Abstract: Systems, methods, and devices for communicating with a serial/parallel interface are described herein. In an aspect, a wireless device includes a transceiver configured to output a plurality of transmission paths, and an antenna configured to output a signal corresponding to at least one of the transmission paths. The wireless device further includes a wireless switching component including a radio-frequency switch configured to selectively connect the antenna to one of the transmission paths, a plurality of signal pins, a serial interface including a plurality of serial inputs electrically coupled to at least one pin of the plurality of signal pins, a parallel interface including a plurality of parallel inputs electrically coupled to at least one pin of the plurality of signal pins, a decoder, and a level shifter configured to control the radio-frequency switch, the at least one pin electrically coupled to both a serial input and a parallel input.

Abstract: A variable load power amplifier that improves the performance of a power amplifier that provides both envelope tracking (ET) and average power tracking (APT). The variable load power amplifier can include a plurality of amplifiers that are each selectively connectable into one of a plurality of parallel combinations, each of the plurality of parallel combinations characterized by a corresponding load line. The variable load power amplifier can also include a plurality of control elements arranged to selectively connect one or more of the plurality of amplifiers into one of the plurality of parallel combinations, each of the plurality of control elements having a respective input terminal provided to receive a respective control signal, each of the plurality of control elements responsive to the respective control signal.

Abstract: In an embodiment, an apparatus includes a first transmit path, a second transmit path, and a switch element. The first transmit path can provide a first radio frequency (RF) signal in accordance with a nominal specification. The second transmit path can provide a second RF signal in accordance with an intermittent specification, in which the first and second RF signals are within the same transmit band. The switch element can provide the first RF signal as a transmit mode output in a first state and provide the second RF signal as the transmit mode output in a second state.

Abstract: Disclosed are compositions, devices and methods related to thermal barrier coating materials having enhanced toughness. In some embodiments, a multiphase ceramic can include a first phase formed from a cubic and/or a tetragonally stabilized metal oxide, and a second phase formed from a magnetoplumbite-based aluminate that is chemically compatible with the first phase. Various example applications in which such materials can be utilized are disclosed.

Abstract: Matching network for broadband power amplifier. In some embodiments, a power amplifier can include an amplifying transistor having an input and an output, and a matching circuit coupled to the output of the amplifying transistor. The matching circuit can include a first capacitance, an inductance, and a second capacitance connected in series. The matching circuit can further include a third capacitance implemented in a shunt path from a node between the first capacitance and the inductance to a ground, and a fourth capacitance implemented in a shunt path from a node between the inductance and the second capacitance to the ground.

Abstract: A radio frequency (RF) power amplifier circuit includes an input and an output. A power amplifier transistor has a first terminal connected to the input, a second terminal connected to the output, and a third terminal defined by a degeneration inductance. A first capacitor is connected to the third terminal of the power amplifier transistor, along with a negative capacitance circuit connected in series with the first capacitor. The negative capacitance and the first capacitor define a series resonance at a predefined operating frequency band, which shunts the degeneration inductance of the third terminal.

Abstract: A radio-frequency (RF) module includes a driver transistor having a base, collector and emitter, an RF input port coupled to the base of the driver transistor, a cascode transistor having a base, collector and emitter, the emitter of the cascode transistor being coupled to the collector of the driver transistor, an RF output port coupled to the collector of the cascode transistor, and a coupling path connecting the base of the cascode transistor to the emitter of the cascode transistor, the coupling path including a capacitor.

Abstract: Systems, apparatuses and methods for reduced OFF capacitance in switching devices are disclosed. A transistor stack includes first and second doped regions serving as a source and drain, respectively of a transistor, an elongated gate structure including a first gate structure disposed between the first and second regions and serving as a gate of the transistor, a first set of electrical contact pads disposed on the first region, and a second set of electrical contact pads disposed on the second region, the second set of contact pads having an offset position with respect to the first set of contact pads in a longitudinal direction of the first and second regions.

Abstract: Multi-band device having multiple miniaturized single-band power amplifiers. In some embodiments, a power amplifier die can include a semiconductor substrate, and a plurality of power amplifiers (PAs) implemented on the semiconductor substrate. Each PA can be configured to drive approximately a characteristic load impedance of a downstream component along an individual frequency band signal path, such that each PA is sized smaller than a wide band PA configured to drive more than one of the frequency bands associated with the plurality of PAs. The downstream component can include an output filter.

Abstract: In an embodiment, an apparatus includes a packaging substrate and a die on the packaging substrate. The die includes an integrated passive device and a contact providing an electrical connection to the integrated passive device. A conductive trace of the packaging substrate is in an electrical path between the contact of the die and a ground potential. Such an integrated passive device and conductive trace can be included in a matching network configured to receive an amplified radio frequency signal from a power amplifier, for example. The packaging substrate can be, for example, a laminate substrate.

Abstract: Dielectric-filled surface-mounted waveguide devices and methods for coupling microwave energy. In some embodiments, a radio-frequency (RF) waveguide can include a dielectric block having a first edge that joins a mounting surface and a first adjacent surface. The RF waveguide can further include a conductive coating that substantially covers the dielectric block. The conductive coating can define a wrap-around opening that exposes the dielectric block along the first edge. The wrap-around opening can include a strip on the first adjacent surface along the first edge and a strip on the mounting surface along the first edge.

Abstract: Aspects of this disclosure relate to a radio frequency system that includes an envelope generator configured to generate an envelope signal corresponding to an envelope of a radio frequency signal and at least two radio frequency components coupled to the envelope generator. One of the radio frequency components is a radio frequency switch configured to pass the radio frequency signal. The radio frequency switch is configured to receive the envelope signal to cause intermodulation distortion associated with the radio frequency switch to be reduced.

Abstract: Radio-frequency (RF) devices are disclosed having transistor gate voltage compensation to provide improved switching performance. RF devices, such as switches, include a plurality of field-effect transistors (FETs) connected in series between first and second nodes, each FET having a gate. A compensation network including a coupling circuit couples the gates of each pair of neighboring FETs.

Abstract: Disclosed are circuits and methods for increasing an output frequency of an inductance-capacitance (LC) oscillator. In some embodiments, the LC oscillator can be implemented as a voltage-controlled oscillator (VCO) having differential outputs. When the VCO is implemented on a die, wirebond connections from the outputs to a ground results in an effective inductance that impacts a maximum frequency associated with the VCO. An electrical connection such as a wirebond between the differential outputs yields a reduction in the effective inductance thereby increasing the maximum frequency. In some embodiments, the wirebond between the differential outputs can be configured so that its contribution to mutual inductance is reduced or substantially nil.

Abstract: Disclosed are systems, devices, and methodologies to reduce harmonics in a radio frequency output signal. A power amplifier system comprises a power amplifier and a tunable output matching network electrically connected between the output of the power amplifier and an output of the tunable output matching network. The tunable output matching network reduces second-order harmonics in an amplified radio frequency signal when the power amplifier operates in a low frequency mode. The tunable output matching network includes traps such as a series inductor and a first capacitor in series with a first switch, a second capacitor in series with a second switch, and a third capacitor in series with a third switch, where the traps are tuned to selected harmonic frequencies when the power amplifier operates in the low frequency band of the operating band of frequencies.

Abstract: Aspects of this disclosure relate tuning an impedance presented to a common port of a multi-throw switch. The impedance can be tuned based on an impedance associated with a throw of the multi-throw switch that is activated. This can, for example, provide impedance matching for a duplexer port coupled to a throw of the multi-throw switch that is activated. According to embodiments of this disclosure, a shunt inductor in parallel with a tunable capacitance circuit can tune the impedance presented to the common port of the multi-throw switch. The shunt inductor and the tunable capacitance circuit can be coupled to a node in a signal path between an antenna switch and an antenna port in some embodiments.

Abstract: Aspects of this disclosure relate to detecting power associated with an individual carrier of a carrier aggregated signal. In an embodiment, a carrier aggregation system includes radio frequency (RF) sources, a transmission output, and a directional coupler. The RF sources, such as power amplifiers, can each be associated with a separate carrier. The transmission output can provide a carrier aggregated signal that includes an aggregation of the separate carriers associated with the RF sources. The directional coupler can provide an indication of RF power of one of the separate carriers.

Abstract: Systems, apparatuses and methods are disclosed providing signal conditioning circuits configured to condition RF signals, and an interface in communication with the signal-conditioning circuits, the interface including M inputs and N outputs, each of the quantities M and N greater than 1. The interface is configured so that each of at least two of the M inputs is coupled to a separate output through a separate switch.

Abstract: Circuits and methods related to radio-frequency (RF) power couplers. In some embodiments, an RF circuit can include a first circuit having a frequency response that includes a feature within a selected frequency range, and a second circuit coupled to the first circuit such that the feature of the frequency response is at least in part due to the coupling. The RF circuit can further include an adjustment circuit configured to move the feature away from the selected frequency range. In some embodiments, such an RF circuit can be implemented in a packaged module which in turn can be included in a wireless device.

Abstract: Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.