Abstract: A phase change memory element has a memory region, a first electrode and a second electrode. The memory region is arranged between the first and the second electrodes and has a bulk zone and an active zone. The memory region is made of a germanium, antimony and tellurium based alloy, wherein germanium is in a higher percentage than antimony and tellurium in the bulk zone of the memory region. The active zone is configured to switch between a first stable state associated with a first memory logic level and a second stable state associated with a second memory logic level. The active zone has, in the first stable state, a uniform, amorphous structure and, in the second stable state, a differential polycrystalline structure including a first portion, having a first stoichiometry, and a second portion, having a second stoichiometry different from the first stoichiometry.

Abstract: A measurement is made of jitter present in a jittery clock signal. A digital sinusoid generator circuit clocked by the jittery clock signal generates a pulse density modulation (PDM) signal corresponding to a sinusoid waveform. The PDM signal is converted by a sigma-delta modulator circuit to an oscillating frequency signal with an output of digital values digital values indicative of oscillating frequency signal phase. Responsive to the jittery clock signal, the digital values indicative of oscillating frequency signal phase are sampled. A digital differentiator circuit determines a digital difference between consecutive samples of the digital values indicative of oscillating frequency signal phase. The digital difference is processed by a digital signal processing circuit to generate a frequency spectrum and determine from signal-to-noise ratio a measurement of jitter in the jittery clock signal.

Abstract: An embodiment device comprises a first processing unit configured to process an initial data line and deliver a first processed data line, a first delay unit coupled to the output of the first processing unit and configured to deliver a delayed first processed data line delayed by a first delay, a second delay unit configured to deliver the delayed initial data line delayed by a second delay, a second processing unit coupled to the output of the second delay unit and configured to process the delayed initial data line and deliver a delayed second processed data line, and a comparison unit configured to compare the contents of the delayed first and second processed data lines and deliver a non-authentication signal if the contents are not identical, the first and second delays being equal to a variable value.

Abstract: According to principles as discussed herein, an EEPROM cell is provided and then, after testing the code, using the exact same architecture, transistors, memory cells, and layout, the EEPROM cell is converted to a read-only memory (“ROM”) cell. This conversion is done on the very same integrated circuit die using the same layout, design, and timing with only a single change in an upper level mask in the memory array. In one embodiment, the mask change is the via mask connecting metal 1 to poly. This allows the flexibility to store the programming code as non-volatile memory code, and then after it has been tested, at time selected by the customer, some or all of that code from a code that can be written to a read-only code that is stored in a ROM cell that is composed the same transistors and having the same layout.

Abstract: A microelectromechanical system (MEMS) gyroscope includes a driving mass and a driving circuit that operates to drive the driving mass in a mechanical oscillation at a resonant drive frequency. An oscillator generates a system clock that is independent of and asynchronous to the resonant drive frequency. A clock generator circuit outputs a first clock and a second clock that are derived from the system clock. The drive loop of the driving circuit including an analog-to-digital converter (ADC) circuit that is clocked by the first clock and a digital signal processing (DSP) circuit that is clocked by the second clock.

Abstract: A communication network comprises a plurality of electronic devices coupled via a plurality of communication links. The communication links comprise links over a first physical medium and links over a second physical medium. A method of operating the network comprises issuing, at an originator device, a path request message directed towards a destination device, transmitting the path request message from the originator device to the destination device through a first set of intermediate devices via a forward sequence of links, issuing, at the destination device, a path reply message directed towards the originator device, and transmitting the path reply message from the destination device to the originator device through a second set of intermediate devices via a reverse sequence of links.

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

Abstract: A protection device includes a first inductive element connecting first and second terminals and a second inductive element connecting third and fourth terminals. A first component includes a first avalanche diode connected in parallel with a first diode string, anodes of the first avalanche diode and a last diode in the string being connected to ground, cathodes of the first avalanche diode and a first diode in the string being connected, and a tap of the first diode string being connected to the first terminal. A second protection component includes a second avalanche diode connected in parallel with a second diode string, anodes of the second avalanche diode and a last diode in the string being connected to ground, cathodes of the second avalanche diode and a first diode in the string being connected, and a tap of the second diode string being connected to the third terminal.

Abstract: In an embodiment a method for dynamic power control of a power level transmitted by an antenna of a contactless reader is disclosed. The method may include supplying a power to the antenna and performing at least one power adjusting cycle for adjusting a power level during a contactless transaction with a transponder, each power adjusting cycle including modifying the power supplied to the antenna to a predetermined level of power, performing a first measuring of a loading effect on the antenna at the predetermined level of power and adjusting the power level according to the measured loading effect.

Abstract: A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.

Abstract: Disclosed herein is a method including sinking current from a pair of input transistors of a differential amplifier while sourcing more current to the pair of input transistors than is sunk. The method further includes generating a pair of input differential signals using a pair of input voltage regulators, and amplifying a difference between the pair of input differential signals to produce a pair of differential output voltages, using the differential amplifier. The method also includes amplifying the pair of differential output voltages using at least one voltage gain amplifier, and generating control signals for current sources that source the current to the pair of input transistors of the differential amplifier, from the pair of differential output voltages after at least amplification.

Abstract: An electronic chip supports an optical device and electric connection zones. An insulating coating coats the electronic chip, covers the electric connection zones and exposes the optical device. An optical plugging element is at least partly fastened onto a first face of the insulating coating and is optically coupled to the optical device. Vias pass through the insulating coating from its first face to a second face opposite to the first face. Inner walls of the vias support electrically conductive paths connected to the electric connection zones of the electronic chip by electrically conductive tracks arranged on the first face of the insulating coating. The electrically conductive paths of the vias further have ends protruding onto the second face of the insulating coating.

Abstract: In an embodiment, a circuit includes N sensing channels. Each channel includes a first main sensing node and a second redundancy sensing node paired therewith. N analog-to-digital converters (ADCs) are coupled to the first sensing nodes, with digital processing circuits coupled to the N ADCs. A pair of multiplexers are coupled to the second sensing nodes and to the N ADCs with a further ADC coupled to the output of the second multiplexer. An error checking circuit is coupled to the outputs of the second multiplexer and the further ADC to compare, at each time window in a sequence of N time windows, a first digital value and a second digital value resulting from conversion to digital of: an analog sensing signal at one of the first sensing nodes, and an analog sensing signal at the second sensing node paired with the selected one of the first sensing nodes.

Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

Abstract: The present disclosure relates to a method comprising receiving edges conveyed by a serial bus and separated by multiples of a same duration, determining a measurement value of a ratio between a cycle time of a clock and the duration, and sending bits on the serial bus using the measurement value.

Abstract: A wireless power circuit operable in transceiver mode and in Q-factor measurement mode includes a bridge rectifier having first and second inputs coupled to first and second terminals of a coil, and an output coupled to a rectified node. An excitation circuit coupled to the first terminal, in Q-factor measurement mode, drives the coil with a pulsed signal. A protection circuit couples the first terminal to a first node when in Q-factor measurement mode and decouples the first terminal when in transceiver mode. A controller causes the bridge rectifier to short the first and second terminals to ground during Q-factor measurement mode. A sensing circuit amplifies voltage at the first node to produce an output voltage, and in response to the voltage at the first node rising to cross a rising threshold voltage, digitizes the output voltage. The digitized output voltage is used in calculating a Q-factor of the coil.

Abstract: A micro-electro-mechanical device is formed by a fixed structure having a cavity. A tiltable structure is elastically suspended over the cavity and has a main extension in a tiltable plane and is rotatable about a rotation axis parallel to the tiltable plane. A piezoelectric actuation structure includes first and second driving arms carrying respective piezoelectric material regions and extending on opposite sides of the rotation axis. The first and the second driving arms are rigidly coupled to the fixed structure and are elastically coupled to the tiltable structure. During operation, a stop structure limits movements of the tiltable structure with respect to the actuation structure along a planar direction perpendicular to the rotation axis. The stop structure has a first planar stop element formed between the first driving arm and the tiltable structure and a second planar stop element formed between the second driving arm and the tiltable structure.

Abstract: In an embodiment, a circuit for tripling frequency is configured to receive an input voltage (Vin) having a sinusoidal shape and a base frequency. The circuit has a first and a second transistor pair that are cross-coupled, and a trans-characteristics f(Vin) approximating a polynomial nominal trans-characteristic given by f ? ( V i ? n ) = ( 3 A ? V i ? n - 4 A 3 ? V i ? n 3 ) ? g m where A represents an amplitude of the input voltage and gm is a transconductance of transistors of the first and second transistor pairs.

Abstract: A microelectromechanical device includes a fixed structure defining a cavity with a tiltable structure that is elastically suspended in the cavity. A piezoelectrically driven actuation structure, interposed between the tiltable structure and the fixed structure, is biased for causing rotation of the tiltable structure about a first rotation axis belonging to a horizontal plane in which the tiltable structure rests. The actuation structure includes a pair of driving arms carry respective regions of piezoelectric material and are elastically coupled to the tiltable structure on opposite sides of the first rotation axis through respective elastic decoupling elements. The elastic decoupling elements exhibit stiffness in regard to movements out of the horizontal plane and compliance to torsion about the first rotation axis.

Abstract: A first multiplier multiplies a first input with a first coefficient and a first adder sums an output of the first multiplier and a second input to generate a first output. A second multiplier multiplies a third input with a second coefficient, a third multiplier multiplies a fourth input with a third coefficient, and a second adder sums outputs of the second and third multipliers to generate a second output. The second and third inputs are derived from the first output and the first and fourth inputs are derived from the second output. The first and second outputs generate digital values for first and second digital sinusoids, respectively.