Abstract: A semiconductor device and a method for controlling body bias thereof capable of properly controlling body bias of a transistor even in a case where process variation occurs are provided. Operation speeds of ring oscillators ROSCn and ROSCp respectively change due to an influence of process variation at an NMOS transistor MN side and a PMOS transistor MP side. Speed/bias data represent a correspondence relationship between the operation speeds of the ring oscillators ROSCn and ROSCp and set values V1n and V1p of body biases VBN and VBP. A body bias controller receives speed values Sn and Sp measured for the ring oscillators ROSCn and ROSCp to which the body biases VBN and VBP based on default values are respectively applied, and obtains the set values V1n and V1p on the basis of the speed/bias data.

Abstract: An image sensor including an ADC circuit receiving pixel data to be supplied in parallel from the a pixel array, outputting a reference signal in accordance with a digital code, comparing the reference signal and the pixel data, and outputting the digital code at which the reference signal and the pixel data have a predetermined relation, the ADC circuit including a ramp-signal generating circuit outputting a ramp signal having a gradient with respect to change of the digital code, the gradient being different between when the digital code is in a first range and when the digital code is in a second range different from the first range and an attenuator receiving the ramp signal to be supplied and outputting the reference signal having a gradient being the same between when the digital code is in the first range and when the digital code is in the second range.

Abstract: Example implementations include a system of secure decryption by virtualization and translation of physical encryption keys, the system having a key translation memory operable to store at least one physical mapping address corresponding to at least one virtual key address, a physical key memory operable to store at least one physical encryption key at a physical memory address thereof; and a key security engine operable generate at least one key address translation index, obtain, from the key translation memory, the physical mapping address based on the key address translation index and the virtual key address, and retrieve, from the physical key memory, the physical encryption key stored at the physical memory address.

Abstract: A conventional network managing method has a problem that there is a high possibility that a setting error of communication software occurs. According to one embodiment, a non-transitory computer-readable medium including a network managing program is executed in a master apparatus, system information stored in a slave apparatus in advance is read out in a procedure conforming to an SNMP, protocol information in which a communication protocol that can be used by the slave apparatus is described is read out from the slave apparatus by using an object ID described in the system information thus read out, and the protocol information thus read out is referred to start communication with the slave apparatus by executing software corresponding to the communication protocol.

Abstract: Systems and methods for evaluating a set of bounding boxes in a blended image are described. A system can include an integrated circuit configured to obtain expected bounding box data. The expected bounding box data can be based on coordinates data of an image. The integrated circuit can determine target coordinates based on the expected bounding box data. The integrated circuit can receive a blended image including a set of objects and a set of bounding boxes. The integrated circuit can extract pixel values located at the target coordinates in the blended image. The integrated circuit can identify an error relating to the set of bounding boxes based on the extracted pixel values and the expected bounding box data.

Abstract: Reliability of a semiconductor device is improved. The semiconductor device PKG1 includes a wiring substrate SUB1, a semiconductor chip CHP1 and a capacitor CDC mounted on the upper surface 2t of the wiring substrate SUB1, and a lid LD formed of a metallic plate covering the semiconductor chip CHP1 and the wiring substrate SUB1. The semiconductor chip CHP1 is bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP1, is disposed in the cut off portion 4d1 provided in the lid LD, and is exposed from the lid LD.

Abstract: To provide a memory protection circuit and a memory protection method suitable for quick data transfer between a plurality of virtual machines via a common memory, according to an embodiment, a memory protection circuit includes a first ID storing register that stores therein an ID of any of a plurality of virtual machines managed by a hypervisor, an access determination circuit that permits the virtual machine having the ID stored in the first ID storing register to access a memory, a second ID storing register that stores therein an ID of any of the virtual machines, and an ID update control circuit that permits the virtual machine having the ID stored in the second ID storing register to rewrite the ID stored in the first ID storing register.

Abstract: A semiconductor device includes a semiconductor substrate having first and second surfaces, an insulated gate bipolar transistor (IGBT) and a diode formed on the semiconductor substrate, wherein the diode comprises a drift layer of a first conductivity type formed so as to have a first region on the first surface of the semiconductor substrate, a first body layer of a second conductivity type formed so as to have a second region adjacent to the first region at an upper portion of the drift layer, a first floating layer of the second conductivity type formed so as to have a third region adjacent to the first region at an upper portion of the drift layer, a first trench electrode formed in a region adjacent to the first floating layer at an upper portion of the drift layer, and a first control gate formed on top of the first region.

Abstract: Controllers are provided for providing ports corresponding to Dual Role Powers (DRPs), which may be both the feed side and the receive side, in accordance with the USB Type-C and/or USB Power Delivery standards. The controller includes a control interface for controlling a power management unit for controlling charging and discharging of the secondary battery, a signal transmission module for exchanging a signal with a connection destination via a communication line in the USB cable, and a sequence execution unit. If the power supply from the secondary battery becomes over discharged while the power stored in the secondary battery as the power supply side is being supplied to the connection destination, the sequence execution unit stops the substantial execution of the sequence as the power receiving side unless a predetermined condition is satisfied.

Abstract: A Semiconductor device includes an insulating layer, an optical waveguide, a first dummy semiconductor film, a second semiconductor film and a third semiconductor film. The optical waveguide is formed on the insulating layer. The first dummy semiconductor film is formed on the insulating layer and is spaced apart from the optical waveguide. The first dummy semiconductor film is formed on the first semiconductor film. The second semiconductor film is integrally formed with the optical waveguide as a single member on the insulating layer. The third semiconductor film is formed on the second semiconductor film. A material of the first dummy semiconductor film is different from a material of the optical waveguide. In plan view, a distance between the optical waveguide and the first dummy semiconductor film in a first direction perpendicular to an extending direction of the optical waveguide is greater than a thickness of the insulating layer.

Abstract: The semiconductor device includes an image signal processor, a scaler, and an ROI (Region of Interest) controller. The image signal processor executes image processing including demosaic processing and stores the image after the image processing in memory. The scaler reduces the capture image from the image sensor to generate a reduced entire image and causes the image signal processor to execute image processing on the reduced entire image. The ROI controller cuts out a partial region of the captured image from the image sensor to generate an ROI image and causes the image signal processor to execute image processing on the ROI image.

Abstract: The abnormal power supply voltage detection device has a function of accurately detecting the abnormal voltage in accordance with the characteristics of the semiconductor element for each semiconductor chip. Circuit group for operating the adjustment function has a function of preventing the influence of the power supply voltage of the logic system such as control in the semiconductor product malfunctions becomes abnormal. Furthermore, it has a function of detecting the abnormal voltage of the various power supplies in the semiconductor product. It also has a function to test the abnormal voltage detection function in the normal power supply voltage range during use of semiconductor products.

Abstract: A semiconductor device includes: a first substrate; a multilayer wiring layer formed on the first substrate; a first inductor formed into a meander shape on the multilayer wiring layer in a plan view; and a second inductor formed into a meander shape on the multilayer wiring layer in a plain view, and arranged so as to be close to the first inductor in a plan view and not to overlap with the first inductor. A transformer is configured by the first inductor and the second inductor and, in a plan view, the first inductor and the second inductor extend along a first direction in which one side of the first substrate extends.

Abstract: A semiconductor device capable of decreasing a jitter component is provided. A first calibration circuit searches a second delay value of a data delay circuit while determining a delay value of a strobe delay circuit to be a first delay value that is larger than the minimum value and smaller than the maximum value. A second calibration circuit determines a first corrected delay value and a second corrected delay value by shifting both the first delay value and the second delay value by the same correction value in a direction toward the minimum value, and sets the first corrected delay value and the second corrected delay value to the strobe delay circuit and the data delay circuit, respectively.

Abstract: The present invention is to reduce detection of an erroneous edge caused by variation in a case of a sampling frequency that is not larger than a data transmission frequency. A semiconductor device includes: a data reception circuit configured to receive first data at first time and receive second data at second time; and an edge recognition circuit configured to set a range and detect an edge contained in the range. The edge recognition circuit includes a measurement circuit configured to measure a first period taken from the reception of the first data to the reception of the second data, and is configured to determine the range in which the edge contained in the data that is received by the data reception circuit is detected, on the basis of the first period.

Abstract: An over-temperature protection circuit is described. The circuit comprises an input for sensing a voltage across a transistor, a voltage-to-current converter configured to generate a current in dependence upon the voltage, an accumulator storing a value indicative of power dissipated by the transistor and which depends on the current; and a comparator configured to determine whether the value exceeds a threshold value and, in dependence on the value exceeding the threshold value, to generate a signal to cause the transistor to be switched off.

Abstract: A semiconductor device comprises a wiring substrate and a semiconductor chip. In the wiring substrate, a plurality of micro-elements each comprised of a stacked structure including a power supply pattern and a ground pattern is arranged at a predetermined interval. In each of the plurality of micro-elements, the power supply pattern is formed in a wiring layer located one layer above or one layer below a wiring layer in which the ground pattern is formed. A power supply potential is to be supplied to the power supply patter, and a ground potential is to be supplied to the ground patter.

Abstract: A semiconductor device includes clock adjustment circuits, provided to a plurality of functional circuits operating in synchronization with a clock signal respectively for adjusting a delay amount for each functional circuit, and a clock path selection circuit for controlling whether a clock is transmitted to the functional circuits through any one of a plurality of paths included in the clock adjustment circuits respectively. In the semiconductor device, the clock path selection circuit outputs a path instruction signal for instructing switching of a path for transmitting a clock signal in accordance with a change in an operation state of a plurality of functional circuits.

Abstract: First, an offset spacer including a stacked film of insulating films is formed on the upper surface of the semiconductor layer, the side surface of the gate electrode, and the side surface of the cap film. Next, a part of the insulating films is removed to expose the upper surface of the semiconductor layer. Next, in a state where the side surface of the gate electrode is covered with the insulating films, an epitaxial layer is formed on the exposed upper surface of the semiconductor layer. Here, among the offset spacers, the insulating film which is a silicon nitride film is formed at a position closest to the gate electrode, and the position of the upper end of the insulating film formed on the side surface of the gate electrode is higher than the position of the upper surface of the gate electrode.

Abstract: An inspection terminal provided in a test device has a main body portion including a support portion that is curved; a plate-shaped portion integrally connected to the support portion and extending in a first direction; a tip portion integrally connected to the plate-shaped portion and having a larger dimension in a second direction intersecting with the first direction than that of the plate-shaped portion in the second direction; and a slit formed from the tip portion to the plate-shaped portion so as not to reach the support portion of the inspection terminal. The tip portion of the inspection terminal has a first contact portion and a second contact portion that are separated from each other by way of via the slit, and each contact portion is brought into contact with an external terminal of a semiconductor package, and an electrical test of the semiconductor package is performed.