Abstract: The composition includes: (i) an ethylene-based polymer; (ii) an organic peroxide, (iii) a triorganophosphine, and (iv) a protic acid-source compound (“PASC”) selected from a protic acid, a protic acid-generator compound (“PAGC”), and combinations thereof. The triorganophosphine has the Structure (1): wherein R1, R2, and R3 each is independently selected from a C1-C40 hydrocarbyl group, a C1-C40 heterohydrocarbyl group, and combinations thereof; with the proviso that the phosphorus atom is bound to a carbon atom in each of R1, R2, and R3.

Abstract: A neural interfacing device is disclosed. The neural interfacing device includes a microneedle electrode. The microneedle electrode includes a body having a void formed therein and a plurality of microneedles. The void surrounds the plurality of microneedles, and the plurality of microneedles are bent outward with respect to the body to form a three-dimensional microneedle electrode. Additionally, each of the plurality of microneedles is sized and shaped to penetrate a nerve epineurium.

Abstract: A resin for grayscale digital light processing 3D printing includes a donor moiety, an acceptor moiety, a rigid moiety, a photoinitiator, and a photoabsorber. The donor moiety is an acrylate monomer with a side group of a free carbonyl, a primary amine on an acrylate, a secondary amine on an acrylate, and/or a tertiary amine on an acrylate. The acceptor moiety is different than the donor moiety and is an acrylate monomer with a side group of a free hydroxy, a primary amine, secondary amine, and/or an imine. And the rigid moiety is acrylate monomer with a side group of a cyclohexyl, a substituted cyclohexyl, or a bicyclic structure. A monolithic structure formed from the resin using grayscale digital light processing 3D printing can have a Young's modulus ranging from 0.1 MPa to 100 MPa.

Abstract: In an aspect, a solid-state Li-ion battery (SSLB) cell, may comprise an anode electrode comprising an anode electrode surface and an anode active material, a cathode electrode comprising a cathode electrode surface and an cathode active material, and an inorganic, melt-infiltrated, solid state electrolyte (SSE) ionically coupling the anode electrode and the cathode electrode, wherein at least a portion of at least one of the electrode surfaces comprises an interphase layer separating the respective electrode active material from direct contact with the SSE, and wherein the interphase layer comprises two or more metals from the list of: Zr, Al, K, Cs, Fr, Be, Mg, Ca, Sr, Ba, Sc, Y, La or non-La lanthanoids, Ta, Zr, Hf, and Nb.

Abstract: A collar may be provided having an aperture through it through which the turret of a wafer handling robot may be extended or retracted. The collar may have one or more radial gas passages. Gas directed inwards towards the turret from the radial passage(s) may turn downward when it strikes the turret. A bellows may be optionally affixed to the bottom of the turret and to the bottom of the base such that the volume of the base occupied by the turret and the bellows remains generally fixed regardless of the degree to which the turret is extended from the base.

Abstract: A substrate support includes an edge ring, one or more heating elements, and a cable configured to provide power from a power source to the edge ring and the one or more heating elements. The cable includes a first plurality of wires connected to the edge ring, a second plurality of wires connected to the one or more heating elements, a filter module, wherein the first plurality of wires and the second plurality of wires are twisted together within the filter module, and an isolation device. The isolation device is connected to the first plurality of wires and disposed between the filter module and the edge ring. The isolation device is configured to compensate for a resonance frequency generated during operation of the edge ring and the one or more heating elements.

Abstract: A substrate processing system for treating a substrate includes a manifold, a plurality of injector assemblies located in a processing chamber, and a dose controller. Each of the plurality of injector assemblies is in fluid communication with the manifold and includes a valve including an inlet and an outlet. The dose controller is configured to communicate with the valve in each of the plurality of injector assemblies. The dose controller is configured to adjust a pulse width supplied to the valve in each of the plurality of injector assemblies to provide spatial dosing and at least one of compensate for upstream skew caused by a prior process and pre-compensate for downstream skew expected from a subsequent process.

Abstract: Methods and related apparatus for depositing an ashable hard mask (AHM) on a substrate include pulsing a low frequency radio frequency component at a high power. Pulsing low frequency power may be used to increase the selectivity or reduce the stress of an AHM. The AHM may then be used to etch features into underlying layers of the substrate.

Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.

Abstract: Respiratory protection systems are provided containing a form-fitting facial frame and a removable filter media. The respiratory protection systems can alleviate the problems with fit and comfort of traditional respiratory protection systems. The form-fitting facial frame can intimately contact the face of a subject and can be configured to removably secure a filter media. The form-fitting facial frame can include an upper frame portion configured to intimately contact the dorsum nasi and cheekbone of a subject, and lower frame portion configured to intimately contact the jaw line of the subject. In some embodiments, the form-fitting facial frame is manufactured based upon a facial feature of a subject. The form-fitting facial frame can be manufactured by 3D printing. The respiratory system can be used with common mechanical filter media including N95 and N100 filter media.

Abstract: Methods, systems, and computer programs are presented for determining the recipe for manufacturing a semiconductor with the use of machine learning (ML) to accelerate the definition of recipes. One general aspect includes a method that includes an operation for performing experiments for processing a component, each experiment controlled by a recipe, from a set of recipes, that identifies parameters for manufacturing equipment. The method further includes an operation for performing virtual simulations for processing the component, each simulation controlled by one recipe from the set of recipes. An ML model is obtained by training an ML algorithm using experiment results and virtual results from the virtual simulations. The method further includes operations for receiving specifications for a desired processing of the component, and creating, by the ML model, a new recipe for processing the component based on the specifications.

Abstract: Various carrier ring designs and configurations to control an amount of deposition at a wafer's front side and bevel edge are provided. The carrier ring designs can control the amount of deposition at various locations of the wafer while deposition is performed on the wafer's back side, with no deposition desired on the front side of the wafer. These locations include front side, edge, and back side of bevel; and front and back side of the wafer. Edge profiles of the carrier rings are designed to control flow of process gases, flow of front side purge gas, and plasma effects. In some designs, through holes are added to the carrier rings to control gas flows. The edge profiles and added features can reduce or eliminate deposition at the wafer's front side and bevel edge.

Abstract: The present disclosure describes systems and methods for novel phononic frequency combs and related sensing techniques realized by a piezoelectric multimode or single-mode mechanical resonator based on parametric pumping. In one embodiment of such a system, a single frequency electrical input provides an electrical signal comprising an amplitude and a single input frequency to a multimode mechanical resonator, in which a value of the single input frequency equals a sum of the resonance frequencies of the two resonance modes of the mechanical resonator. Accordingly, the mechanical resonator is configured to produce at least one phononic frequency comb in response to a motion of the mechanical resonator caused by the electrical signal.

Abstract: A faceplate of a showerhead has a bottom side that faces a plasma generation region and a top side that faces a plenum into which a process gas is supplied during operation of a substrate processing system. The faceplate includes apertures formed through the bottom side and openings formed through the top side. Each of the apertures is formed to extend through a portion of an overall thickness of the faceplate to intersect with at least one of the openings to form a corresponding flow path for process gas through the faceplate. Each of the apertures has a cross-section that has a hollow cathode discharge suppression dimension in at least one direction. Each of the openings has a cross-section that has a smallest cross-sectional dimension that is greater than the hollow cathode discharge suppression dimension.

Abstract: The present invention provides an improved method of PET imaging in a subject for diagnosis and/or treatment of cardiovascular related disease. The method comprises exponential function dosing based on subject body habitus. It provides improved and consistent imaging quality in comparison to fixed or linear dosing based on subject's body weight. More particularly, it relates to a method of imaging processing for diagnosing and/or identifying a risk of developing a coronary artery disease comprising administering a dose of Rb-82 to a subject, wherein the dose is calculated based on exponential squared function of body habitus of the subject; and wherein the method of imaging processing in a subject is iterative ordered-subset expectation maximization (OSEM) reconstruction method.

Abstract: Methods and apparatuses for forming an encapsulation bilayer over a chalcogenide material on a semiconductor substrate are provided. Methods involve forming a bilayer including a barrier layer directly on chalcogenide material deposited using pulsed plasma plasma-enhanced chemical vapor deposition (PP-PECVD) and an encapsulation layer over the barrier layer deposited using plasma-enhanced atomic layer deposition (PEALD). In various embodiments, the barrier layer is formed using a halogen-free silicon precursor and the encapsulation layer deposited by PEALD is formed using a halogen-containing silicon precursor and a hydrogen-free nitrogen-containing reactant.

Abstract: Embodiments are directed toward a mounting device for circuit boards. The mounting device preferably includes a first standoff and a first track. The first standoff is preferably configured to receive a circuit board. The first track is preferably be configured to receive the first standoff. The first standoff is preferably configured to move relative to the first track in two dimensions to facilitate receiving different circuit boards having different sizes or dimensions.

Abstract: Various carrier ring designs and configurations to control an amount of deposition at a wafer's front side and bevel edge are provided. The carrier ring designs can control the amount of deposition at various locations of the wafer while deposition is performed on the wafer's back side, with no deposition desired on the front side of the wafer. These locations include front side, edge, and back side of bevel; and front and back side of the wafer. Edge profiles of the carrier rings are designed to control flow of process gases, flow of front side purge gas, and plasma effects. In some designs, through holes are added to the carrier rings to control gas flows. The edge profiles and added features can reduce or eliminate deposition at the wafer's front side and bevel edge.

Abstract: A method includes arranging a substrate in a processing chamber, and exposing the substrate to a gas mixture including a first metal precursor gas and a second metal precursor gas to deposit a first metal precursor and a second metal precursor onto the substrate at the same time. The method further includes purging the processing chamber, supplying a reactant common to both the first metal precursor and the second metal precursor to form a layer of an alloy on the substrate, and purging the processing chamber.

Abstract: Systems and methods for real-time control of temperature within a plasma chamber are described. One of the methods includes sensing a voltage in real time of a rail that is coupled to a voltage source. The voltage source supplies a voltage to multiple heater elements of the plasma chamber. The voltage that is sensed is used to adjust one or more duty cycles of corresponding one or more of the heater elements. The adjusted one or more duty cycles facilitate achieving and maintaining a temperature value within the plasma chamber over time.