Abstract: An electronic circuit including: a first branch, placed between two terminals of application of a D.C. voltage, including a series connection of a first constant current source, of a first diode-connected N-channel MOS transistor, of a first diode-connected P-channel MOS transistor, and of a second constant current source; a second branch, parallel to the first branch, comprising a series connection of a second N-channel MOS transistor connected as a current mirror on the first N-channel MOS transistor and of a second P-channel MOS transistor connected as a current mirror on the first P-channel transistor; and an input terminal connected between the first N-channel and P-channel transistors and an output terminal connected between the second N-channel and P-channel transistors.

Abstract: This process for manufacturing a Schottky-barrier MOS transistor on a fully depleted semiconductor film may include depositing a first layer of a first sacrificial material on an active zone of the substrate, forming a silicon layer on top of the first layer of sacrificial material, forming a gate region on top of the silicon layer with interposition of a gate oxide layer, and selective etching of the sacrificial material so as to form a tunnel beneath the gate region. The tunnel is filled with a dielectric second sacrificial material. A controlled lateral etching of the second sacrificial material is performed so as to keep behind a zone of dielectric material beneath the gate region. Silicidation is performed at the location of the source region and drain region and at the location of the etched zone.

Abstract: System for testing a multitasking computation architecture, comprising a set of processors linked by data communication channels, comprising a generating stage for generating sequences of test instructions based on characteristics of said processors comprising programming rules for the computation processors, characterized in that it comprises a control stage for the stage for generating sequences based on data representative of the data communication channels.

Abstract: A planar transistor device includes two independent gates (a first and second gates) along with a semiconductor channel lying between the gates. The semiconductor channel is formed of a first material. The channel includes opposed ends comprising dielectric zone with a channel region positioned between the gates. The dielectric zones comprises an oxide of the first material.

Abstract: An integrated circuit includes a substrate and at least one active region. A transistor produced in the active region separated from the substrate. This transistor includes a source or drain first region and a drain or source second region which are connected by a channel. A gate structure is position on top of said channel and operates to control the channel. The gate structure is formed in a trench whose sidewalls have a shape which converges (narrows) in the width dimension towards the substrate. A capacitor is also formed having a first electrode, a second electrode and a dielectric layer between the electrodes. This capacitor is also formed in a trench. An electrode line is connected to the first electrode of the capacitor. The second electrode of the capacitor is formed in a layer shared in common with at least part of the drain or source second region of the transistor. A bit line is located beneath the gate structure. The integrated circuit may, for example, be a DRAM memory cell.

Abstract: An anti-fuse cell includes a standard MOS transistor of an integrated circuit, with source and drain regions covered with a metal silicide layer and at least one track of a resistive layer at least partially surrounding the MOS transistor, and adapted to pass a heating current such that the metal of said metal silicide diffuses across drain and/or source junctions.

Abstract: An image sensor having a number of pixel zones delimited by isolation trenches, each pixel zone including a photodiode; a transfer gate associated with each of the pixel zones and arranged to transfer charge from the photodiode to a sensing node; and a read circuit for reading a voltage at one of the sensing nodes, the read circuitry including a number of transistors of which at least one is positioned at least partially over a pixel zone of the pixel zones.

Abstract: An image sensor including a plurality of pixels each including a charge collection region including an N-type region bounded by P-type regions and having an overlying P-type layer; and an insulated gate electrode positioned over the P-type layer and arranged to receive a gate voltage for conveying charges stored in the charge collection region through the P-type layer.

Abstract: A semiconductor device includes a semiconductive channel region and a gate region. The gate region has at least one buried part extending under the channel region. The buried part of the gate region is formed by forming a cavity under the channel region. That cavity is at least partial filled with silicon and a metal. An annealing step is performed so as to form a silicide of said metal in the cavity. The result is a totally silicided buried gate for the semiconductor device.

Abstract: A hybrid substrate comprises first and second active areas made from semiconductor materials laterally offset from one another and separated by an isolation area. The main surfaces of the isolation area and of the first active area form a plane. The hybrid substrate is obtained from a source substrate successively comprising layers made from a first and second semiconductor materials separated by an isolation layer. A single etching mask is used to pattern the isolation area, first active area and second active area. The main surface of the first active area is released thereby forming voids in the source substrate. The etching mask is eliminated above the first active area. A first isolation material is deposited, planarized and etched until the main surface of the first active area is released.

Abstract: A clock circuit for an integrated circuit having at least one MOS transistor. The clock circuit includes a first circuit for inducing a degradation of the transistor as a function of time and means for measuring a parameter of the transistor that reflects a lowering of the performance of the transistor resulting from the degradation. This also includes a method of generating a counting value of clock circuit by inducing continuous degradation of an MOS transistor. The method could include measuring a parameter of transistor, reflecting a lowering of performance of transistor resulting from said degradation. The method could also include measuring the temperature and calculating the counting value of the clock from the value of said parameter, from the measured temperature and from a law of variation of the parameter as a function of time and temperature.

Abstract: A process for producing a microelectronic device includes producing a first semiconductor substrate which includes a first layer and a second layer present between a first side and a second side of the substrate. First electronic components and an interconnecting part are produced on and above the second side. The substrate is then thinned by a first selective etch applied from the first side and stopping on the first layer followed by a second selective etch stopping on the second layer. A second substrate is attached over the interconnecting part. The electronic components may comprise optoelectronic devices which are illuminated through the second layer.

Abstract: An integrated microelectronic device is formed from a substrate having a first side and a second side and including a doped active zone (2) in the first side of the substrate. A circuit component is situated in the doped active zone. A through silicon via extends between the second side and the first side, the via being electrically isolated from the substrate by an insulating layer. A buffer zone is situated between the insulating layer and the doped active zone. This buffer zone is positioned under a shallow trench isolation zone provided around the doped active zone. The buffer zone functions to reduce the electrical coupling between the through silicon via and the doped active zone.

Abstract: A finFET field effect transistor is produced by the formation of an electrical junction between the thin fin portion of semiconductor material which forms the channel of the transistor and the circuit substrate. Doping particles are implanted in the substrate through a mask which is then subsequently used to form the thin fin portion of the channel. The channel of the finFET transistor is thus electrically insulated from the circuit substrate in the same manner as in MOS integrated circuits realized from bulk silicon substrates.

Abstract: A process for forming a wire portion in an integrated electronic circuit includes epitaxially growing the wire portion on a side surface of a seed layer portion (11, 12). Cross-sectional dimensions of the wire portion correspond to a thickness of the seed layer portion and to a duration of the growing step. The seed layer portion is then selectively removed while the wire portion is retained fixedly on the circuit. Afterwards, heating of the circuit can cause the wire portion becoming rounded in cross-section. The wire portion obtained may be about 10 nanometers in diameter. It may be used for forming a channel of a MOS transistor devoid of short channel effect.

Abstract: A method for manufacturing a suspended membrane in a single-crystal semiconductor substrate, including the steps of: forming in the substrate an insulating ring delimiting an active area, removing material from the active area, successively forming in the active area a first and a second layers, the second layer being a single-crystal semiconductor layer, etching a portion of the internal periphery of said ring down to a depth greater than the thickness of the second layer, removing the first layer so that the second layer formed a suspended membrane anchored in the insulating ring.

Abstract: A memory includes memory cells arranged as a matrix of rows and columns between word lines and bit lines, and a set of differential read/write amplifiers for reading and writing of the memory cells and for communicating with local bit lines common to at least some of the memory cells. A read/write circuit is common to the set of differential read/write amplifiers, and a set of selection gateways selectively transfer data between the common read/write circuit and a selected differential read/write amplifier.

Abstract: A thermoelectric generator including a membrane maintained by lateral ends and capable of taking a first shape when its temperature reaches a first threshold and a second shape when its temperature reaches a second threshold greater than the first threshold; at least one electrically conductive element attached to with the membrane and connecting the lateral ends of the membrane; and circuitry capable of generating, at the level of the membrane, a magnetic field orthogonal to the membrane displacement direction, the lateral ends of the membrane being connected to output terminals of the generator.

Abstract: A method for manufacturing a device including a field of micrometric tips, including forming a polycrystalline layer on a support; performing an anisotropic plasma etching of all or part of the polycrystalline layer by using a gas mixture including chlorine and helium, whereby tips are formed at the surface of the polycrystalline layer.

Abstract: A single-crystal layer of a first semiconductor material including single-crystal nanostructures of a second semiconductor material, the nanostructures being distributed in a regular crystallographic network with a centered tetragonal prism.