Abstract: A semiconductor device of the present invention includes: a P-type output transistor configured to have a source to which a power supply voltage is applied, and a drain connected to an external connection pad; a gate wiring configured to be connected to a gate of the output transistor; a signal transmitting portion configured to transmit an input signal to the gate wiring; and a voltage-breakdown protecting portion configured to apply the power supply voltage to a back gate of the output transistor if a voltage on the external connection pad is equal to or lower than the power supply voltage, or the voltage-breakdown protecting portion bringing the signal transmitting portion into a disconnection state and applies the voltage on the external connection pad to the gate and the back gate of the output transistor if the voltage applied on the external connection pad is higher than the power supply voltage.

Abstract: A message handler is described. The message handler is configured, in response to receiving a data package which is formatted according to a given communications protocol, such as CAN or Ethernet, and which comprises package-directing data and payload data, to generate package having a predetermined data format, for example a layer-2 or layer-3 package, which comprises a header and payload data. The header comprises an address generated in dependence upon the package-directing data and wherein the payload comprises the data package. The package having a predetermined data format may be an IEEE 1722 frame.

Abstract: A semiconductor device includes a phase interpolation circuit including an N-bit current digital-analog conversion circuit, a switch circuit, a capacitive element, an inverter, and a control logic circuit. The control logic circuit detects an end of a phase interpolation operation by using an output result of the inverter and outputs a first control signal for turning off the current digital-analog conversion circuit. Also, the control logic circuit detects the end of the phase interpolation operation by using the output result of the inverter and outputs a second control signal for turning off the inverter.

Abstract: The source region, drain region, buried insulating film, gate insulating film, and gate electrode of the semiconductor device are formed in a main surface of a semiconductor substrate. The buried insulating film is buried in a first trench formed between the source and drain regions. The first trench has a first side surface and a first bottom surface. The first side surface faces the source region in a first direction extending from one of the source and drain regions to the other. The first bottom surface is connected to the first side surface and is along the main surface of the semiconductor substrate. A crystal plane of a first surface of the semiconductor substrate, which is the first side surface of the first trench, is (111) plane. A crystal plane of a second surface of the semiconductor substrate, which is the bottom surface of the first trench, is (100) plane.

Abstract: An IGBT capable of handling high-speed switching while reducing a leakage current of a semiconductor device including the IGBT is provided. The semiconductor device according to one embodiment includes an IGBT including a p-type collector layer on a back surface of a silicon substrate and a dislocation suppressing layer for forming a hetero junction with silicon in the p-type collector layer. The dislocation suppressing layer includes a silicon germanium (SiGe) layer.

Abstract: A semiconductor device includes a syndrome generation circuit configured to generate a syndrome code based on data and an error correction code corresponding to the data, an error determination circuit configured to detect a 1-bit error in the data based on the syndrome code, and multi-bit error detection circuit configured to determine whether the data detected to have 1-bit error includes a multi-bit error by using an error address of the data detected to have 1-bit error and an error syndrome code of the data detected to have 1-bit error.

Abstract: A semiconductor device according to an embodiment includes a holding circuit including a buffer configured to obtain a heat stress information having a temperature dependency every predetermined period and a stress counter configured to accumulate the heat stress information and hold the accumulated value as a cumulative stress count value, a control circuit including an operation determination threshold value, and a wireless communication circuit. According to the semiconductor device according to the embodiment, while reducing the power consumption, it is possible to wirelessly transmit the cumulative heat stress information.

Abstract: A semiconductor device includes a main circuit and a peripheral circuit inputting/outputting a signal from/to the main circuit, the main circuit including: a memory cell array; a sense amplifier; a first output holding circuit holding the read data output from the sense amplifier; a second output holding circuit receiving the read data as its input output from the first output holding circuit; and a delay circuit outputting a delay signal for activating the second output holding circuit to be later than the first output holding circuit. The delay circuit includes an element applying a load capacitance to a wiring of the delay signal. A power-supply voltage being a first voltage is supplied to the memory cell array, the sense amplifier and the first output holding circuit. A power-supply voltage being a second voltage is supplied to the delay circuit, the second output holding circuit and the peripheral circuit.

Abstract: A semiconductor device has an impurity region covering a bottom of a gate trench and a column region. A bottom of the column region is deeper than a bottom of the gate trench. The impurity region is arranged between the gate trench and the column region. This structure can improve the characteristics of the semiconductor device.

Abstract: A semiconductor device includes a first transistor that flows a load current to an external load; a current generation circuit that outputs a current corresponding to a power consumption generated in an overheat detection target when the load current flows the overheat detection target; a resistor-capacitor-network comprising a resistor and a capacitor corresponding to a thermal resistance and a thermal capacitance of the overheat detection target, and having one end coupled to the current generation circuit; an overheat detection circuit coupled to a connection point of the current generation circuit and the resistor-capacitor-network; and a voltage source that sets a voltage of the connection point of the current generation circuit and the resistor-capacitor-network to a predetermined voltage.

Abstract: A semiconductor device is configured so that two or more master devices access a slave device via a bus. The semiconductor device includes: a priority generation circuit that generates a priority based on a transfer amount between a specific master device and a specific slave device; and an arbitration circuit that performs an arbitration based on the priority when competition of the accesses occurs.

Abstract: Oscillator circuitry is disclosed. The oscillator circuitry comprises a free-running oscillator for generating pulses at a frequency, and a frequency adjustment circuit for adaptively adjusting the frequency of the free-running oscillator. The frequency adjustment circuit comprises a counter configured to count a number of pulses generated by the free-running oscillator and logic configured to compare the number of pulses with an expected number of pulses (corresponding to a target frequency) to determine a difference value and to adjust the frequency of the free-running oscillator in dependence on the difference value. The frequency adjustment circuit is configured, in response to receiving a synchronisation pulse, to trigger an update of the number of pulses to be compared.

Abstract: The semiconductor device includes a control unit having redundant processors, a memory storing target data, a secure memory storing a key used for encryption or decryption processing, an cryptographic unit, a secure processor instructing cryptographic processing to the cryptographic unit in response to a request from the control unit, a first bus coupled to the control unit, the memory, the cryptographic unit, and the secure processor, and a second bus coupled to the secure memory, the cryptographic unit, and the secure processor. The control unit communicates with the memory via a predetermined error detection mechanism, the cryptographic unit includes a plurality of cryptographic processors that independently perform cryptographic processing on target data using a key based on an instruction, and each of the plurality of cryptographic processors includes a data transfer unit that performs data transfer with the memory via the error detection mechanism.

Abstract: The plurality of CAM cells MC are configured to discriminate a match or mismatch between stored data stored in advance and search data. A match line is coupled to a plurality of CAM cells, and has a voltage level controlled based on discrimination results of the plurality of CAM cells. A first transistor and a second transistor are coupled in series between a common match output line and a predetermined power source. The first transistor is controlled to be turned ON or OFF based on a voltage level of the match line, and the second transistor is controlled to be turned ON or OFF by a search enabling signal asserted at the time of a search operation.

Abstract: A network device comprising a set of queues and a time-aware shaper which comprises a set of transmission gates and gate control instructions. The gate control list comprises a set of individual gate control lists, each individual gate control list configured to control a respective gate and which comprises a sequence of entries, each entry comprising a duration of time.

Abstract: A semiconductor device with improved reliability is provided. The semiconductor device is characterized by its embodiments in that sloped portions are formed on connection parts between a pad and a lead-out wiring portion, respectively. This feature suppresses crack formation in a coating area where a part of the pad is covered with a surface protective film.

Abstract: A semiconductor device includes: a semiconductor substrate; an insulating layer formed on the semiconductor substrate; an optical waveguide formed on the insulating layer, extending in a first direction in a plan view, and being made of silicon; and an interlayer insulating film formed on the insulating layer to cover the optical waveguide. In this case, a crystal surface of a side surface of the optical waveguide is a (111) surface.

Abstract: Improving a reliability of a semiconductor device. A resistive element is comprised of a semiconductor layer of the SOI substrate and an epitaxial semiconductor layer formed on the semiconductor layer. The epitaxial semiconductor layer EP has two semiconductor portions formed on the semiconductor layer and spaced apart from each other. The semiconductor layer has a region on where one of the semiconductor portion is formed, a region on where another of the semiconductor portion is formed, and a region on where the epitaxial semiconductor layer is not formed.

Abstract: The semiconductor device has the main surface, the semiconductor substrate having the first impurity region formed on the main surface, the first electrode formed on the main surface having the first impurity region, the insulating film formed on the main surface such that surround the first electrode, the second electrode formed on the insulating film such that spaced apart from the first electrode and annularly surround the first electrode, and the semi-insulating film. The first electrode has the outer peripheral edge portion. The semi-insulating film is continuously formed from on the outer peripheral edge portion to on the second electrode. The outer peripheral edge portion includes the first corner portion. The second electrode has the second corner portion facing the first corner portion. The semi-insulating film on the insulating film is removed between the first corner and the second corner portion.

Abstract: A semiconductor device includes a semiconductor substrate, a semiconductor layer, a first insulating film, and a conductive film. The semiconductor layer is formed on the semiconductor substrate. A first trench reaching the semiconductor substrate is formed within the semiconductor layer. The first insulating film is formed on the inner side surface of the first trench such that a portion of the semiconductor substrate is exposed in the first trench. The conductive film is electrically connected with the semiconductor substrate and formed on the inner side surface of the first trench through the first insulating film. In plan view, a first length of the first trench in an extending direction of the first trench is greater than a second length of the first trench in a width direction perpendicular to the extending direction, and equal to or less than 30 ?m.