Abstract: A semiconductor device includes a semiconductor substrate, a semiconductor element, and a multilayer wiring. The semiconductor element is formed on the semiconductor substrate. The multilayer wiring includes a wiring electrically connected with the semiconductor element, and a first inductor. The multilayer wiring is formed on the semiconductor substrate such that the multilayer wiring covers the semiconductor element. The first inductor is formed such that the first inductor electrically isolated from the wiring and is magnetically connected with the wiring.

Abstract: A debug apparatus for performing allocation of target programs in which temperature is uniformized is provided. The debug apparatus receives temperature data measured by temperature sensors from a semiconductor device. The debug apparatus determines, as an analysis result of the temperature data, a CPU where the number of target programs executed is to be decreased and a CPU where the number of target programs executed is to be increased. The debug apparatus changes allocation of the target programs executed by a plurality of CPUs in the semiconductor device based on the analysis result of the temperature data.

Abstract: A semiconductor device, a battery pack, a method of controlling the semiconductor device, and a control program capable of accurately measuring a remaining capacity of a battery is provided. The semiconductor device includes: a current measurement circuit configured to measure a current value of a first current supplied from a battery to the semiconductor device that is a host device and a current value of a second current supplied from the battery to a load; and a computing circuit configured to calculate the remaining capacity of the battery, based on an accumulation value of the first current and an accumulation value of the second current in a period from start of discharging to end of discharging in the battery.

Abstract: A power electronic module is provided that includes an electrical connection on opposing surfaces of an electronic component that allows a high current path from a top board to a bottom board through the body of the electronic component thus improving the power electronic module's electrical resistance and reducing the current load on the connector structure which is located between the first substrate and the second substrate. The power electronic module further includes a semiconductor component positioned on an external surface of the top board which allows for thermal contact of the semiconductor component with an external heat sink thus providing an efficient system thermal management via a reduced heat dissipation path. Additional heat dissipation can be obtained by disposing a metallic spacer on the semiconductor component of the power electronic module of the present disclosure.

Abstract: A CAN communication controller and a method of operating a CAN communication controller are disclosed. The CAN communication controller is for transmitting first and second types of frames wherein the first type of frame is used to transmit event-triggered communication data and the second type of frame is used to transmit best effort traffic data, the CAN communication controller configured, in response to transmitting a frame of the second type having a given identifier, to delay arbitration of a following frame of the second type having the given identifier, and not to delay arbitration of a frame of the first type.

Abstract: A differential amplifier includes a first differential amplifier circuit as a first stage, a second differential amplifier circuit having a common mode feedback circuit in a second stage, and a feedback differential circuit configured to multiply a differential signal between a differential output of the first differential amplifier circuit and a differential input of the second differential amplifier circuit by a magnitude of a differential output of the common mode feedback circuit.

Abstract: A method for manufacturing a semiconductor device includes forming semiconductor devices from a semiconductor wafer and identifying a position of the semiconductor device in the semiconductor wafer, wherein the forming the semiconductor devices includes forming a first repeating pattern including i semiconductor devices each having a unique pattern, forming a second repeating pattern including j semiconductor devices each having a unique pattern, defining semiconductor devices on the semiconductor wafer such that each of the k semiconductor devices has a unique pattern based on the first and second repeating patterns, and grinding a backside of the semiconductor wafer, wherein each unique pattern of the k semiconductor devices is composed of a combination of the unique patterns of the first and second repeating patterns, wherein the position of the semiconductor device is identified based on the unique patterns of the first and second repeating patterns and an angle of a grinding mark.

Abstract: Exemplary embodiments may include a device with an input power component, a system supply component, an inductive charger component operatively coupled to the input component and the system component, and a direct charger component operatively coupled to the inductive charger and the system component. Exemplary embodiments may further include an input node of the inductive charger component and an input node of the direct charger component operatively coupled to an output node of the input power component at a first device node. Exemplary embodiments may also include a method of receiving an input power signal, obtaining a charging condition, entering a first charging state, in accordance with the obtained charging condition satisfying a first charging condition, and entering a second charging state, in accordance with the obtained charging condition satisfying a second charging condition.

Abstract: An apparatus is disclosed that includes a duty cycle controller. The duty cycle controller includes a tuning circuit comprising a first field-effect transistor. The first field-effect transistor is configured to implement a capacitor. The duty cycle controller further includes an edge delay circuit. The edge delay circuit includes a second field-effect transistor that, when activated by an input clock signal of the duty cycle controller, is configured to connect a voltage source to an output clock signal of the duty cycle controller. The edge delay circuit further includes a third field-effect transistor that, when activated, is configured to connect the first field-effect transistor of the tuning circuit to the output clock signal.

Abstract: A semiconductor device which is a processor includes a plurality of first power supply regions in each of which a functional module having a predetermined function is arranged and to which a power supply voltage is individually supplied, a setting unit configured to specify an order of supplying the power supply voltage in the plurality of first power supply regions, and a power controller configured to supply the power supply voltage to the plurality of first power supply regions in accordance with the order specified by the setting unit.

Abstract: A non-volatile semiconductor memory and three or more types of transistors are provided. A thickness of a first gate oxide film of a first transistor is larger than that of a second gate oxide film of a second transistor, and is smaller than that of a third gate oxide film of a third transistor. In a first transistor region, a first silicon oxide film is formed on a surface of a semiconductor substrate, and second and third silicon oxide films are formed on the first silicon oxide film. By removing the second and third silicon oxide films and a part of an upper layer of the first silicon oxide film, the first gate oxide film is formed from the first silicon oxide film.

Abstract: Systems and apparatuses for wireless power transfer system are described. A receiver may send an amplitude shift key (ASK) signal to a transmitter. The transmitter may receive the ASK signal from the receiver. The transmitter may perform a demodulation on the ASK signal. The transmitter may, in response to a failure to demodulate the ASK signal, encode a notification of failure in a frequency shift key (FSK) signal. The transmitter may transmit the FSK signal to the receiver. The receiver may receive the FSK signal. The receiver may perform a function to resolve the failure to demodulate the ASK signal.

Abstract: A resolver converter includes a tracking loop circuit that calculates an angle ? from a resolver output signal, a control and diagnosis circuit that controls the tracking loop circuit and diagnoses based on the resolver output signal, wherein the control and diagnosis circuit, by operating the tracking loop circuit as a direct digital synthesizer (DDS), synchronously detects a noise signal superimposed on the resolver output signal.

Abstract: Example implementations includes a method of partitioning a non-transitory memory device by detecting a boot state of a processing device including a non-transitory memory device, identifying a startup state of the processing device based on the boot state, and partitioning the memory device into at least one secure address region, in accordance with a determination that the startup state satisfies an operating state condition. Example implementations also include a method of generating a secure partition associated with a non-transitory memory device by identifying a target processing instruction restricted to execution at a secure subsystem of a processing device, assigning to the target processing instruction a secure address, associating the secure address with a secure address region of a non-transitory memory device of the processing device, and generating a secure partition table including the secure address.

Abstract: An apparatus, a method and a non-transitory computer-readable storage medium storing a program for controlling power receiving operation. The apparatus includes a controller configured to compare a frequency of an electric current generated by a voltage induced in a power receiving circuit by a magnetic field generated by a power transmitting apparatus, against a frequency threshold to determine whether the frequency is equal to or below the frequency threshold, and in response to determining that the frequency is equal to or below the frequency threshold, control a communications circuit to communicate a control command message instructing the power transmitting apparatus to modify a power charge signal used to provide the magnetic field in a manner for protecting the apparatus.

Abstract: A semiconductor device includes a crystal oscillator circuit, a first noise application circuit, and a second noise application circuit. The first noise application circuit is connected to the crystal oscillator circuit and is configured to drive a crystal resonator by selectively applying initial noises of opposite phases to a first external terminal and a second external terminal. The second noise application circuit applies a second noise to the first external terminal by amplifying a signal at the first external terminal and returning the amplified signal to the first external terminal, thereby driving an oscillation amplifier and a crystal resonator of the crystal oscillator circuit and shortening a start-up time of the crystal oscillator circuit.

Abstract: A message handler is described. The message handler is configured, in response to receiving a data package which is formatted according to a given communications protocol, such as CAN or Ethernet, and which comprises package-directing data and payload data, to generate package having a predetermined data format, for example a layer-2 or layer-3 package, which comprises a header and payload data. The header comprises an address generated in dependence upon the package-directing data and wherein the payload comprises the data package. The package having a predetermined data format may be an IEEE 1722 frame.

Abstract: An IGBT capable of handling high-speed switching while reducing a leakage current of a semiconductor device including the IGBT is provided. The semiconductor device according to one embodiment includes an IGBT including a p-type collector layer on a back surface of a silicon substrate and a dislocation suppressing layer for forming a hetero junction with silicon in the p-type collector layer. The dislocation suppressing layer includes a silicon germanium (SiGe) layer.

Abstract: A computer-implemented method of monitoring a first signal with respect to a plurality of threshold values within a simulation of an electronic circuit, the method comprising providing a first threshold value, monitoring the first signal with respect to the first threshold value, detecting that the first signal has reached or has traversed across the first threshold value, and generating a second threshold value in response to the detection of the first signal having reached or having traversed across the first threshold value.

Abstract: Systems and methods for using a battery voltage loop under high-current conditions are described. A method for operating a charger, the method includes setting, by a charger controller, a battery voltage threshold; setting, by the charger controller, an on-the-go (OTG) voltage threshold; computing, by a first comparator, a battery voltage error based on a difference between a battery voltage and the battery voltage threshold; computing, by a second comparator, an OTG voltage error based on a difference between an OTG voltage and the OTG voltage threshold; and selecting, by a loop selector, a battery voltage loop when the battery voltage error is smaller than the OTG voltage error.