Abstract: A copolymer comprises the polymerized product of a base-soluble monomer of formula (I): wherein Ra is H, F, C1-10 alkyl, or C1-10 fluoroalkyl, L1 is an m valent C2-30 alkylene, C3-30 cycloalkylene, C6-30 arylene, C7-30 aralkylene group, X1 is independently a base-soluble organic group comprising ?-diketone, ?-ester-ketone, ?-di-ester, or a combination comprising at least one of the foregoing; and an additional monomer copolymerizable with the base-soluble monomer of formula (I).

Abstract: The present invention aims at providing a semiconductor device capable of reliably preventing a wire bonded to an island from being disconnected due to a thermal shock, a temperature cycle and the like in mounting and capable of preventing remarkable increase in the process time. In the semiconductor device according to the present invention, a semiconductor chip is die-bonded to the surface of an island, one end of a first wire is wire-bonded to an electrode formed on the surface of the semiconductor chip to form a first bonding section and the other end of the first wire is wire-bonded to the island to form a second bonding section, while the semiconductor device is resin-sealed. A double bonding section formed by wire-bonding a second wire is provided on the second bonding section of the first wire wire-bonded onto the island.

Abstract: A microchip including a separation portion for separating a first component and a second component from a sample containing the first component and the second component, respectively, a first collection portion for collecting the first component, a second collection portion for collecting the second component, a first flow path for guiding the first component from the separation portion to the first collection portion, and a second flow path for guiding the second component from the separation portion to the second collection portion is provided.

Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.

Abstract: A chrome-free composition of an acidic suspension of manganese compounds and manganese ions are applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.

Abstract: A switching power source device disclosed in this specification includes a switching power source portion of nonlinear control method to generate an output voltage from an input voltage by performing an ON/OFF control of a switch element according to a comparison result between a feedback voltage and a reference voltage, wherein a ripple component is injected to either one of the feedback voltage and the reference voltage, and an offset control portion to adjust either one of the feedback voltage and the reference voltage for cancelling a DC offset of the output voltage caused by the ripple component.

Abstract: A semiconductor device includes a semiconductor chip, and a terminal connected with the semiconductor chip. The terminal has a first surface and a second surface spaced from each other in a thickness direction. The semiconductor device also includes a sealing resin covering the semiconductor chip and the terminal. The sealing resin is so configured that the first surface of the terminal is exposed from the sealing resin. The terminal is formed with an opening to be filled with the sealing resin.

Abstract: There is provided a lens control device that feeds a motor current to a lens drive motor which drives lens according to the motor current, the lens control device including: a servo computation portion that calculates a motor current setting value such that a deviation of the position of the lens to which a correction offset has been adjusted from a target position is reduced; a motor driver that generates the motor current according to the motor current setting value; and a calibration computation portion that adjusts the correction offset such that an average value of the motor current approaches zero.

Abstract: A mobile telephone includes a cartilage conduction unit for making contact with the ear cartilage. The cartilage conduction unit is provided to at least one of two corner parts at an upper side of the mobile telephone. The mobile telephone can include a surface of an outer wall and a cartilage conduction vibration source arranged inward from the surface of the outer wall, the vibration of the cartilage conduction vibration source being transmitted to the surface of the outer wall, wherein when the surface of the outer wall is brought into contact with at least a part of the ear cartilage around the entrance part to the external auditory meatus without making contact with the auricular helix, the sound pressure inside the external auditory meatus at about 1 cm from the entrance part of the external auditory meatus has an at least 10 dB increase compared to the non-contact state.

Abstract: The hearing system comprises a finger ring and a hearing device body. The finger ring includes: a first short-distance wireless communication portion; a vibration output portion disposed at a position that contacts a finger to convert a voice signal, which is received by the first short-distance wireless communication portion, into a cartilage conduction vibration and outputs it; and a first power source portion that supplies power to the first short-distance wireless communication portion and the vibration output portion.

Abstract: The present invention provides thermosetting aqueous binder compositions comprising one or more reducing sugar, one or more diprimary diamine or poly(primary amine), and from 7 to 45 wt. %, based on total solids, of one or more polysaccharide having a dextrose equivalent (DE) value of from 5 to 30. The compositions provide treated articles, such as fiberglass mat. The binders provide articles having a dramatically reduced binder weight loss upon cure and a reduction in cure energy needed to achieve early dry strength.

Abstract: A semiconductor laser device includes a p-type clad layer and an n-type clad layer, a p-side guide layer and an n-side guide layer interposed between the p-type clad layer and the n-type clad layer, and an active layer interposed between the p-side guide layer and the n-side guide layer. The active layer includes at least two quantum well layers and a barrier layer interposed between the quantum well layers adjoining to each other. Each of the p-type clad layer and the n-type clad layer is formed of a (Alx1Ga(1-x1))0.51In0.49P layer (0?x1?1). Each of the p-side guide layer, the n-side guide layer and the barrier layer is formed of a Alx2Ga(1-x2)As layer (0?x2?1). Each of the quantum well layers is formed of a GaAs(1-x3)Px3 layer (0?x3?1). The (Alx1Ga(1-x1))0.51In0.49P layer has a composition satisfying an inequality, x1>0.7. The Alx2Ga(1-x2)As layer has a composition satisfying an inequality, 0.4?x2?0.8.

Abstract: A soft-start circuit generates a soft-start voltage Vss having a voltage level that rises over time. A pulse width modulator generates a PWM signal having a duty ratio adjusted such that a feedback voltage Vout? that corresponds to the output voltage Vout of the switching power supply matches the soft-start voltage Vss. A driver circuit controls a switching element according to the PWM signal. A capacitor is arranged such that one terminal thereof is set to a fixed electric potential. A current source generates a charge current that flows intermittently in synchronization with the PWM signal so as to charge the capacitor. The soft-start circuit outputs, as the soft-start voltage Vss, a voltage that occurs at the capacitor.

Abstract: The present invention provides methods for making shapeable composite materials or shaped articles from recycled materials comprising forming a crumb slurry by, in any order, increasing the particle size of a composition comprising white water waste from one or more emulsion or dispersion polymer and combining the white water waste polymer with one or more waste thermoset material, preferably, ground tire rubber (GTR), and, then processing the combined material wet or dry as a thermoplastic to form the composite material or article. Additionally, shaped articles and composite materials can be made from substantially all recycled waste materials, such as white water waste from acrylic or vinyl polymer emulsions and waste rubber vulcanizates. The composite materials can consist essentially of reshapeable materials, i.e. without crosslinking agents, thermosettable compositions or compatibilizers to provide reshapeable or recyclable articles.

Abstract: An LED driving circuit drives a display backlight LED string including multiple LEDs connected in series. A power supply supplies a driving voltage from an output terminal thereof to a first end of the LED string. A detection resistor is arranged between a second end of the LED string and a fixed voltage terminal. The LED driving circuit receives a pulse modulation signal having a duty ratio that corresponds to the luminance. In the on period, in which the PDIM signal is the first level, the LED driving circuit controls the power supply such that the voltage drop across the detection resistor approaches a predetermined target value. In the off period, in which the PDIM signal is the second level, the LED driving circuit stops the control operation for the power supply.

Abstract: A switching power supply device includes: a non-linear control type switching control unit that, in accordance with a result of a comparison between a feedback voltage and a reference voltage, performs on/off control of a switch element, and thereby generates an output voltage from an input voltage; a backflow current detection unit that, upon detecting a backflow current flowing to the switch element, forcibly switches off the switch element; and an on-time setting unit that sets an on-time of the switch element, in a case of the backflow current not being detected, in accordance with a duty of the switch element, and in a case of the backflow current being detected, in accordance with a switch voltage appearing at one end of the switch element or the output voltage.

Abstract: A capacitance type gyro sensor includes a semiconductor substrate, a first electrode integrally including a first base portion and first comb tooth portions and a second electrode integrally including a second base portion and second comb tooth portions, formed by processing the surface portion of the semiconductor substrate. The first electrode has first drive portions that extend from opposed portions opposed to the respective second comb tooth portions on the first base portion toward the respective second comb tooth portions. The second electrode has second drive portions formed on the tip end portions of the respective second comb tooth portions opposed to the respective first drive portions. The first drive portions and the second drive portions engage with each other at an interval like comb teeth.

Abstract: Provided is a semiconductor device that can be manufactured at low cost and that can reduce a reverse leak current, and a manufacturing method thereof. A semiconductor device has: a source region and a drain region having a body region therebetween; a source trench that reaches the body region, penetrating the source region; a body contact region formed at the bottom of the source trench; a source electrode embedded in the source trench; and a gate electrode that faces the body region. The semiconductor device also has: an n-type region for a diode; a diode trench formed reaching the n-type region for a diode; a p+ region for a diode that forms a pn junction with the n-type region for a diode at the bottom of the diode trench; and a schottky electrode that forms a schottky junction with the n-type region for a diode at side walls of the diode trench.

Abstract: A semiconductor power device of the present invention includes a first electrode and a second electrode, a breakdown voltage holding layer that is made of a semiconductor having a predetermined thickness and a predetermined impurity concentration, to which the first electrode and the second electrode are joined, and that has an active region in which carriers to generate electric conduction between the first electrode and the second electrode move, and an insulation film that is formed on the breakdown voltage holding layer and that has a high dielectric-constant portion having a higher dielectric constant than SiO2 at a part contiguous to the breakdown voltage holding layer.

Abstract: A semiconductor power module according to the present invention includes a base member, a semiconductor power device having a surface and a rear surface with the rear surface bonded to the base member, a metal block, having a surface and a rear surface with the rear surface bonded to the surface of the semiconductor power device, uprighted from the surface of the semiconductor power device in a direction separating from the base member and employed as a wiring member for the semiconductor power device, and an external terminal bonded to the surface of the metal block for supplying power to the semiconductor power device through the metal block.