Abstract: A voltage regulator for producing an output voltage that selectively tracks a logic voltage or a reference voltage and method of operating the voltage regulator. The voltage regulator has a diode OR with a logic and reference transistors. The logic voltage is scaled to be close in value to the reference voltage, if the two are not close in value. When the scaled logic voltage is larger than the reference voltage the logic transistor is on, turning off the reference transistor and passing the logic voltage to the output of the diode OR. When the scaled logic voltage is smaller than the reference voltage the logic transistor is off and the reference transistor is on, passing the reference voltage to the output of the diode OR. The voltage at the output of the diode OR is then compared in a comparator with the voltage at the output of the voltage regulator, which is scaled by the same factor as the logic voltage.

Abstract: An integrated circuit and method are provided for sensing activity such as temperature variations in a surrounding environment. The integrated released beam sensor preferably includes a switch detecting circuit region and a sensor switching region connected to the switch detecting circuit region. The sensor switching region preferably includes a fixed contact layer, a sacrificial layer on the fixed contact layer, and a floating contact on the sacrificial layer and having portions thereof overlying the fixed contact layer in spaced relation therefrom in an open switch position and extending lengthwise generally transverse to a predetermined direction. The floating contact preferably includes at least two layers of material. Each of the at least two layers have a different thermal expansion coefficient so that the floating contact displaces in the predetermined direction responsive to a predetermined temperature variation so as to contact the fixed contact layer and thereby form a closed switch position.

Abstract: A special rail is provided along each edge of an integrated circuit chip with bias circuits connected to the ends of each special rail. The bias circuits charge the special rail to the V.sub.DD voltage level during normal operation, and clamp the special rail to the V.sub.SS rail upon the occurrence of an overvoltage event. Input bonding pads are provided along each edge of the chip and are connected through diodes to the special rail so that 5 volt signals applied to the input bonding pads do not cause damage to the device when operated from a 3.3 volt supply. A signal line of extended length is provided between each input bonding pad and its receiver circuit and includes folded portions for adding to the length of the signal line to form a high frequency inductor to protect the receiver circuit at the onset of an overvoltage event before clamping becomes effective.

Abstract: According to the present invention, clock control logic circuitry of a clocked memory device using precharged data path techniques generates a self-timed pulse. The self-timed pulse is representative of a pulsed path active strobe or a reset strobe of the clocked memory device. The clock control logic circuitry of the present invention is characterized as having at least a first delay timing chain, a second delay timing chain, and means for selectively changing the width of a self-timed pulse generated by the clock control logic circuitry. Selectively changing the width of the self-timed pulse is accomplished by selectively adding the delay of the first delay timing chain to the delay of the second delay timing chain during a special mode of operation of the clocked memory device.

Abstract: A DC-to-DC converter includes an error amplifier; a ramp generator for generating a ramp signal at the first input of the error amplifier independent of the output of the error amplifier and so that the output of the error amplifier ramps up at a relatively slow rate to avoid overshoot of the desired output voltage of the converter during the start-up phase of the converter; and a ramp disable circuit for disabling the ramp signal upon reaching a value corresponding to the normal operating phase of the converter. The DC-to-DC converter preferably includes at least one power switch and pulse width modulation (PWM) control circuit cooperating with the power switch to provide a desired output voltage of the converter. The ramp generator in one embodiment comprises a current source and an external capacitor connected thereto. In yet another embodiment, the ramp generator may be provided by a staircase ramp generator comprising an amplifier and an integrating capacitor connected thereto.

Abstract: A method is provided for forming an improved landing pad of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A first opening is formed through a first dielectric layer to expose a portion of a diffused region. A landing pad is formed over the first dielectric layer and in the opening. The landing pad preferably comprises a doped polysilicon layer disposed in the first opening and over a portion of the first dielectric layer. The landing pad will provide for smaller geometries and meet stringent design rules such as that for contact space to gate. A second dielectric layer having an opening therethrough is formed over the landing pad having an opening therethrough exposing a portion of the landing pad. A conductive contact, such as aluminum, is formed in the contact opening. The conductive contact will electrically connect with the diffused region through the landing pad.

Abstract: A method is provided for forming an improved landing pad of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A first opening is formed through a first dielectric layer to expose a portion of a diffused region. A dual polysilicon landing pad is formed in the first opening and on a portion of the first dielectric layer adjacent the first opening. The dual landing pad is preferably formed from two polysilicon landing pads with an oxide formed in between a portion of the two polysilicon layers and over the first polysilicon layer. This landing pad will enhance the planarization of the wafer at this stage of the manufacturing and tolerate misalignment of subsequently formed metal contacts without invading design rules.

Abstract: An integrated circuit wherein a planarization step has been performed before the primary metal deposition step, but after deposition of the adhesion and barrier layers. Thus the adhesion and barrier layers are present on the sidewalls of contact holes, but do not underlie the whole extent of the primary metallization.

Abstract: A circuit for producing multiple pulse width modulated outputs. The circuit includes a logic device for each pulse width modulated output. Each of the logic devices includes a first input, a second input, and a clock input, and each of logic device produces a logical high output in response to a logical high at its first input in coincidence with a clock signal at its clock input. The logical high output of the logic device remains high until a logical high is applied at its second input in coincidence with a clock signal at the clock input, whereupon the logic device produces a logical low output. The logical low output of the logic device remains low until a logical high is again applied at its first input in coincidence with a clock signal at the clock input. The circuit includes programmable circuitry for selectively applying logical high and low signals to the first and second inputs of the logic devices.

Abstract: An integrated circuit device such as an SRAM operating in a battery backup mode, or operating in a quiescent mode when deselected in the operation of a portable electronic device, includes a power dissipation control circuit that reduces the voltage on an internal power supply node so that the memory array is powered at a minimum level sufficient to retain the data stored therein intact.

Abstract: A signal driver receives an input signal and an enable signal, and generates an output signal from the input signal when the enable signal has an active state. When the enable signal has an inactive state, the signal driver draws substantially zero supply current regardless of the level of the input signal. The enable signal may be the sense-amplifier enable signal. The signal driver may also include an input circuit that receives the input signal and generates an intermediate signal from the input signal when the enable signal has the first state. An output circuit is coupled to the input circuit, receives the intermediate signal, and generates the output signal from the intermediate signal. A switch circuit is coupled to the input circuit, receives the enable signal, and cuts off substantially all supply current to the input circuit when the enable signal has the second state.

Abstract: A high performance CMOS process using grown field oxide for active area isolation takes advantage of process steps used in LDD transistor fabrication to reduce the chip space occupied by the field oxide. Portions of the spacer oxide layer are retained intact over the field oxide during the etching step used to form the oxide spacers on the sides of the polysilicon gates. The retained spacer oxide portions increase the total oxide thickness in the field area to effectively block the ion implantation used to form the heavily doped portions of the source and drain regions. This enables use, in the initial fabrication steps, of a grown field oxide of reduced thickness and advantageously a correspondingly reduced width so as to reduce the chip space allocated to the field oxide.

Abstract: Parallel testing of integrated circuit devices are facilitated such that it is not necessary that integrated circuit devices to be parallel tested be "ends only" devices. A side pad located along the sides, rather than the ends, of the integrated circuit device is electrically connected by multiplexing circuitry to a corresponding configurable probe pad located along the ends of the device. During parallel testing of the device, the side pad is effectively tested when the configurable probe pad is probed and tested. While the configurable probe pad is tested during parallel testing, the side pad is not directly exercised. Following parallel testing, the side pad is bonded to the device package but the configurable probe pad is not bonded to the device package.

Abstract: Parallel testing of integrated circuit devices are facilitated such that it is not necessary that integrated circuit devices to be parallel tested be "ends only" devices. A side pad located along the sides, rather than the ends, of the integrated circuit device is electrically connected by multiplexing circuitry to a corresponding configurable probe pad located along the ends of the device. During parallel testing of the device, the side pad is effectively tested when the configurable probe pad is probed and tested. While the configurable probe pad is tested during parallel testing, the side pad is not directly exercised. Following parallel testing, the side pad is bonded to the device package but the configurable probe pad is not bonded to the device package.

Abstract: A method is provided for forming an improved landing pad of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A first opening is formed through a first dielectric layer to expose a portion of a diffused region. A first polysilicon landing pad is formed over the first dielectric layer and in the opening. This landing pad will provide for smaller geometries and meet stringent design rules such as that for contact space to gate. A dielectric pocket is formed over the polysilicon landing pad over the active region. A second conductive landing pad is formed over the polysilicon landing pad and the dielectric pocket. A second dielectric layer is formed over the landing pad having a second opening therethrough exposing a portion of the landing pad. A conductive contact, such as aluminum, is formed in the second contact opening. The conductive contact will electrically connect with the diffused region through the landing pad.

Abstract: A mask is used for lightly doped drain and halo implants in an integrated circuit device. The mask exposes only portions of the substrate adjacent to field effect transistor gate electrodes. Since the halo implant is made only near the transistor channels, where it performs a useful function, adequate device reliability and performance is obtained. Since the halo implant is masked from those portions of the active regions for which it is not necessary, active region junction capacitances are lowered. Such lowered capacitances result in an improved transistor switching speed. The mask used to define the lightly doped drain and halo implant region can be easily formed from a straight forward combination of already existing gate and active area geometries.

Abstract: A liquid level sensor unit outputs a voltage value, which corresponds to a measured liquid level, to an anti-slosh circuit that provides a fast timing rate during the initial condition of the circuit and a slow timing rate during the normal operation of the circuit. The anti-slosh circuit further includes a low liquid level warning circuit and a power-on-reset circuit. The system timing rate can be externally controlled by connecting an RC circuit to the improved anti-slosh circuit. A customer defined reference level for low liquid warning is also possible. The entire circuit is included on a single, monolithic integrated circuit. An input pin receives the signal from the fuel tank. An output pin drives a liquid level gauge.

Abstract: A method and circuits for coupling a memory embedded in an integrated circuit to interconnect pads during a memory test mode is disclosed. The integrated circuit contains a processor, an embedded memory and a switching circuit for: (1) temporary coupling the interconnect pads of the integrated circuit, coupled to the processor during normal operation mode of the circuit, to the memory during a memory test mode; (2) and decoupling the external interconnect pads from the memory, after the memory is tested, and coupling them to the processor.

Abstract: A method is provided for reducing the reflectivity of a metal layer prior to photolithography. A thin buffer layer, such as oxide, can be deposited over the metal layer. A short plasma etch is performed in order to roughen, but not completely remove, the thin oxide layer. This roughened layer significantly reduces the reflectivity of the underlying metal layer. As an alternative, the brief plasma etch can be applied directly to the metal layer, which results in a significant roughening of its upper surface. This also reduces the reflectivity of the metal layer.

Abstract: A DVD CD-ROM player integrated with a personal computer is provided. When integrating a DVD CD-ROM with a personal computer, there are various problems that must be overcome. For example, the stream from the DVD CD-ROM utilizes a 27 MHz clock. However, a personal computer typically does not have a 27 MHz clock, but instead has a system clock, that runs at the frequency of the processor. Therefore, in order to play a DVD-based audio-visual work in a personal computer, a clock running at 27 MHz is needed. As such, a software clock running at 27 MHz is provided which facilitates the integration of a DVD CD-ROM into a personal computer. By using a software clock, synchronization of the audio-visual stream is facilitated and both cost and development time are reduced.