involve acquiring spatial information of the space that hosts the luminaire and/or providing user-selected distribution of light within that space.

Abstract: A conversion device includes a carrier body, a conversion body, which is secured on the carrier body, for converting electromagnetic radiation, a conduction track, which is applied on the conversion body, for monitoring the conversion body, and a contact element applied on the carrier body. The contact element has a first layer construction including at least a first contact layer and a second contact layer including mutually different materials. The conduction track has a second layer construction including at least a first conduction layer and a second conduction layer comprising mutually different materials. The contact element is electrically connected to the conduction track. At least one of the first conduction layer or the second conduction layer are electrically conductive and the thickness of said conductive layers is chosen such that an electrical impedance of the conduction track lies in a predetermined range.

Abstract: A circuit assembly for simulating a load current from an on-board network having an input connected to a line of the on-board network of a vehicle for connecting to a load, an output connected to a light source which replaces the load. A series circuit formed by a resistor and a switch, wherein the resistor has a resistance in the same order as that of the load to be simulated, and the series circuit is connected in parallel with the input. A switching controller with the input connected in parallel to the input of the circuit assembly, and draws a current from the line of the on-board network for connecting to a load smaller than the load current of the load to be replaced. The circuit assembly is open the switch and actuate the switching controller and to close the switch and deactivate the switching controller.

Abstract: An optoelectronic semiconductor component is disclosed, comprising: a semiconductor body (1) having a semiconductor layer sequence (2) with a p-type semiconductor region (3), an n-type semiconductor region (5), and an active layer (4) arranged between the p-type semiconductor region (3) and the n-type semiconductor region (5); a support (10) having a plastic material and a first via (11) and a second via (12); a p-contact layer (7) and an n-contact layer (8), at least some regions of which are arranged between the support (10) and the semiconductor body (1), wherein the p-contact layer (7) connects the first via (11) to the p-type semiconductor region (3) and the n-contact layer (8, 8A) connects the second via (12) to the n-type semiconductor region (5); and an ESD protection element (15) which is arranged between the support (10) and the semiconductor body (1), wherein the ESD protection element (15) is electrically conductively connected to the first via (11) and to the second via (12), and wherein a forwar

Abstract: A lighting control apparatus for producing control signals or cues for controlling operating parameter of one or more controlled lighting devices, including a learning machine configured for performing: a supervised learning phase, wherein, as a function of a first set of audio and/or video files coupled with a first set of control signals, the machine produces mapping rules between the audio and/or video files and the control signals of these first sets; an unsupervised learning phase wherein the machine receives a second set of audio and/or video files and produces, from the second set of audio and/or video files, a second set of control signals as a function of the mapping rules. The learning machine may be configured to carry out a reinforced learning phase with the production of an evaluation ranking of the mapping rules and the possible elimination of mapping rules.

Abstract: A module for a video wall includes a first light emitting chip of an image pixel connecting to a first power line by a first electrical terminal, the first light emitting chip connects to a third power line by a second electrical terminal, a second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is a surface metallization, including contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on a carrier, the insulation layer includes openings above the contact sections, and the light emitting chips are arranged in the openings.

Abstract: In one embodiment of the invention, the semiconductor laser (1) comprises a semiconductor layer sequence (2). The semiconductor layer sequence (2) contains an n-type region (23), a p-type region (21) and an active zone (22) lying between the two. A laser beam is produced in a resonator path (3). The resonator path (3) is aligned parallel to the active zone (22). In addition, the semiconductor laser (1) contains an electrical p-contact (41) and an electrical n-contact (43) each of which is located on the associated region (21, 23) of the semiconductor layer sequence (2) and is configured to input current directly into the associated region (21, 23). The n-contact (43) extends from the p-type region (21) through the active zone (22) and into the n-type region (23) and is located, when viewed from above, next to the resonator path (3).

Abstract: The invention relates, inter alia, to a method for producing a plurality of semiconductor chips, the method comprising the following steps: providing a substrate (1); applying a semiconductor layer sequence (2) to the substrate (1); generating a plurality of recesses (6) in the semiconductor layer sequence (2) on the side of the semiconductor layer sequence (2) that is facing away from the substrate (1); detaching the substrate (1) from the semiconductor layer sequence (2); thinning the semiconductor layer sequence (2) on the side that was facing the substrate (1) prior to detaching the substrate (1).

Abstract: A semiconductor component and an illumination device is disclosed. In an embodiment the semiconductor component includes a semiconductor chip configured to generate a primary radiation having a first peak wavelength and a radiation conversion element arranged on the semiconductor chip. The radiation conversion element includes a quantum structure that converts the primary radiation at least partly into secondary radiation having a second peak wavelength and a substrate that is transmissive to the primary radiation.

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a layer structure having an active zone for producing electromagnetic radiation, wherein the active zone is arranged in a first plane, wherein a recess is introduced into the surface of the layer structure, wherein the recess adjoins an end surface of the component, wherein the end surface is arranged in a second plane, wherein the second plane is arranged substantially perpendicularly to the first plane, wherein the recess has a bottom surface and a lateral surface wherein the lateral surface is arranged substantially perpendicularly to the end surface, wherein the lateral surface is arranged tilted at an angle not equal to 90° to the first plane of the active zone, and wherein the bottom surface is arranged in the region of the first plane of the active zone.

Abstract: According to the present disclosure, an organic optoelectronic component provides with a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure, at least one contact section for electrically contacting the organic optoelectronic component, and an electrically conductive elastomer connector which is arranged above the contact section and is electrically connected to the contact section. The contact section is electrically connected to one of the electrodes.

Abstract: A method of increasing photo-luminescent quantum yield (PLQY) of QDs to be used as down-converters placed directly on an LED chip includes synthesizing a plurality of quantum dots, applying energy to the plurality of quantum dots to increase PLQY of the plurality of quantum dots, dispensing the plurality of quantum dots onto the LED chip, and curing the LED chip.

Abstract: A method for producing a component may include providing a composite containing a semiconductor stack layer, a first exposed connection layer and a second exposed connection layer, where the connection layers are arranged on the semiconductor stack, assigned to different electrical polarities and are configured to electrically contact the component to be produced; forming a first through contact exposed in lateral directions on the first connection layer and a second through contact exposed in lateral directions on the second connection layer, where the through contacts are formed from an electrically conductive connection material; and applying a molded body material on the composite for forming a molded body, where each of the through contacts are fully and circumferentially enclosed by the molded body at least in the lateral directions, such that the molded body and the through contacts form a permanently continuous carrier which mechanically carries the component to be produced.

Abstract: A light-emitting assembly is provided in different embodiments. The light-emitting assembly comprises: a substrate (22); first light-emitting components (31) arranged on the substrate (22) along a first line and emitting first light of a first colour; second light-emitting components (33) arranged on the substrate (22) along a second line and emitting second light of a second colour, wherein the first line runs laterally next to the second line; and multiple optical waveguides (44) for guiding the light, which are arranged over the light-emitting components (31, 33), extend in the direction from the first line to the second line, and cross the first line and the second line.