Abstract: The thin film transistor formed of polycrystalline silicon is positioned adjacent a heat reaction chamber. The gate electrode for the transistor is formed within a silicon substrate and a gate dielectric is positioned over the gate electrode. A pass transistor is coupled to the gate electrode, the pass transistor having a source/drain region in the same semiconductor substrate and positioned adjacent to the gate electrode of the thin film heating transistor. When the pass transistor is enabled, a voltage is applied to the gate electrode which causes the current to flow from the drain to the source of the thin film transistor. The current flow passes through a highly resistive region which generates heat that is transmitted to the heat reaction chamber.

Abstract: A processing system includes a plurality of processing resources capable of executing a plurality of objects. The objects include a client object and one or more server objects. The client object is capable of requesting a service provided by at least one of the one or more server objects. The processing system also includes at least one hardware engine capable of receiving a request for the service from the processing resource executing the client object, formatting one or more messages associated with the requested service, and communicating the one or more messages to the processing resource executing at least one of the one or more server objects that provides the requested service.

Abstract: A processing system includes a plurality of processing resources capable of executing a plurality of objects. The objects include a client object and one or more server objects. The client object is capable of requesting a service provided by at least one of the one or more server objects. The processing system also includes a hardware object request broker capable of receiving one or more messages from the processing resource executing the client object and communicating the one or more messages to the processing resource executing at least one of the one or more server objects that provides the requested service. The one or more messages are capable of invoking the requested service.

Abstract: A circuit and method are disclosed for detecting activation of a switch, such as a mechanical switch, having a first terminal coupled to two or more voltage sources, with each voltage source providing a distinct voltage level representing a logic high level. The circuit includes first circuitry, having an output coupled to the switch for initially placing a first voltage across the switch representative of a logic low level. The circuit further includes second circuitry having an input coupled to the switch for sensing a voltage differential appearing across the switch and an output for indicating whether the voltage appearing across the switch is at any voltage representative of the logic high level, the second circuitry being controlled to selectively eliminate static current drawn by the circuit based upon the value of the output of the second circuitry.

Abstract: A system and method is disclosed for increasing the strength of a bond made by a small diameter wire in ball bonding. In one embodiment of the invention a structure for receiving a ball bond comprises substrate material that has portions that form a substrate cavity and a wire bond pad that covers and fills the substrate cavity. The wire bond pad also has portions that form a wire bond cavity for receiving the ball bond. The ball is wirebonded to the sides and bottom of the wire bond cavity. The sides of the wire bond cavity provide additional strength to the bond to resist shear and tensile forces that may act on the wire.

Abstract: An integrated circuit burn-in test system includes an integrated circuit and a tester. The integrated circuit includes operating circuitry, a heater for heating the operating circuitry, and burn-in test circuitry for testing the operating circuitry while being heated. A package surrounds the operating circuitry, the heater and the burn-in test circuitry. The burn-in test circuitry causes the operating circuitry to operate and generate data related thereto. The tester receives data from the burn-in test circuitry. The heater may be configured within the package to heat at least one predetermined portion of the operating circuitry.

Abstract: Each pixel of an array has a subarray of upper capacitor plates located just beneath a sensing surface. The upper plates may be square and laid out in an equal number of rows and columns. Each upper plate can be selectively electrically connected to one of two lower capacitor plates according to the state of a memory cell, such as an SRAM memory cell, associated with each upper plate. The upper plate/lower plate interconnections can be configured in predetermined different patterns of the upper plates in successive sensing operations to improve the accuracy of capacitively sensing of an object, such as a human fingerprint, applied to the sensing surface above the pixel array.

Abstract: A method and circuit are disclosed for enabling an oscillator circuit to oscillate a predetermined period of time following completion of a power-up operation. The circuit may include a counter having a control for receiving a control signal from a system power-on-reset circuit, and a clock input. A ring oscillator has an output coupled to the clock input of the counter.

Abstract: A circuit and method are disclosed for detecting activation of a switch, such as a mechanical switch. The circuit may include a first circuit for temporarily driving the second terminal of the switch to a second logic level. A second circuit, coupled to the switch, senses a voltage level of the second terminal of the switch and generates an output signal representative of the voltage sensed. A sequential logic circuit is responsive to the output signal of the second circuit so as to maintain a logic value representative of the switch having been closed.

Abstract: A flat filter layer is received between upper and lower mold portions of a mold for packaging an integrated circuit sensor device, held by the mold over and in contact with the integrated circuit's sensing surface, in light compression between the sensing surface and a mold surface. The filter layer includes slots allowing passage of injected encapsulating material to cover the integrated circuit die, with overlap portions embedded in the encapsulating material, while preventing such encapsulating material from flowing onto the sensing surface. The filter layer may be, for example, a liquid and/or light filter, and may include a protective or supportive backing. The filter is thus affixed to the packaged integrated circuit sensor device, while mold residue is reduced and mold life extended.

Abstract: A ball or land grid array plastic substrate portion is formed with a hole therethrough in the region on which the integrated circuit die is to be formed, with a copper heat slug inserted within the opening having a bottom surface substantially aligned with the bottom surface of the plastic portion to allow molding tooling for conventional ball or land grid array packages to be employed. The integrated circuit die is mounted on the heat slug, which has a solderable bottom surface and is directly soldered to the PCB. An additional copper heat spreader region is formed on an upper surface of the plastic portion.

Abstract: Methods and structures for ensuring the highly linear discharge of a capacitor used for slew rate control of a power driving stage from a maximum voltage to a minimum supply voltage, such as ground. A voltage ramp generator uses a single cascoded current source to achieve the linear ramp-down.

Abstract: A released beam structure fabricated in trench and manufacturing method thereof are provided herein. One embodiment of a released beam structure according to the present invention comprises a semiconductor substrate, a trench, a first conducting layer, and a beam. The trench extends into the semiconductor substrate and has walls. The first conducting layer is positioned over the walls of the trench at selected locations. The beam is positioned with the trench and is connected at a first portion thereof to the semiconductor substrate and movable at a second portion thereof. The second portion of the beam is spaced from the walls of the trench by a selected distance. Therefore, the second portion of the beam is free to move in a plane that is perpendicular or parallel to the surface of the substrate, and could be deflected to electrically contact with the walls of the trench in response to a predetermined acceleration force or a predetermined temperature variation applied on the beam structure.

Abstract: A modulo mi adder and a modulo mi,j scaling unit for use with an RNS. The adder includes a modulo mi barrel shifter, and a dynamic storage unit coupled to the barrel shifter to store the output of the barrel shifter. In a preferred embodiment, the dynamic storage unit includes one dynamic latch for each output line of the barrel shifter, with each of the dynamic latches including a clocked inverter in cascade with an inverter. One modulo mi,j scaling unit includes a modified modulo mi barrel shifter that performs both residue conversion and an arithmetic operation. The residue conversion is performed without using combinational logic. In one preferred embodiment, the modified barrel shifter performs the residue conversion though mi-mj additional columns that replicate normal columns for all modulo mi input lines that are congruent modulo mj.

Abstract: A system and method is disclosed for efficiently executing single program multiple data (SPMD) programs in a microprocessor. A micro single instruction multiple data (SIMD) unit is located within the microprocessor. A job buffer that is coupled to the micro SIMD unit dynamically allocates tasks to the micro SIMD unit. The SPMD programs each comprise a plurality of input data streams having moderate diversification of control flows. The system executes each SPMD program once for each input data stream of the plurality of input data streams.

Abstract: The contact opening through an insulating layer is formed having a straight sidewall portion and a bowl shaped sidewall portion. The bowl shaped sidewall portion is near the top of the insulation layer to provide an enlarged diameter of the contact opening at the top relative to the bottom. A conductive material is then formed in the contact opening in electrical contact with a lower conductive layer. The conductive material forms a plug having an enlarged head, such as a nail head or a flat heat screw shape. The enlarged head protects the silicon and a barrier layer, if present, within the contact from being etched by any subsequent anisotropic etches. Thus, when an electrical interconnection layer such as aluminum is formed overlying the contact plug, the plug acts as an etch stop to prevent etching of a barrier layer of the barrier layer within the contact opening.

Abstract: An apparatus and method are provided to accelerate error diffusion for color halftoning for embedded applications. High performance is achieved by utilizing functional parallelism within the halftoning error diffusion process, including exploiting data parallelism in different color planes, reducing the number of memory accesses to the error buffer, accelerating the computation by using a parallel instruction set, and improving the throughput of the system by implementing pipelined architecture. A halftoning coprocessor architecture can implement the foregoing. The architecture can be optimized for high performance, low complexity and small footprint. The coprocessor can be incorporated into embedded systems to accelerate the performance of error diffusion halftoning therein.

Abstract: A circuit and method are disclosed for controlling current dissipated by an oscillator circuit. The circuit includes a current source adapted to source current to or sink current from the oscillator circuit. A control circuit is adapted to count a predetermined period of time following the occurrence of an event, such as completion of a power-up operation. An output of the control circuit, having a value indicative of whether the predetermined period of time has elapsed, is coupled to a control input of the current source. In this way, the output of the control circuit sets a current level sourced to or sunk from the oscillator circuit by the current source.

Abstract: An arithmetic circuit for use with an RNS is provided. The arithmetic circuit includes an arithmetic core, test circuitry, and logic circuitry. The arithmetic core performs an RNS arithmetic operation, and the test circuitry verifies proper circuit delay by inducing oscillation at the output of the arithmetic core during testing. The logic circuitry produces a pass/fail signal based on whether the oscillation frequency of the arithmetic core is at least equal to a minimum threshold value. In one preferred embodiment, the logic circuitry includes a counter that counts oscillations of the output of the arithmetic core during testing, and a comparator that compares the output of the counter after a predetermined test period with the minimum threshold value. Also provided is a method for testing the propagation delay of an RNS arithmetic circuit having an arithmetic core.

Abstract: A method and circuit buffer for temporarily holding packets of information. The buffer may include a first memory and a second memory for holding the packets of information. The first memory may be a read-once memory in which data stored in the first memory is destroyed upon being read therefrom the first time. The second memory may be a memory in which stored data therein is not destroyed following the data being read from the second memory the first time. The buffer includes at least one queue. The head-of-line packet of the at least one queue is stored in the second memory. Incoming fanout splitting packets are stored in the second memory and other incoming packets are initially stored in the first memory.